Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1998
10/22/1998WO1998047329A1 Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board
10/22/1998WO1998047328A1 Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
10/22/1998WO1998047327A1 Substrate with a circuit-board conductor network and method for producing said substrate
10/22/1998WO1998047326A1 Wiring board having vias
10/22/1998WO1998047320A2 Multifunctional printed circuit board with an opto-electronically active component
10/22/1998WO1998047179A1 Printed wiring board and method for manufacturing the same
10/22/1998WO1998047175A1 Process for manufacturing semiconductor device and semiconductor component
10/22/1998WO1998046982A1 Device for inspecting test objects and the use thereof
10/22/1998WO1998046810A1 Bipolar electrochemical connection of materials
10/22/1998WO1998046686A1 Coatings based on hyaluronic acid and the derivatives thereof for the protection of electronic parts from external agents
10/22/1998WO1998046130A1 Method and pdt probe for minimizing ct and mri image artifacts
10/22/1998WO1998020531A3 Method for forming a through-via in a laminated substrate
10/22/1998DE19808589A1 Arrangement for rounding corners on boards, especially circuit boards
10/22/1998DE19738550A1 Multiple layer conductor structure e.g. for electronic circuit
10/22/1998DE19730972C1 Housing part for electronic valve control device
10/22/1998DE19730417C1 Fixing method for use with circuit-board screening
10/22/1998DE19716709A1 Oxidation protection of molten solder
10/22/1998DE19716651A1 Circuit board labelling device
10/22/1998DE19716539A1 Electrical coil for a surface mounted device
10/22/1998DE19716044A1 Selective solder electrodeposition on circuit board pads
10/22/1998DE19716012A1 Surface-mounted electronic component
10/22/1998DE19715898A1 Substrat mit Leiterbahnvernetzung und Verfahren zu dessen Herstellung Substrate with conductor track cross-linking and methods for its preparation
10/22/1998DE19715658A1 Multifunktions-Leiterplatte mit opto-elektronisch aktivem Bauelement Multifunction board with opto-electronically active component
10/22/1998CA2296113A1 Fabrication of high density multilayer interconnect printed circuit boards
10/22/1998CA2296112A1 Positive working photodefinable resin coated metal for mass production of microvias in multilayer printed wiring boards
10/22/1998CA2286578A1 Case for circuit boards
10/21/1998EP0873047A2 Production of insulating varnishes and multilayer printed circuit boards using these varnishes
10/21/1998EP0872920A2 Continuous electronic stamping with offset carrier
10/21/1998EP0872919A2 Circuit board electrical connector
10/21/1998EP0872912A2 Circular-polarization antenna
10/21/1998EP0872882A2 Method of fabricating a curved metal-ceramic-substrate
10/21/1998EP0872301A1 Ultrasonic welding of copper foil
10/21/1998EP0872099A1 A method and device to fasten a loudspeaker to a circuit board
10/21/1998EP0871568A1 Conductive film composite
10/21/1998EP0871565A2 Process for preparing an insulated multilayer structure
10/21/1998EP0781501B1 Monolithic lcp polymer microelectronic wiring modules
10/21/1998EP0767964B1 Anisotropically conducting adhesive and process for its production
10/21/1998EP0758351B1 Energy polymerizable compositions, homopolymers and copolymers of oxazolines
10/21/1998EP0698233B1 Process and device for coating printed circuit boards
10/21/1998CN1196868A Method and circuit board panel for preventing assembly-line delamination and sagging for circuit board manufacturing
10/21/1998CN1196794A Machine for opposite control of printed circuits
10/20/1998US5826126 Flexible printed circuit board housing structure for a camera
10/20/1998US5825635 Warp prevention and cable holding structure for printed circuit board
10/20/1998US5825633 Multi-board electronic assembly including spacer for multiple electrical interconnections
10/20/1998US5825631 Method for connecting two substrates in a thick film hybrid circuit
10/20/1998US5825630 Electronic circuit board including a second circuit board attached there to to provide an area of increased circuit density
10/20/1998US5825629 Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment
