Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/1999
04/01/1999WO1998052393A9 Surface mount power supply device
04/01/1999CA2303979A1 Improved chemical drying and cleaning system
03/1999
03/31/1999EP0906006A2 Process for manufacturing pressure-tight via connections
03/31/1999EP0906005A1 Terminal pins mounted in flexible substrates
03/31/1999EP0906004A2 Multilayer circuit board
03/31/1999EP0905824A2 Electrical connector
03/31/1999EP0905775A2 Electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same
03/31/1999EP0905763A2 Multilayer wiring substrate and method for producing the same
03/31/1999EP0905720A1 Thick film low value high frequency inductor, and method of making the same
03/31/1999EP0905700A2 Support for a data processing device
03/31/1999EP0905564A2 Dry film photoresist construction suitable for rolling up on itself
03/31/1999EP0904938A1 Printing method and printing apparatus
03/31/1999EP0904887A1 Gold plated solder material and method of fluxless soldering using said solder
03/31/1999EP0904675A1 Screen printing method and screen printing apparatus
03/31/1999EP0904163A1 Method for cleaning electronic hardware components
03/31/1999EP0842594B1 Controller with a housing made of at least two parts
03/31/1999EP0776538A4 Electric power distribution system
03/31/1999CN1212820A Method and combined circuit board for preventing delamination and sagging in course of manufacturing complex circuit board
03/31/1999CN1212782A Data processing of Bitstream signal
03/31/1999CN1212734A Misted precursor deposition apparatus and method with improved mist and mist flow
03/31/1999CN1212640A Resist coating apparatus and coating method
03/31/1999CN1212601A Multilayer wiring substrate and method for producing the same
03/31/1999CN1212600A Electronic unit manufacturing apparatus and method
03/31/1999CN1212494A Motor, structure of stator of motor and assembly method of stator
03/31/1999CN1212486A Circuit card connector with isolation base assembly
03/31/1999CN1212195A Laser processing method
03/31/1999CN1042777C Production method for semiconductor units
03/30/1999US5889682 Clock routing design method using a hieraichical layout design
03/30/1999US5889657 Surface-mounting structure and method of electronic devices
03/30/1999US5889655 Integrated circuit package substrate with stepped solder mask openings
03/30/1999US5889572 Liquid crystal display device
03/30/1999US5889462 Multilayer thick film surge resistor network
03/30/1999US5889349 Cylindrical coreless vibrating motor
03/30/1999US5889333 Semiconductor device and method for manufacturing such
03/30/1999US5889234 Modified with infrared radiation; nondelaminating; bonding strength
03/30/1999US5889233 Multilayer wiring structure
03/30/1999US5888654 High performance epoxy based laminating adhesive
03/30/1999US5888627 Printed circuit board and method for the manufacture of same
03/30/1999US5888584 Printing paste on substrate in pattern through multilayer stencil having capillaries to control paste flow and reservoirs to control dosing
03/30/1999US5888583 Misted deposition method of fabricating integrated circuits
03/30/1999US5888372 Continuously from nonconducting film by electroless and galvanic metallization
03/30/1999US5888312 Using polysiloxane cleaning compounds
03/30/1999US5888308 Process for removing residue from screening masks with alkaline solution
03/30/1999US5888102 Surface mount carrier for electronic components
03/30/1999US5887805 Compositions of metallic and non-metallic components of wiring assemblies and printed wiring boards
03/30/1999US5887520 Method of fabricating plastic mask for paste printing with an excimer laser
03/30/1999US5887435 Environmentally protected module
03/30/1999US5887345 Method for applying curable fill compositon to apertures in a substrate
03/30/1999US5887342 Method for making an electronic control unit
03/30/1999US5887324 Electrical terminal with integral capacitive filter
03/30/1999US5887312 Clamping assembly for squeegee blade with pin referencing and bar clamping
03/30/1999CA2134019C Solder ball connections and assembly process
