| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/29/1999 | US5916736 Process of manufacturing a printed circuit board with plated landless through-holes by the use of a filling material |
| 06/29/1999 | US5916735 Method for manufacturing fine pattern |
| 06/29/1999 | US5916688 Siloxanepolyimidepolyamic acid copolymers; chemical resistance |
| 06/29/1999 | US5916675 Applying the adhesive onto a heat resistance resin film to form a film adhesive composite, drying the adhesive on the film applied, bonding a release agent onto the dried adhesive |
| 06/29/1999 | US5916641 Method of forming a monolayer of particles |
| 06/29/1999 | US5916486 Method for providing discharge protection or shielding |
| 06/29/1999 | US5916485 Method of manufacturing highly conducting composites containing only small proportions of electron conductors |
| 06/29/1999 | US5916453 Methods of planarizing structures on wafers and substrates by polishing |
| 06/29/1999 | US5916451 Minimal capture pads applied to ceramic vias in ceramic substrates |
| 06/29/1999 | US5916407 Process for producing an electrically conductive connection |
| 06/29/1999 | US5916401 Coating of substrates |
| 06/29/1999 | US5916374 Supporting vertically, simultaneously spraying front and back with aqueous alkaline cleaning solution |
| 06/29/1999 | US5915999 In a plated through-hole formed in a circuit board |
| 06/29/1999 | US5915994 Connector for use with printed circuit and added component |
| 06/29/1999 | US5915979 Electrical connector with stress isolating solder tail |
| 06/29/1999 | US5915977 System and interconnect for making temporary electrical connections with bumped semiconductor components |
| 06/29/1999 | US5915757 Electrostatic protective device and method for fabricating same |
| 06/29/1999 | US5915755 Method for forming an interconnect for testing unpackaged semiconductor dice |
| 06/29/1999 | US5915753 Method of producing a high-density printed wiring board for mounting |
| 06/29/1999 | US5915752 Method of making connections to a semiconductor chip assembly |
| 06/29/1999 | US5915749 Method for mounting an integrated circuit device onto a printed circuit board |
| 06/29/1999 | CA2155116C System for automatically connecting a source of eletric current to laminates in a press |
| 06/29/1999 | CA2092109C Apparatus for the assembly of stacks of press materials on the manufacture of laminated sheets |
| 06/24/1999 | WO1999031944A1 Electric circuit supports |
| 06/24/1999 | WO1999031943A1 Circuit support packing and method for the production thereof |
| 06/24/1999 | WO1999031777A1 Bus bar wiring board and method of producing the same |
| 06/24/1999 | WO1999031302A1 Printed circuit manufacturing process using tin-nickel plating |
| 06/24/1999 | WO1999031293A1 Pretreating fluid and method of pretreatment for electroless nickel plating |
| 06/24/1999 | WO1999030866A1 Pb-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE |
| 06/24/1999 | WO1998058825A3 Window wiper motor system for an automotive vehicle |
| 06/24/1999 | DE19814445C1 Hybrid circuit arrangement |
| 06/24/1999 | DE19756448A1 Schaltkreisträger-Packung und Verfahren zu deren Herstellung Circuit carrier package and process for their preparation |
| 06/24/1999 | DE19755792A1 Flat textile structure of bonded insulating textile layers contains microstructured wiring |
| 06/24/1999 | DE19755765A1 Housing for automobile electronic control device |
| 06/24/1999 | DE19755155A1 Electronic module for simple circuits of electronic components |
| 06/24/1999 | DE19754874A1 Converting substrate with edge contacts into ball grid array |
| 06/23/1999 | EP0924971A2 Device for connecting printed circuit boards |
| 06/23/1999 | EP0924970A2 Cleaning solution for electronic materials and method for using the same |
| 06/23/1999 | EP0924969A2 Printed-circuit board - mountable ferrite EMI filter |
| 06/23/1999 | EP0924774A2 Redundant multitier contacts for a solid state x-ray detector |
| 06/23/1999 | EP0924764A2 Pinned circuit board with a plurality of semiconductor devices |
| 06/23/1999 | EP0924761A1 Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same |
| 06/23/1999 | EP0924755A2 Method of fabricating a multilayer circuit board |
| 06/23/1999 | EP0923791A1 Method for making a glued joint between an electronic component and a supporting substrate |
| 06/23/1999 | EP0923627A1 High temperature resistant antistatic pressure-sensitive adhesive tape |
| 06/23/1999 | CN1220773A Film carrier tape, semiconductor assembly, semiconudctor device, manufacturing method therefor, mounting board and electronic equipment |
| 06/23/1999 | CN1220631A Screen printing method and screen printing press |