10/20/1998US5825303 Sealed housing and method of sealing for apparatus in meter pit enclosures
10/20/1998US5825093 Attachment system and method therefor
10/20/1998US5825086 Hermetic heat sealing
10/20/1998US5825057 Process for fabricating layered superlattice materials and making electronic devices including same
10/20/1998US5825041 System for optical curing
10/20/1998US5824964 Circuit board for a semiconductor device and method of making the same
10/20/1998US5824959 Flexible electrical cable and associated apparatus
10/20/1998US5824950 To be secured to a printed circuit board
10/20/1998US5824634 Useful in the electronic industry
10/20/1998US5824598 Correcting defects
10/20/1998US5824454 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
10/20/1998US5824371 Corrosion resistant metal article coated with emeraldine base polyaniline
10/20/1998US5824361 Magnetic head fabrication process
10/20/1998US5824157 Fluid jet impregnation
10/20/1998US5824155 Method and apparatus for dispensing viscous material
10/20/1998US5823830 Tailess compliant contact
10/20/1998US5823820 For mounting a microphone
10/20/1998US5823801 Electrical connector having thin contacts with surface mount edges
10/20/1998US5823800 Printed circuit board socket
10/20/1998US5823793 Holder for an electrical or electronic component
10/20/1998US5823736 Substrate processing device and method for substrate from the substrate processing device
10/20/1998US5823210 Cleaning method and cleaning apparatus
10/20/1998US5822856 Manufacturing circuit board assemblies having filled vias
10/20/1998US5822851 Method of producing a ceramic package main body
10/20/1998US5822850 Circuit devices and fabrication Method of the same
10/15/1998WO1998045921A1 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
10/15/1998WO1998045856A1 Meniscus-shaped terminations for leadless electronic components
10/15/1998WO1998045804A1 Chip card with a riveted joint
10/15/1998WO1998045755A1 Waterborne photoresists made from urethane acrylates
10/15/1998WO1998045716A1 Method for making cards with multiple contact tips for testing semiconductor chips
10/15/1998WO1998045504A1 Article, method, and apparatus for electrochemical fabrication
10/15/1998WO1998030967A3 Flexible touchpad circuit with mounted circuit board
10/15/1998WO1998021272A3 Manufacture of composites of inorganic powder and polymer materials
10/15/1998DE19739481A1 Apparatus for placing several solder balls onto a substrate
10/15/1998DE19715368A1 Manufacture of multi layer circuit boards
10/15/1998DE19715067A1 Screen printing machine for both sides of flat card, esp. printed circuits electronic card
10/15/1998CA2572786A1 Method for electrochemical fabrication including etching to remove flash
10/15/1998CA2572503A1 Method for electrochemical fabrication including enhanced data manipulation
10/15/1998CA2572499A1 Method for electrochemical fabrication including use of multiple structural and/or sacrificial materials
10/14/1998EP0871352A1 Integrated circuit device cooling structure
10/14/1998EP0871220A2 Pin usage of a semiconductor package
10/14/1998EP0870642A2 Support for mechanically holding and electrically connecting electronic components, particularly light-emitting diodes, and process for electrically conductive connection of the components on a support
10/14/1998EP0870419A2 End-wall frame for led alphanumeric display
10/14/1998EP0870418A1 Electronic assembly with semi-crystalline copolymer adhesive
10/14/1998EP0870362A1 Method for producing an electrical component and resulting component
10/14/1998EP0870349A1 Electrical connector assembly with interleaved multilayer structure and fabrication method
10/14/1998EP0870329A1 Epoxy resin based solder paste
10/14/1998EP0870325A1 Microelectronic mounting with multiple lead deformation
10/14/1998EP0870306A1 Method of securing an electric contact to a ceramic layer as well as a resistance element thus manufactured
10/14/1998EP0792388B1 Method for directly depositing metal containing patterned films
10/14/1998EP0712534B1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits
10/14/1998EP0708707B1 Method of laminate manufacture
10/14/1998EP0698232B1 Process and device for coating printed circuit boards
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