03/25/1999WO1999014994A1 Multi-layer circuit board
03/25/1999WO1999014828A1 Recyclable locator device for board mounted connectors
03/25/1999WO1999014823A1 Ball grid array socket assembly
03/25/1999WO1999014049A1 Mini-stencil and device for using same
03/25/1999WO1999013994A1 Deposition of substances on a surface
03/25/1999WO1999001796A3 Pattern-forming methods
03/25/1999WO1998037564A3 A surface-mount fuse and the manufacture thereof
03/25/1999DE19842237A1 Attachment element for at least one additional circuit board on a mother board
03/25/1999DE19741802A1 Arrangement for selective coating of circuit boards on both sides with high viscosity material
03/25/1999CA2302252A1 Deposition of substances on a surface
03/25/1999CA2301751A1 Mini-stencil and device for using same
03/24/1999EP0903969A2 Electronic printed circuit board
03/24/1999EP0903837A2 Motor, structure of stator of the motor and assembly method of the stator
03/24/1999EP0903786A2 Light emitting diode array and method of manufacturing
03/24/1999EP0903636A2 Thermal assisted photosensitive composition and process for formation of fine conductor lines utilizing such composition
03/24/1999EP0903635A2 Light exposure pattern mask and production method of the same
03/24/1999EP0903426A2 Improved zinc-chromium stabilizer containing a hydrogen inhibiting additive
03/24/1999EP0903386A1 Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith
03/24/1999EP0903066A1 Reel for winding photosensitive film
03/24/1999EP0903062A1 Lead attach for chip on board printed wiring board
03/24/1999EP0903061A1 Process for reflow soldering of circuit boards fitted with smd components
03/24/1999EP0903014A1 Proximity switches with mechanical decoupling of terminal pins and plug-in unit
03/24/1999EP0902977A1 Surface mount package with heat transfer feature
03/24/1999EP0902973A1 Substrate for a semiconductor chip
03/24/1999EP0902957A2 A surface-mount fuse and the manufacture thereof
03/24/1999EP0882384A4 Metal ball grid electronic package
03/24/1999EP0781186B1 Method of applying solder to connection surfaces, and method of producing a solder alloy
03/24/1999EP0696240B1 Process and apparatus for the wave soldering of circuit boards
03/24/1999EP0670760B1 Electrical connector
03/24/1999CN2311918Y Narrow slit hole exciting and spraying tin soldering apparatus
03/24/1999CN1212115A Printed circuit multilayer assembly and method of manufacture therefor
03/24/1999CN1212063A Non-conductive substrate forming band or panel, on which are formed plurality of support elements
03/24/1999CN1211896A Surface treatment method for copper and copper alloy
03/24/1999CN1211813A Light exposure pattern mask and production method of the same
03/24/1999CN1211750A Thermal assisted photosensitive composition and method thereof
03/24/1999CN1211499A Equipment for manufacturing laminated boards, in particular, industrial laminated boards
03/23/1999US5886886 Voltage multiplier for a power supply unit of an electronic insect-killer device
03/23/1999US5886878 Printed circuit board manufacturing method for through hole components with a metal case
03/23/1999US5886877 Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
03/23/1999US5886876 Surface-mounted semiconductor package and its manufacturing method
03/23/1999US5886875 Apparatus using a circuit board having a frangible portion apparatus
03/23/1999US5886763 LCD heater utilizing Z-axis conductive adhesive to attach bus bars to ito
03/23/1999US5886574 High-frequency amplifier
03/23/1999US5886415 Anisotropic conductive sheet and printed circuit board
03/23/1999US5886413 Reusable, selectively conductive, z-axis elastomeric composite substrate
03/23/1999US5886404 Bottom lead semiconductor package having folded leads
03/23/1999US5886309 Matrix switch board, connection pin, and method of fabricating them
03/23/1999US5886136 Coating a substrate with a photosensitive resin composition comprising a polyamic compound having at each terminal thereof at least one actinic ray-sensitive functional group, a photosensitive polymerizable auxiliary, exposing, developing