| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/06/1999 | EP0913372A1 Aluminum nitride substrate and process for producing the same |
| 05/06/1999 | EP0913076A1 Method for making printed circuits and resulting printed circuit |
| 05/06/1999 | EP0913075A1 Rectifier set for high voltage device |
| 05/06/1999 | EP0912913A1 Electronically addressable microencapsulated ink and display thereof |
| 05/06/1999 | EP0912335A1 Conductive elastomers and methods for fabricating the same |
| 05/06/1999 | EP0797908A4 Single alloy solder clad substrate |
| 05/06/1999 | EP0590046B1 Basic accelerating solutions for direct electroplating |
| 05/06/1999 | DE19847913A1 System optically monitoring concealed soldered connections between part and board |
| 05/06/1999 | DE19829920A1 Electronic component housing |
| 05/06/1999 | DE19749954A1 Detecting molten state during soft soldering of component onto e.g. circuit boards, especially for surface mount devices with ball-grid array connectors |
| 05/06/1999 | DE19747783A1 High frequency especially microwave waveguide element |
| 05/06/1999 | DE19744892A1 Sequential fixing of layers during manufacture of multilayer circuit boards |
| 05/06/1999 | CA2307631A1 Transistor clamp |
| 05/05/1999 | CN1216212A Printed board, mfg. method therefor and structure for connecting conductor elements to printed board |
| 05/05/1999 | CN1215973A Mounted structure of prinited circuit board in semiconductor package |
| 05/05/1999 | CN1215896A Circuit protection device |
| 05/04/1999 | US5901050 Wired base plate and package for electronic parts |
| 05/04/1999 | US5901048 Printed circuit board with chip collar |
| 05/04/1999 | US5901047 Computer chip spacer element |
| 05/04/1999 | US5901046 Surface mount type package unit and method for manufacturing the same |
| 05/04/1999 | US5901045 Method and apparatus for isolating component leads |
| 05/04/1999 | US5901041 Flexible integrated circuit package |
| 05/04/1999 | US5900845 Antenna device |
| 05/04/1999 | US5900738 Method of testing semiconductor devices |
| 05/04/1999 | US5900674 Interface structures for electronic devices |
| 05/04/1999 | US5900673 Low-temperature fusing brazing material, and wiring board and semiconductor device-housing package assembled with the same |
| 05/04/1999 | US5900669 Semiconductor component |
| 05/04/1999 | US5900587 For transmitting electrical signals |
| 05/04/1999 | US5900308 Circuit with copper plating layer, dielectric substrate, gold conductors with undercoat; stable and reliable filtering characteristics; microwave receivers |
| 05/04/1999 | US5900186 Bonding copper to resin using cyclic borane reducting agent |
| 05/04/1999 | US5900096 Method of transferring metal leaf to a substrate |
| 05/04/1999 | US5899759 Electrical connector for rigid circuit boards |
| 05/04/1999 | US5899757 Compression connector |
| 05/04/1999 | US5899737 Method of attaching solder balls to a substrate |
| 05/04/1999 | US5899446 Universal fixture for holding printed circuit boards during processing |
| 05/04/1999 | US5899376 Transfer of flux onto electrodes and production of bumps on electrodes |
| 05/04/1999 | US5898992 To conductors of printed circuits on a flexible substrate |
| 05/04/1999 | US5898991 Methods of fabrication of coaxial vias and magnetic devices |
| 05/03/1999 | CA2251051A1 Laminated spring structure and flexible circuitry connector incorporating same |
| 04/29/1999 | WO1999021238A1 Thin-profile or button-type battery circuits and constructions, methods of forming |
| 04/29/1999 | WO1999021227A1 Connector assembly for accommodating bga-style components |
| 04/29/1999 | WO1999021224A1 Package substrate |
| 04/29/1999 | WO1999021131A1 Method and device for producing chip cards |
| 04/29/1999 | WO1999020977A1 Three-dimensional inspection system |
| 04/29/1999 | WO1999020425A1 Flux management system |
| 04/29/1999 | WO1999000844A3 Sockets for semiconductor devices with spring contact elements |
| 04/29/1999 | DE19838532A1 Process for placing number of solder-material shaped pieces on connecting surface arrangement of substrate and for melting them onto surfaces |
| 04/29/1999 | DE19744351A1 Electronic assembly is packaged with a viscous molding material and a rigid cast encapsulation |
| 04/29/1999 | DE19742470A1 Method of manufacturing an electrical equipment with a housing, e.g. a revolution rate sensor |
| 04/29/1999 | CA2306623A1 Flux management system |
| 04/29/1999 | CA2252113A1 Substrate and process for producing the same |
