| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/22/1999 | WO1999019982A1 Surface mount lc filter with polymer layers |
| 04/22/1999 | WO1999019900A2 Method of forming an electronic device |
| 04/22/1999 | WO1999019543A1 Method for producing very small metal ball |
| 04/22/1999 | WO1999019442A1 Stripping composition for urethane conformal coatings |
| 04/22/1999 | WO1999019139A1 Bumped substrate assembly |
| 04/22/1999 | DE19830158A1 Zwischenträgersubstrat mit hoher Verdrahtungsdichte für elektronische Bauelemente Between the carrier substrate with high wiring density for electronic components |
| 04/22/1999 | DE19744643A1 Semiconductor component adhesive-pressing method |
| 04/22/1999 | DE19743289A1 High density multilevel interconnect substrate, especially for multi-chip modules, has insulation levels of different materials |
| 04/22/1999 | DE19740701A1 Vertical surface mount packaged semiconductor component e.g. for novel high power memory chip` |
| 04/22/1999 | CA2306384A1 Method of forming an electronic device |
| 04/21/1999 | EP0910236A2 Electronic apparatus |
| 04/21/1999 | EP0910163A1 Oscillator module |
| 04/21/1999 | EP0909838A1 Electroless copper plating solution and method for electroless copper plating |
| 04/21/1999 | EP0909608A2 Fixture for aligning and clamping a workpiece, in particular a pack of printed circuit boards, on a machine tool |
| 04/21/1999 | EP0909407A1 Photopolymerizable thermosetting resin composition |
| 04/21/1999 | EP0807325B1 Press-fit connecting pin and electronic device using the same |
| 04/21/1999 | EP0806127A4 An environmentally desirable method of manufacturing printed circuits, printed circuits made thereby and associated apparatus |
| 04/21/1999 | EP0751866B1 Method of making a ud crossply pwb laminate having one or more inner layers of metal |
| 04/21/1999 | CN1214849A Feeder system for supplying electrical components to pick up locations |
| 04/21/1999 | CN1214661A Electrical component feeding and delivery system |
| 04/21/1999 | CN1214610A Composition and method for stripping solder and tin from printed circuit boards |
| 04/21/1999 | CN1214557A High density connector system |
| 04/21/1999 | CN1214548A 多芯片模块 A multi-chip module |
| 04/21/1999 | CN1214547A 多芯片模块 A multi-chip module |
| 04/21/1999 | CN1214544A Discrete semiconductor device and method for producing the same |
| 04/21/1999 | CN1214497A Circuit substrate, circuit-formed suspension substrate, and prodution methods therefor |
| 04/20/1999 | US5896276 Electronic assembly package including connecting member between first and second substrates |
| 04/20/1999 | US5896271 Integrated circuit with a chip on dot and a heat sink |
| 04/20/1999 | US5896259 Preheating device for electronic circuits |
| 04/20/1999 | US5896127 Coordinate data input device and method of fabricating the same |
| 04/20/1999 | US5896080 Thermal fuse for fixing on a circuit board |
| 04/20/1999 | US5896077 Terminal for surface mountable electronic device |
| 04/20/1999 | US5896036 Carrier for testing semiconductor dice |
| 04/20/1999 | US5895969 Thin type semiconductor device, module structure using the device and method of mounting the device on board |
| 04/20/1999 | US5895800 A heat resistance, solvent resistance polynorbornene graft copolymer and a curing agent to form a dielectric protective coatings for semiconductor, printed circuits, electronics |
| 04/20/1999 | US5895581 Laser imaging of printed circuit patterns without using phototools |
| 04/20/1999 | US5895554 Alignment method and apparatus for mounting electronic components |
| 04/20/1999 | US5895302 Method for making a heat-resistant reflector for LED display suitable for surface mounting |
| 04/20/1999 | US5895281 High density board to board connector |
| 04/20/1999 | US5895277 Electrical connection box with general and special circuits |
| 04/20/1999 | US5895234 Semiconductor device and method for producing the same |
| 04/20/1999 | US5895232 Three-dimensional warp-resistant integrated circuit module method and apparatus |
| 04/20/1999 | US5895231 External terminal fabrication method for semiconductor device package |
| 04/20/1999 | US5894984 Structure of electronic parts and method of soldering electronic parts to substrate |
| 04/20/1999 | US5894793 Screen printing machine with control means for separating a screen from a printing material |
| 04/20/1999 | US5894648 High speed depaneling apparatus and method |
| 04/20/1999 | CA2120326C Structure of an electrotechnical device |
