| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/19/1999 | EP0917197A2 High-frequency integrated circuit and method for manufacturing the same |
| 05/19/1999 | EP0917196A2 Semiconductor element module and semiconductor device |
| 05/19/1999 | EP0917191A2 Electronic component unit, electronic assembly using the unit, and method for manufacturing the electronic component unit |
| 05/19/1999 | EP0917190A2 Circuit support board |
| 05/19/1999 | EP0917163A2 Magnetic component assembly |
| 05/19/1999 | EP0916488A1 Automatic screen printing system |
| 05/19/1999 | EP0916480A1 Manufacture of laminated film and printed wiring board |
| 05/19/1999 | EP0916447A2 Method and device for aligning a workpiece on a machine tool table |
| 05/19/1999 | EP0916438A1 Nickel powder and process for preparing the same |
| 05/19/1999 | EP0916238A1 Surface mounting process of components for oscillators on printed circuits using conductive epoxy adhesive |
| 05/19/1999 | EP0916237A1 Process for producing connecting conductors |
| 05/19/1999 | EP0916144A1 Method for making a transponder coil and transponder produced by said method |
| 05/19/1999 | EP0815499B1 Multi-rate positioner system having an improved profiling filter |
| 05/19/1999 | EP0651916B1 Rf waveguide signal transition apparatus |
| 05/19/1999 | CN1216891A Method for installing electronic device and circuit board |
| 05/19/1999 | CN1216890A Method and apparatus for mfg. flexible element substrate |
| 05/19/1999 | CN1216873A Laminated spring structure and flexible circuitry connector incorporating same |
| 05/19/1999 | CN1216726A Trough for soldering by jetting molten solder |
| 05/19/1999 | CN1043451C Composite screen plant made of metallic foil and silk net |
| 05/19/1999 | CN1043414C Process for metal surface treatment for mfg. electronic device |
| 05/18/1999 | US5905640 Secure access circuit |
| 05/18/1999 | US5905638 Method and apparatus for packaging a microelectronic device with an elastomer gel |
| 05/18/1999 | US5905558 Circuit plate, process for producing same and liquid crystal device including same |
| 05/18/1999 | US5905382 Universal wafer carrier for wafer level die burn-in |
| 05/18/1999 | US5905352 Magneto-repulsion punching with dynamic damping |
| 05/18/1999 | US5905018 Method of preparing a substrate surface for conformal plating |
| 05/18/1999 | US5904975 Printed circuit board |
| 05/18/1999 | US5904954 Forming flocked layer of heat-resistant fibers on flexible film; coating, precipitating, drying |
| 05/18/1999 | US5904863 Process for etching trace side walls |
| 05/18/1999 | US5904859 Applying etchant solution to metal layer, said etchant solution having a ph of at least 11, and comprising an alkali ferricyanide to etch the copper and chromium, the etchant solution also containing copper complexing agent |
| 05/18/1999 | US5904797 Adhesion improvement with methylacrylate-chromium complexes and poly(vinyl alcohol) |
| 05/18/1999 | US5904782 Epoxy based, VOC-free soldering flux |
| 05/18/1999 | US5904773 Fluid delivery apparatus |
| 05/18/1999 | US5904582 Structure for altering bus bar circuits |
| 05/18/1999 | US5904499 Package for power semiconductor chips |
| 05/18/1999 | US5904498 Connection component with releasable leads |
| 05/18/1999 | US5904495 Interconnection technique for hybrid integrated devices |
| 05/18/1999 | CA2127948C Surface mount solder assembly of leadless integrated circuit packages to substrates |
| 05/14/1999 | WO1999023864A1 Method of soldering components to at least one carrier |
| 05/14/1999 | WO1999023724A1 Edge interface electrical connectors |
| 05/14/1999 | WO1999023722A1 Compression connector |
| 05/14/1999 | WO1999023687A1 Articles or compositions comprising nanoscale particles; methods of utilizing or producing such particles |
| 05/14/1999 | WO1999022897A1 Drill or milling head |
| 05/14/1999 | WO1999022571A2 Three-dimensional flexible electronic module |
| 05/14/1999 | WO1998054733A3 Low profile pin-less planar magnetic devices and method of making same |
| 05/12/1999 | EP0915643A1 Holding device for printed circuit boards |
| 05/12/1999 | EP0915641A1 Surface mount assembly for electronic components |
| 05/12/1999 | EP0915512A2 Ceramic substrate having a metal circuit |
| 05/12/1999 | EP0915504A1 Semiconductor package and method of forming the same |
| 05/12/1999 | EP0915488A2 Multilayer capacitor |
