Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1998
11/04/1998CN1198009A Semiconductor device package having end-fach halved through-holes and inside-area through-holes
11/04/1998CN1197996A Solder alloy and their use
11/03/1998US5831835 Press grid for electrically connecting circuit components
11/03/1998US5831833 Bear chip mounting printed circuit board and a method of manufacturing thereof by photoetching
11/03/1998US5831832 Molded plastic ball grid array package
11/03/1998US5831831 Bonding material and phase change material system for heat burst dissipation
11/03/1998US5831828 Flexible circuit board and common heat spreader assembly
11/03/1998US5831826 Heat transfer apparatus suitable for use in a circuit board assembly
11/03/1998US5831788 Circuit connector
11/03/1998US5831445 Wafer scale burn-in apparatus and process
11/03/1998US5831336 Ternary solder for the enhancement of C-4 fatigue life
11/03/1998US5831332 Semiconductor package for surface mounting
11/03/1998US5831247 Apparatus and method for producing an electronic component provided with bumps
11/03/1998US5831218 Method and circuit board panel for circuit board manufacturing that prevents assembly-line delamination and sagging
11/03/1998US5831214 Electrical circuit
11/03/1998US5830949 Adhesive resin composition and adhesive sheet
11/03/1998US5830563 Fluorene-skeleton epoxy acrylate
11/03/1998US5830533 High density lines without exposing the photoresist to electroless bath
11/03/1998US5830389 Electrically conductive compositions and methods for the preparation and use thereof
11/03/1998US5830376 Topographical selective patterns
11/03/1998US5830374 Method for producing multi-layer circuit board and resulting article of manufacture
11/03/1998US5830307 Production method for substrate having projecting portions
11/03/1998US5830297 Method and apparatus for application of adhesive
11/03/1998US5829694 Apparatus and systems that separate and isolate precious and semi-precious metals from electronic circuit boards
11/03/1998US5829689 Solder spreading apparatus
11/03/1998US5829668 Method for forming solder bumps on bond pads
11/03/1998US5829667 Method for strengthening a solder joint when attaching integrated circuits to printed circuit boards
11/03/1998US5829576 Device for carrying electronic components
11/03/1998US5829128 Method of mounting resilient contact structures to semiconductor devices
11/03/1998US5829127 Latticework with plurality of overlying lines
11/03/1998US5829126 Method of manufacturing probe card
11/03/1998US5829125 Wireless bonding method
11/03/1998US5829124 Method for forming metallized patterns on the top surface of a printed circuit board
11/03/1998US5829121 Antenna making method
11/03/1998CA2135508C Method for forming solder balls on a semiconductor substrate
10/1998
10/29/1998WO1998048605A1 Apparatus for the coating of flat-form substrates, especially of printed circuit boards
10/29/1998WO1998048602A1 Ball grid array package assembly including stand-offs
10/29/1998WO1998048601A1 Process and apparatus for the treatment of flat-form material, especially of printed circuit boards
10/29/1998WO1998048458A1 Ball grid array package employing solid core solder balls
10/29/1998WO1998048455A1 Interelectrode connecting structure, interelectrode connecting method, semiconductor device, semiconductor mounting method, liquid crystal device, and electronic equipment
10/29/1998WO1998048454A1 Method of forming redundant signal traces and corresponding electronic components
10/29/1998WO1998048378A2 Card inlay for chip cards
10/29/1998WO1998048084A1 Method of electrophoretic deposition of laminated green bodies
10/29/1998WO1998048069A1 Lead-free solder
10/29/1998DE19818452A1 Resin coated substrate socket
10/29/1998DE19805168A1 Printing screen or mask for universal application
10/29/1998DE19733123A1 Method of generating solder paste print with fine structures on substrate
10/29/1998DE19731537C1 Plant assembly laminates for manufacture of e.g. single or double sided printed circuit boards
10/29/1998DE19722713C1 Use of carbon@-containing conductive liquid rubber
10/29/1998DE19717698A1 Verfahren und Vorrichtung zur Reinigung von Aktivierung von elektrischen Leiterbahnen und Platinenoberflächen Method and apparatus for the purification of activation of electric conductors and platinum surfaces
10/29/1998DE19717550A1 Flat bus=bar packet for transistorised rectifier apparatus