| 04/28/1999 | EP0912079A1 Thick-film conductor circuit and production method therefor |
| 04/28/1999 | EP0911913A2 Electrical connector |
| 04/28/1999 | EP0911903A2 Coaxcial cable, method for manufacturing a coaxial cable, and wireless communication device |
| 04/28/1999 | EP0911878A2 Metalization system |
| 04/28/1999 | EP0911876A2 Low thermal expansion circuit board and multilayer wiring circuit board |
| 04/28/1999 | EP0911678A2 Display device with terminals connected to a folded film substrate |
| 04/28/1999 | EP0911675A2 Method and device for mounting an electrically contactable display |
| 04/28/1999 | EP0911353A1 Adhesive resin composition and adhesive film |
| 04/28/1999 | EP0910936A1 Method of providing a synthetic resin capping layer on a printed circuit |
| 04/28/1999 | EP0910935A1 Electrical circuit |
| 04/28/1999 | EP0910490A1 Molten solder dispensing system |
| 04/28/1999 | EP0910480A1 Device for wet coating, in particular printed circuit boards with lacquer |
| 04/28/1999 | EP0834169A4 Tesselated electroluminescent display having a multilayer ceramic substrate |
| 04/28/1999 | CN1215439A Process and device for the electrochemical treatment of items with a fluid |
| 04/28/1999 | CN1215301A Multi-layer substrate and making method thereof |
| 04/28/1999 | CN1215254A Electronic equipment |
| 04/28/1999 | CN1215096A Plating method |
| 04/28/1999 | CN1214979A Nickel powder and preparation process thereof |
| 04/27/1999 | US5898717 Third harmonic generation apparatus |
| 04/27/1999 | US5898575 Support assembly for mounting an integrated circuit package on a surface |
| 04/27/1999 | US5898574 Self aligning electrical component |
| 04/27/1999 | US5898573 Microelectronic packages and packaging methods including thermally and electrically conductive pad |
| 04/27/1999 | US5898563 Chip composite electronic component with improved moisture resistance and method of manufacturing the same |
| 04/27/1999 | US5898344 High-frequency module |
| 04/27/1999 | US5898314 Translator fixture with force applying blind pins |
| 04/27/1999 | US5898248 Small motor holding device in individual calling receiver |
| 04/27/1999 | US5898222 Capped copper electrical interconnects |
| 04/27/1999 | US5898218 Structure for mounting electronic components and method for mounting the same |
| 04/27/1999 | US5898215 Microelectronic assembly with connection to a buried electrical element, and method for forming same |
| 04/27/1999 | US5898128 Electronic component |
| 04/27/1999 | US5897913 Method for applying a protective coating to the components of a printed circuit board |
| 04/27/1999 | US5897761 Surface treatment of matte surface; controlling surface roughness |
| 04/27/1999 | US5897756 Device for chemical or electroyltic surface treatment of plate-like objects |
| 04/27/1999 | US5897727 Depositing transparent conductive layer on substrate, depositing layer of crosslinkable pressure sensitive adhesive, placing in contact with receptor surface, curing to adhere to both |
| 04/27/1999 | US5897724 Plating copper directly on a portion of a porous conductive material on a sintered substrate so that the copper extends to the substrate surface, preventing exposure of the conductive material; forming conductor terminal |
| 04/27/1999 | US5897723 Method for fabricating a ceramic composite body having at least one hollow portion therein |
| 04/27/1999 | US5897707 Apparatus for applying solder paste to contact elements of ball grid array components |
| 04/27/1999 | US5897692 Electroless plating solution |
| 04/27/1999 | US5897368 Method of fabricating metallized vias with steep walls |
| 04/27/1999 | US5897336 Direct chip attach for low alpha emission interconnect system |
| 04/27/1999 | US5897335 Flip-chip bonding method |
| 04/27/1999 | US5897334 Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards |
| 04/27/1999 | US5897326 Method of exercising semiconductor devices |
| 04/27/1999 | US5897188 Structure of liquid crystal display device with two driver circuit substrates partially superposed and connected by a flexible cable |
| 04/27/1999 | US5896655 Method for manufacturing electrically conductive lead-throughs in metallized plastic housings |
| 04/27/1999 | US5896650 Method of making ceramic multilayer |
| 04/27/1999 | CA2012670C Multilayer film and laminate for use in producing printed circuit boards |
| 04/22/1999 | WO1999020090A1 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| 04/22/1999 | WO1999020089A1 Stratified composite dielectric and method of fabrication |