Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/1999
06/16/1999CN1219743A Multilayered electronic part with minimum silver diffusion and its manufacturing method
06/16/1999CN1219741A Electrode modification using unzippable polymer paste
06/16/1999CN1219469A Method of manufacturing composite laminate comprising unidirectional reinforcing fibres, for use in printed wire boards
06/16/1999CN1043715C Printer system for printing circuit patterns on base board
06/15/1999US5913109 Fixtures and methods for lead bonding and deformation
06/15/1999US5912984 Method and apparatus for in-line solder paste inspection
06/15/1999US5912654 Electric-circuit board for a display apparatus
06/15/1999US5912510 Bonding structure for an electronic device
06/15/1999US5912507 Solderable pad with integral series termination resistor
06/15/1999US5912505 Semiconductor package and semiconductor device
06/15/1999US5912438 Assembly of electronic components onto substrates
06/15/1999US5912435 Circuit arrangement having a plurality of circuit units and a common multi-wire cable
06/15/1999US5912066 Silicon nitride circuit board and producing method therefor
06/15/1999US5912047 Borosilicate electronic coatings
06/15/1999US5912046 By placing the liquid having solids in suspension in a centrifuge and spinning it about an axis so that liquid is forced against the surface of component
06/15/1999US5912044 Method for forming thin film capacitors
06/15/1999US5911907 Nitric acid, ferric nitrate, stabilizer consisting of a 4-amino-1,2,4-triazole, a 3-amino-5-methylisoxazole, a sulfanilamide, and a sulfamide, such which inhibits exothermic conditions, emission of toxic nox gas, and copper attack.
06/15/1999US5911863 Method of manufacturing plastic foils which are electrically conductive in one direction but insulating in other directions
06/15/1999US5911850 Separation of diced wafers
06/15/1999US5911584 Circuit card connector with isolation base assembly
06/15/1999US5911583 Stacked electrical circuit having an improved interconnect and alignment system
06/15/1999US5911356 Method for attaching lead parts and shield case to printed circuit board, and method for attaching chip parts, lead parts and shield case to printed circuit board
06/15/1999US5911355 Method and device for mechanically removing solder beads on the surface of the printed circuit boards
06/15/1999CA2133148C Waterborne photoresists having binders neutralized with amino acrylates
06/15/1999CA2050091C Electronic circuit and method with thermal management
06/10/1999WO1999029151A1 Ground clip apparatus for circuit boards
06/10/1999WO1999029149A1 Method and machine for producing flexible and semirigid printed-circuit boards
06/10/1999WO1999029148A1 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method
06/10/1999WO1999028981A1 Product having a rechargeable battery which is held in a mechanically stable manner and is easy to remove
06/10/1999WO1999028970A1 Semiconductor device and method for manufacturing the same
06/10/1999WO1999028161A1 Interior trim panel and electrical harness apparatus for an automotive vehicle
06/10/1999WO1999028126A1 Prepreg for multilayer printed wiring boards and process for producing the same
06/10/1999DE19838574A1 Electronic component is encapsulated by a curable resin layer and a thermoplastic resin layer
06/10/1999DE19813193A1 Electronic module separation method e.g. for semiconductor module
06/10/1999DE19753149A1 Copper-ceramic substrate production by direct copper bond connection of metallization through a via
06/10/1999DE19750224A1 Plug for releasable electrical connection between flat strip cable and circuit board
06/10/1999DE19749147A1 Printed circuit board contact system
06/10/1999CA2312481A1 Interior trim panel and electrical harness apparatus for an automotive vehicle
06/10/1999CA2311800A1 Process for surface-mounting a microwave package on a printed circuit and package and printed circuit for the implementation of the process
06/09/1999EP0921716A1 Reinforced solder joints for printed circuit boards
06/09/1999EP0921715A1 PCB for mounting RF band pass filter and method of manufacture
06/09/1999EP0921642A2 Multiband high-frequency switching module
06/09/1999EP0921596A1 Terminal blades mounted on flexible substrates
06/09/1999EP0921594A2 Connection device
06/09/1999EP0921567A2 Multi-layer circuit board
06/09/1999EP0921566A1 Microelectromechanical component, such as a microsensor or a microactuator transferable onto a hybrid circuit substrate
06/09/1999EP0921538A2 Electric component, in particular coil, preferably for SMD assembly technique
06/09/1999EP0920947A2 Solder skimmer system