| 04/20/1999 | CA2077463C System and method for precision cleaning by jet spray |
| 04/15/1999 | WO1999018766A1 Method for mounting semiconductor element to circuit board, and semiconductor device |
| 04/15/1999 | WO1999018762A1 Method for connecting surface mount components to a substrate |
| 04/15/1999 | WO1999018633A1 Wiring board constructions and methods of making same |
| 04/15/1999 | WO1999018541A1 Method for making smart cards capable of operating with and without contact |
| 04/15/1999 | WO1999018266A1 Programmed pulse electroplating process |
| 04/15/1999 | WO1999018254A2 Solution and method for currentless deposition of gold coating |
| 04/15/1999 | WO1999018253A2 Method and solution for producing gold coating |
| 04/15/1999 | WO1999008495A3 Method of manufacturing surface-mountable sil hybrid circuit |
| 04/15/1999 | WO1999008297A3 Method of manufacturing a plurality of electronic components |
| 04/15/1999 | WO1999005701A3 Composite electrical contact structure and method for manufacturing the same |
| 04/15/1999 | WO1999001795A3 Pattern-forming methods and radiation sensitive materials |
| 04/15/1999 | DE19846851A1 Photosensitive composition and film for sand blasting for making printed circuit or insulation of plasma display panel |
| 04/15/1999 | DE19802127C1 Method for laser machining |
| 04/15/1999 | DE19745601A1 Solution for current-less gold plating |
| 04/15/1999 | DE19742327A1 Method for coating metal components and other rigid articles |
| 04/15/1999 | CA2306407A1 Method for making smart cards capable of operating with and without contact |
| 04/14/1999 | EP0909120A2 Housing for electronic components |
| 04/14/1999 | EP0909119A2 Method for adhering a metallization to a substrate |
| 04/14/1999 | EP0909118A2 Conductive elastomer for grafting to an elastic substrate |
| 04/14/1999 | EP0909117A2 Method of making thick film circuits |
| 04/14/1999 | EP0908976A2 High density connector system |
| 04/14/1999 | EP0908975A1 Male connector for flat flexible circuit |
| 04/14/1999 | EP0908968A2 Connector for flat flexible circuitry |
| 04/14/1999 | EP0908943A2 Laser-solderable electronic component |
| 04/14/1999 | EP0908312A1 Screen printing method and screen printing press |
| 04/14/1999 | EP0908311A1 Screen printing apparatus and screen printing method |
| 04/14/1999 | EP0908077A1 Multi-layer stamped electrically conductive circuit and method for making same |
| 04/14/1999 | EP0907998A1 Power pad/power delivery system |
| 04/14/1999 | EP0907985A1 Latticework with plurality of overlying lines |
| 04/14/1999 | EP0907965A1 Component housing for surface mounting a semiconductor component |
| 04/14/1999 | EP0907963A1 Solder bump apparatus, electronic component and method for forming a solder bump |
| 04/14/1999 | EP0907893A1 A method of testing and fitting electronic surface-mounted components |
| 04/14/1999 | EP0907763A1 Process for the reduction of copper oxide |
| 04/14/1999 | EP0907453A1 Process for soldering electronic components to a printed circuit board |
| 04/14/1999 | EP0851944B1 Method for producing electrodeposited copper foil and copper foil obtained by same |
| 04/14/1999 | EP0799327B1 Process for the corrosion protection of copper or copper alloys |
| 04/14/1999 | EP0795043B1 Silver plating |
| 04/14/1999 | CN2314553Y Head of PCB welder |
| 04/14/1999 | CN2314552Y Small size PCB cutter |
| 04/14/1999 | CN1214090A Screen-like plated article comprising mesh-like fabric using sheath-core composite filaments and cylinder for rotary screen |
| 04/14/1999 | CN1213997A Method employing UV laser pulses of varied energy density to form blind vias in multilayered targets |
| 04/14/1999 | CN1213947A Conductive elastomer for grafting to elastic substrate |
| 04/14/1999 | CN1213946A Red infrared radiation electrothermal film and its prodn. method |
| 04/14/1999 | CN1213851A Copper stud structure with refractory metal liner |
| 04/14/1999 | CN1213837A Method of sealing electronic parts with resin |
| 04/14/1999 | CN1213714A Electroplating appts. |
| 04/14/1999 | CN1213713A Improved zinc-chromium stabilizer containing hydrogen inhibiting additive |
| 04/14/1999 | CN1043002C Appts. for detecting solder wave surface in wave soldering appts. |
| 04/14/1999 | CN1042983C Compsns. of cupric alloy |
| 04/14/1999 | CA2249827A1 Magnetic component assembly |
| 04/13/1999 | US5894410 Perimeter matrix ball grid array circuit package with a populated center |
| 04/13/1999 | US5894252 Laminated ceramic electronic component with a quadrangular inner conductor and a method for manufacturing the same |