| 05/12/1999 | EP0915431A1 IC card and manufacturing method of such a card |
| 05/12/1999 | EP0915383A2 Photosensitive resin composition |
| 05/12/1999 | EP0915381A1 Process of forming a pattern on a substrate |
| 05/12/1999 | EP0915189A2 An electroplating apparatus |
| 05/12/1999 | EP0915182A1 Plating method |
| 05/12/1999 | EP0914895A1 Method and apparatus for reflow soldering metallic surfaces |
| 05/12/1999 | EP0914757A1 Z-axis interconnect method and circuit |
| 05/12/1999 | EP0914756A1 Method and device for the manufacturing of solder stop preferably on a printed board |
| 05/12/1999 | EP0914691A1 Low friction, ductile, multilayer electrodeposits |
| 05/12/1999 | EP0914688A1 Printed circuit board layering configuration for very high bandwidth interconnect |
| 05/12/1999 | EP0914230A1 A flux formulation |
| 05/12/1999 | EP0840660B1 Fluxless contacting of components |
| 05/12/1999 | EP0600051B1 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction |
| 05/12/1999 | DE19758057C1 Antenna fabrication method for IC card |
| 05/12/1999 | DE19749225A1 Separating process for electronic circuit boards |
| 05/12/1999 | DE19749217A1 Separating process for electronic circuit boards |
| 05/12/1999 | DE19748735A1 Bohr- bzw. Fräskopf Drilling or milling head |
| 05/12/1999 | DE19747388C1 Contactless chip card manufacturing method |
| 05/12/1999 | CN1216671A Printed circuit board fabrication apparatus |
| 05/11/1999 | US5903744 Logic emulator using a disposable wire-wrap interconnect board with an FPGA emulation board |
| 05/11/1999 | US5903440 Method of forming assemblies of circuit boards in different planes |
| 05/11/1999 | US5903431 Multiple single layer monolithic passive integrated circuits and method |
| 05/11/1999 | US5903353 Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture |
| 05/11/1999 | US5903056 Electronic package |
| 05/11/1999 | US5903052 Structure for semiconductor package for improving the efficiency of spreading heat |
| 05/11/1999 | US5902959 Surface mount semiconductor package |
| 05/11/1999 | US5902758 Borosilicate glass, alpha- and gamma-alumina, and mullite crystals crystallized out in a dispersed form from the glass and gamma-alumina; low dielectric constant, high strength for multilayer wiring |
| 05/11/1999 | US5902712 Substrate having circuits disposed thereon, coated with ablatively photodecomposable polymer comprising acrylic polymer with bound photoabsorber |
| 05/11/1999 | US5902495 Method and apparatus for establishing a solder bond to a solder ball grid array |
| 05/11/1999 | US5902472 Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath |
| 05/11/1999 | US5902438 Process for the formation of anisotropic conducting material |
| 05/11/1999 | US5902437 Method of making resonant tag labels |
| 05/11/1999 | US5902139 Terminal block for circuit board |
| 05/11/1999 | US5902138 System for connecting wiring harnesses |
| 05/11/1999 | US5901997 Conveyor device for vertically guiding plate-like objects for electroylic surface-treatment |
| 05/11/1999 | US5901442 Method of manufacturing loosening prevention kinks on leads of an electric member for insertion into a mounting board |
| 05/11/1999 | US5901405 Device for cleaning screen plate used in screen printing |
| 05/11/1999 | CA2133149C Waterborne photoresists having polysiloxanes |
| 05/11/1999 | CA2133147C Waterborne photoresists having non-ionic fluorocarbon surfactants |
| 05/11/1999 | CA2131044C Waterborne photoresists having associate thickeners |
| 05/10/1999 | CA2253889A1 Method and apparatus for reflow metallic surfaces |
| 05/06/1999 | WO1999022553A1 Transistor clamp |
| 05/06/1999 | WO1999022552A1 Via pad geometry supporting uniform transmission line structures |
| 05/06/1999 | WO1999021715A1 Manufacture of lithographic printing forms |
| 05/06/1999 | WO1999021676A1 Soldering method and apparatus |
| 05/06/1999 | WO1998038701A9 Connecting structure, liquid crystal device, electronic equipment, anisotropic conductive adhesive, and method for manufacturing the adhesive |
| 05/06/1999 | EP0914027A1 Film-like adhesive for connecting circuit and circuit board |
| 05/06/1999 | EP0913892A2 Laminated spring structure and flexible circuitry connector incorporating same |
| 05/06/1999 | EP0913498A1 Electroless plating processes |
| 05/06/1999 | EP0913497A1 Method and apparatus for plating a substrate |