06/09/1999EP0920792A1 Method and apparatus for orienting miniature components
06/09/1999EP0920789A1 Method for manufacturing a device for burning off thermal energy produced by electronic components embedded in a printed circuit card, and resulting device
06/09/1999EP0920711A1 Interface structures for electronic devices
06/09/1999EP0920676A1 Method for manufacturing an electric and mechanical connexion in a chip card module placed in a card holder recess
06/09/1999EP0840676A4 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
06/09/1999EP0800754A4 Compliant interface for a semiconductor chip
06/09/1999EP0746640B1 Method of electrolytically depositing metals from electrolytes containing organic additives
06/09/1999CN2323550Y Holding basket for printed circuit board cleaner
06/09/1999CN1219292A Electrical and thermal anisotropically conducting structure
06/09/1999CN1219151A Screen printing method and apparatus thereof
06/09/1999CN1219100A Electronic element mounting body and its producing method and electronic apparatus using it
06/09/1999CN1219097A Low thermal expansion circuit board and multi-layer wire circuit board
06/09/1999CN1219096A Holding device for holding printed circuit panel
06/09/1999CN1219007A Connection device for connection terminal of power circuit
06/09/1999CN1218989A Metallizing system
06/08/1999US5910885 Electronic stack module
06/08/1999US5910685 Semiconductor memory module having double-sided stacked memory chip layout
06/08/1999US5910651 Method and apparatus for image nonlinearity compensation in scanning systems
06/08/1999US5910644 Universal surface finish for DCA, SMT and pad on pad interconnections
06/08/1999US5910641 For interconnecting electronic modules to a wiring carrying substrate
06/08/1999US5910396 Providing damping layer on hard substrate, providing top coating on damping layer, masking top coating, exposing to stream of kinetic particles to pattern top coating
06/08/1999US5910394 Radiation sensitive cured coating which exhibits substantial flexibility and reduces line growth
06/08/1999US5910390 Method for forming pattern
06/08/1999US5910354 Metallurgical interconnect composite
06/08/1999US5910341 Method of controlling the spread of an adhesive on a circuitized organic substrate
06/08/1999US5910334 Printing a thick cover layer of dielectric on the first circuit layer, over-lapping the porous dried but not fired feature definition print (fdp) which absorbs solvent, inhibiting spreading; good definition and thickness
06/08/1999US5910282 Method for making a multilevel polyimide stencil
06/08/1999US5910255 Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation
06/08/1999US5910025 Radiotelephone
06/08/1999US5909915 Resin-molded electronic circuit device
06/08/1999US5909839 Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins
06/08/1999US5909741 Chemical bath apparatus
06/08/1999US5909706 Support table for supporting a module board and screen printing method using the same
06/04/1999CA2254676A1 Reinforced solder joints for printed circuit boards
06/03/1999WO1999027760A1 Method and apparatus for manufacturing double sided or multi-layered printed circuit boards
06/03/1999WO1999027759A1 Structured printed circuit boards, foil printed circuit boards and method for the production thereof
06/03/1999WO1999027159A1 Metal composition containing metal acetilide, blank having metallic coating formed therewith, and method for forming the metallic coating
06/03/1999WO1999027002A1 Processes for the production of prepregs and laminated sheets
06/03/1999WO1999026754A1 Method for fixing miniaturised components onto a base plate by soldering
06/03/1999WO1999026753A1 Method and device for thermally bonding connecting surfaces of two substrates
06/03/1999WO1999026752A1 Method and device for assembling two structures with a weld bead
06/03/1999WO1999026731A1 Improved miniature surface mount capacitor and method of making same
06/03/1999WO1998032314A3 Solder joints for surface mount chips
06/02/1999EP0920090A2 Printed circuit connector
06/02/1999EP0920058A2 Circuit component built-in module and method for producing the same
06/02/1999EP0920056A2 IC card, method and apparatus for producing the same
06/02/1999EP0920055A2 Cooling device for a heat generating componant on a printed board
06/02/1999EP0920033A1 Plated non-conductive products and plating method for the same
06/02/1999EP0919870A1 Photosensitive resin composition and photosensitive element using the resin composition
06/02/1999EP0919820A2 Circuit board testing apparatus and method
06/02/1999EP0919640A1 A method of manufacturing three dimensional parts using an inert gas
06/02/1999EP0919375A1 Method for controlling screen printing machine