10/29/1998DE19717512A1 Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen Apparatus for electroplating of printed circuit boards under constant conditions in continuous flow systems
10/29/1998DE19717511A1 Method for specific wet chemical treatment of flat products in continuous installations
10/29/1998DE19716946A1 Heat-producing component to circuit board contacting method
10/29/1998CA2286810A1 Lead-free solder
10/29/1998CA2286017A1 Apparatus for the coating of flat-form substrates, especially of printed circuit boards
10/29/1998CA2285551A1 Process and apparatus for the treatment of flat-form material, especially of printed circuit boards
10/28/1998EP0874454A1 Piezoelectric resonator and electronic component device using the same
10/28/1998EP0874400A1 Semiconductor device
10/28/1998EP0873215A1 Surface mount device removal tool
10/28/1998EP0838133B1 Device for mounting electrical components on printed-circuit boards
10/28/1998EP0769214B1 Process for producing an electrically conductive connection
10/28/1998EP0741804B1 Process and device for the electrolytic metal coating or etching of articles
10/28/1998EP0510065B1 Catalytic, water-soluble polymeric films for metal coatings
10/28/1998CN2295763Y Conveying unit for outlet of tinplating furnace
10/28/1998CN1197514A Microelectronic contact structure and method of making same
10/28/1998CN1197366A Return-flow soldering method and return-flow soldering appts. using the method thereof
10/28/1998CN1197365A Collection substrate and making method of electronic products of using the same
10/28/1998CN1197309A Circular-polarization antenna
10/28/1998CN1197306A Laminated electronic spares
10/28/1998CN1197290A 半导体器件 Semiconductor devices
10/28/1998CN1197125A Activating catalytic solution for chemical sedimentation and its method of chemical sedimentation
10/28/1998CN1197008A Process for joining flexible circuit to polymeric container and for forming barrier layer over sections of flexible circuit and other elements using encapsulant material
10/27/1998US5828555 Multilayer printed circuit board and high-frequency circuit device using the same
10/27/1998US5828543 Integrated control and panel assembly with improved terminations
10/27/1998US5828501 Apparatus and method for positioning a lens to expand an optical beam of an imaging system
10/27/1998US5828133 Support for an electrochemical deposit
10/27/1998US5828128 Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device
10/27/1998US5828125 Ultra-high density warp-resistant memory module
10/27/1998US5828093 Ceramic capacitor and semiconductor device in which the ceramic capacitor is mounted
10/27/1998US5828031 Head transducer to suspension lead termination by solder ball place/reflow
10/27/1998US5828010 Connection of electrically conducting layers with ceramic prominences
10/27/1998US5827951 System to analyze solderability of printed wiring boards
10/27/1998US5827812 Mixtures of perfluorobutyl(or isobutyl) methyl ether with chlorinated or brominated alkanes or hydrochlorofluorocarbons, as solvents, cleaning compounds
10/27/1998US5827605 Ceramic multilayer substrate and method of producing the same
10/27/1998US5827604 Multilayer printed circuit board and method of producing the same
10/27/1998US5827410 Device for the electrolytic treatment of plate-shaped workpieces
10/27/1998US5827386 Method for forming a multi-layered circuitized substrate member
10/27/1998US5827186 Method and PDT probe for minimizing CT and MRI image artifacts
10/27/1998US5827084 Electrical connector assembly with interleaved multilayer structure and fabrication method
10/27/1998US5826516 For screen printing of solder paste
10/27/1998US5826330 Blind hole formed in insulating resin layer by use of short pulse carbon dioxide laser
10/27/1998US5826329 Method of making printed circuit board using thermal transfer techniques
10/27/1998CA2149949C Optical processing method and apparatus for carrying out the same
10/27/1998CA2081222C Method for production of microcapsule type conductive filler
10/22/1998WO1998047338A1 Case for circuit boards
10/22/1998WO1998047333A1 Fabrication of high density multilayer interconnect printed circuit boards
10/22/1998WO1998047332A1 Positive working photodefinable resin coated metal for mass production of microvias in multilayer printed wiring boards
10/22/1998WO1998047331A1 Wiring board, wiring board fabrication method, and semiconductor package
10/22/1998WO1998047330A1 Solder ball loading mechanism
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