| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/05/1999 | US5855995 Ceramic substrate for implantable medical devices |
| 01/05/1999 | US5855805 Microetching and cleaning of printed wiring boards |
| 01/05/1999 | US5855803 Template type cavity-formation device for low temperature cofired ceramic (LTCC) sheets |
| 01/05/1999 | US5855755 Photopolymerization |
| 01/05/1999 | US5855733 Press pad |
| 01/05/1999 | US5855732 Outer lead bonding apparatus and method of bonding lead to substrate |
| 01/05/1999 | US5855711 Method of producing a ceramic circuit substrate |
| 01/05/1999 | US5855323 Method and apparatus for jetting, manufacturing and attaching uniform solder balls |
| 01/05/1999 | US5855063 Method of making contact pad having metallically anchored elastomeric electrical contacts |
| 01/05/1999 | CA2003997C Conversion of manganate to permanganate |
| 12/30/1998 | WO1998059095A1 Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby |
| 12/30/1998 | WO1998058825A2 Window wiper motor system for an automotive vehicle |
| 12/30/1998 | EP0888038A1 Surface mounted electronic parts and manufacturing method therefor |
| 12/30/1998 | EP0888037A1 Anti-tombstoning solder joints |
| 12/30/1998 | EP0887884A2 Bus bar structure |
| 12/30/1998 | EP0887856A1 Method of manufacturing electronic components |
| 12/30/1998 | EP0887851A2 Method of forming interconnections on electronic modules |
| 12/30/1998 | EP0887439A1 Process for improving the adhesion of polymeric materials to metal surfaces |
| 12/30/1998 | EP0887132A2 Copper fine powder and method for preparing the same |
| 12/30/1998 | EP0886996A2 Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
| 12/30/1998 | EP0886991A1 Conducting foil for conductively connecting electric and/or electronic components |
| 12/30/1998 | EP0886894A2 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 12/30/1998 | EP0886810A1 Multi-tool positioning system |
| 12/30/1998 | EP0865675A4 Electrical connector with stress isolating solder tail |
| 12/30/1998 | EP0706445B1 Process for manufacture by endothermic heating of plastic laminates in a continuous band pressed in cycles |
| 12/30/1998 | CN2302598Y Clamping, welding and cutting apparatus for wire soldering machine |
| 12/30/1998 | CN1203621A Adhesive, process for preparation thereof, and process for mounting components |
| 12/30/1998 | CN1203545A Process for manufacturing resin-encapsulated electronic product |
| 12/30/1998 | CN1203512A Electronic unit soldering apparatus |
| 12/30/1998 | CN1203511A Circuit substrate, circuit-formed suspension substrate, and production method thereof |
| 12/30/1998 | CN1203454A 多芯片模块 A multi-chip module |
| 12/30/1998 | CN1203430A Conductive paste, its manufacturing method, and printed wiring board using same |
| 12/30/1998 | CN1041479C Component module |
| 12/30/1998 | CN1041470C Organic chip carriers for wire bond-type chips |
| 12/30/1998 | CA2293218A1 Window wiper motor system for an automotive vehicle |
| 12/29/1998 | US5854724 Magnetic head suspension assembly |
| 12/29/1998 | US5854514 Lead-free interconnection for electronic devices |
| 12/29/1998 | US5854325 Photosensitive adhesive composition for additive plating |
| 12/29/1998 | US5854126 Method for forming metallization in semiconductor devices with a self-planarizing material |
| 12/29/1998 | US5854093 Direct attachment of silicon chip to circuit carrier |
| 12/29/1998 | US5853957 Photosensitive resin compositions, cured films thereof, and circuit boards |
| 12/29/1998 | US5853907 Aromatic polyamide film, method for producing the same, and magnetic recording medium and solar cell using the same |
| 12/29/1998 | US5853622 Transient liquid phase sintering conductive adhesives |
| 12/29/1998 | US5853557 Low friction, ductile, multilayer electrodeposits |
| 12/29/1998 | US5853528 Method for manufacturing laminates and apparatus performing the method |
| 12/29/1998 | US5853517 Method for coining solder balls on an electrical circuit package |
| 12/29/1998 | US5853489 Cleaning process |
| 12/29/1998 | US5852871 Method of making raised contacts on electronic components |
| 12/29/1998 | CA2135794C Tin-bismuth solder connection having improved high temperature properties, and process for forming same |
| 12/25/1998 | CA2232236A1 Anti-tombstoning solder joints |
| 12/24/1998 | DE19827014A1 Method and apparatus for soldering |
| 12/24/1998 | DE19756185A1 Coupling contact structure for integrated circuit pack |