| 06/23/1999 | CN1220492A Semiconductor device |
| 06/23/1999 | CN1220415A Photosensitive composition for sandblasting and photosensitive film comprising the same |
| 06/23/1999 | CN1043753C Method for localized surface glazing of ceramic articles and device for carrying out said method |
| 06/22/1999 | US5915170 Multiple part compliant interface for packaging of a semiconductor chip and method therefor |
| 06/22/1999 | US5915031 Modularized hearing aid circuit structure |
| 06/22/1999 | US5914864 Shock and vibration attenuating structure for an electronic assembly |
| 06/22/1999 | US5914861 Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same |
| 06/22/1999 | US5914859 Electronic component mounting base board and method of producing the same |
| 06/22/1999 | US5914644 Printed-circuit board-mountable ferrite EMI filter |
| 06/22/1999 | US5914614 High density cantilevered probe for electronic devices |
| 06/22/1999 | US5914536 Semiconductor device and soldering portion inspecting method therefor |
| 06/22/1999 | US5914534 Three-dimensional multi-layer molded electronic device and method for manufacturing same |
| 06/22/1999 | US5914530 Semiconductor device |
| 06/22/1999 | US5914358 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same |
| 06/22/1999 | US5914218 Spring contact anchored on one end, the free portion compliantly contacts a second contact pad, electrically interconnecting the two contact pads; spring compensates for thermal and mechanical variations |
| 06/22/1999 | US5914216 Multilayer circuit board and photosensitive resin composition used therefor |
| 06/22/1999 | US5914186 High temperature resistant antistatic pressure-sensitive adhesive tape |
| 06/22/1999 | US5914179 Flexible circuit board and production method therefor |
| 06/22/1999 | US5914016 Apparatus for the treatment of articles |
| 06/22/1999 | US5913699 Laminated spring structure and flexible circuitry connector incorporating same |
| 06/22/1999 | US5913690 Electrical grounding shroud |
| 06/22/1999 | US5913552 From heat |
| 06/22/1999 | US5913455 Apparatus for rapid dispensing of minute quantities of viscous material |
| 06/22/1999 | CA2148106C Printed circuit board testing device with foil adapter |
| 06/17/1999 | WO1999030543A1 Method for making circuit elements for a z-axis interconnect |
| 06/17/1999 | WO1999030542A1 Method of manufacturing multilayer printed wiring board |
| 06/17/1999 | WO1999030541A1 Printed circuits and method for making |
| 06/17/1999 | WO1999030540A1 Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material |
| 06/17/1999 | WO1999030376A2 Battery-included pcb |
| 06/17/1999 | WO1999029932A1 Electroplating method and electroplated articles |
| 06/17/1999 | WO1999029931A2 Clamp-like holding device for immersion plating |
| 06/17/1999 | DE19822782A1 Monolithic multilayer electronic part exhibits minimal silver diffusion from internal electrodes |
| 06/17/1999 | DE19753060A1 Electronic circuit board module |
| 06/16/1999 | EP0923278A1 Manufacturing process for printed circuits |
| 06/16/1999 | EP0923123A2 Process of selective transfer of a microstructure, formed on an initial substrate, to a final substrate |
| 06/16/1999 | EP0923094A2 Multilayer ceramic electronic element and manufacturing method therefor |
| 06/16/1999 | EP0923085A1 Resistance wiring board and method for manufacturing the same |
| 06/16/1999 | EP0922317A1 Electrical terminal with integral capacitive filter |
| 06/16/1999 | EP0922313A1 Circuit connector |
| 06/16/1999 | EP0922300A1 Semiconductor device provided with low melting point metal bumps and process for producing same |
| 06/16/1999 | EP0921887A1 Method and apparatus for forming termination stripes |
| 06/16/1999 | EP0886894A4 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 06/16/1999 | EP0820351A4 Fluid delivery apparatus and method |
| 06/16/1999 | EP0772700B1 Use of a palladium colloid solution |
| 06/16/1999 | EP0748507B1 Anisotropically conducting adhesive |
| 06/16/1999 | CN1220078A Method for mounting terminal on circuit board and circuit board |
| 06/16/1999 | CN1220077A Method for mounting terminal on circuit board and circuit board |
| 06/16/1999 | CN1219981A Electroless copper plating solution and method for electroless copper plating |
| 06/16/1999 | CN1219908A Cleaning apparatus and cleaning method |
| 06/16/1999 | CN1219906A Screen printing apparatus and screen printing method |
| 06/16/1999 | CN1219838A Attachment of electronic device packages to heat sinks |
| 06/16/1999 | CN1219837A Built-in circuit device assembly and its manufacturing method |
| 06/16/1999 | CN1219764A Process for forming inter-level insulating layer and vapor phase deposition system and therein |