| 12/24/1998 | DE19726510A1 Apparatus for electrolytic metal precipitation |
| 12/23/1998 | WO1998058407A1 Component support for a multi-chip module |
| 12/23/1998 | WO1998058390A1 Resistance wiring board and method for manufacturing the same |
| 12/23/1998 | WO1998058372A1 Storage medium having electronic circuit and method for manufacturing thereof |
| 12/23/1998 | WO1998058000A1 A curable, water-borne one-component coating system using thermally labile hydrophilic groups |
| 12/23/1998 | WO1998057774A1 Method and device for repairing defective soldered joints |
| 12/23/1998 | WO1998057729A1 Method and device for supplying several working gases, and its application to an installation for assembling electronic components |
| 12/23/1998 | WO1998043307A3 Soldering globule assembly device for bga components |
| 12/23/1998 | EP0886268A1 Heat mode recording element based on a thin metallic recording layer |
| 12/23/1998 | EP0885683A1 Method and device for bonding solder balls to a substrate. |
| 12/23/1998 | EP0885551A2 Printed circuit board fabrication apparatus |
| 12/23/1998 | EP0885458A1 Method for making electrical connections |
| 12/23/1998 | EP0885315A1 Misted precursor deposition apparatus and method with improved mist and mist flow |
| 12/23/1998 | EP0843621A4 Conductive via fill inks for ceramic multilayer circuit boards on support substrates |
| 12/23/1998 | EP0826152A4 Method and apparatus for testing semiconductor dice |
| 12/23/1998 | EP0779891B1 Novel acylphosphine oxides |
| 12/23/1998 | EP0573534B1 Powder coating method for producing circuit board laminae and the like |
| 12/23/1998 | CN1202977A Flexible coil winding structure of flyback transformer and manufacturing process thereof |
| 12/23/1998 | CN1202795A Method for manufacturing electronic parts and electronic parts using the method |
| 12/23/1998 | CN1202794A Circuit board with primary and secondary through holes |
| 12/23/1998 | CN1202793A Layout structure of mounting two connectors on two sides of printed circuit board |
| 12/23/1998 | CN1202730A Chip scale carrier |
| 12/23/1998 | CN1041377C Device and method for wave soldering |
| 12/23/1998 | CA2290661A1 A curable, water-borne one-component coating system using thermally labile hydrophilic groups |
| 12/22/1998 | US5852397 Electrical devices |
| 12/22/1998 | US5852324 Plastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modes |
| 12/22/1998 | US5852257 Optical module with fluxless laser reflow soldered joints |
| 12/22/1998 | US5851644 Films and coatings having anisotropic conductive pathways therein |
| 12/22/1998 | US5851311 Polymerizable flux composition for encapsulating the solder in situ |
| 12/22/1998 | US5850693 Method of manufacturing an array of surface mount contacts |
| 12/22/1998 | US5850691 Method for securing an electronic component to a pin grid array socket |
| 12/22/1998 | US5850677 To a circuit board |
| 12/22/1998 | CA2140253C Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties |
| 12/22/1998 | CA2069908C Process and device for controlling the flow of operations in electroplating plants |
| 12/20/1998 | CA2238072A1 Method and device for bonding solder balls to a substrate |
| 12/17/1998 | WO1998057376A1 Interconnection technique for hybrid integrated devices |
| 12/17/1998 | WO1998057357A2 Multiple board package employing solder balls and fabrication method and apparatus |
| 12/17/1998 | WO1998057340A1 Coil to be mounted on substrate and structure mounting the same on substrate |
| 12/17/1998 | WO1998057226A2 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate |
| 12/17/1998 | WO1998056513A1 Photosensitive organosilicon films |
| 12/17/1998 | WO1998039732A3 Chip card module and chip card comprising the latter |
| 12/17/1998 | DE19725445A1 Bauteilträger für Multi-Chip-Module Component carrier for multi-chip modules |
| 12/17/1998 | DE19724909A1 Semiconductor device with mount for its securing to PCB |
| 12/17/1998 | DE19724664A1 Mounting unit for connecting light bulbs, etc. of motor vehicle |
| 12/17/1998 | CA2292671A1 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate |
| 12/16/1998 | EP0884937A2 Process for making through hole connections in printed circuit boards |
| 12/16/1998 | EP0884936A1 Method for manufacturing electronic circuit device |
| 12/16/1998 | EP0884935A2 Universal surface finish for DCA SMT, and pad on pad interconnections |