| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/16/1999 | US5871313 For use in a self-aligned chamfering of a workpiece |
| 02/16/1999 | US5870822 Flip chip attachment |
| 02/16/1999 | CA2123905C Metal powder composition for metallization and a metallized substrate |
| 02/16/1999 | CA2116766C Solder bump fabrication method and solder bumps formed thereby |
| 02/11/1999 | WO1999007194A1 Inter-tracks for power printed circuits |
| 02/11/1999 | WO1999006844A2 Magnetic current sensing and short circuit detection in plate structure |
| 02/11/1999 | WO1998049375A3 Device for electrolytic treatment of plate-shaped articles and method for electronic shielding of edge areas of articles during electrolytic treatment |
| 02/11/1999 | DE19834640A1 Multilayer conducting track substrate for integrated hybrid circuit |
| 02/11/1999 | DE19832052A1 Printed circuit board |
| 02/11/1999 | DE19831810A1 Image inaccuracy compensator for optical scanning system |
| 02/11/1999 | DE19732223A1 Function integration module for electrical load in automobile door |
| 02/10/1999 | EP0896502A1 Method of treating metal foil for enhancing adhesion |
| 02/10/1999 | EP0896501A2 Mounting structure for one or more semiconductor devices |
| 02/10/1999 | EP0896368A1 Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment |
| 02/10/1999 | EP0896250A2 Hardenable photoimageable compositions |
| 02/10/1999 | EP0895665A1 Thin film electric motors and method of manufacture |
| 02/10/1999 | EP0895661A1 Electrical connector for circuit board |
| 02/10/1999 | EP0895486A1 Grafted thermoplastic elastomer barrier layer |
| 02/10/1999 | CN1207585A Semiconductor device and its lead frame |
| 02/10/1999 | CN1207505A Hardenable photoimageable compositions |
| 02/10/1999 | CN1042074C Method and compositions for diffusion patterning |
| 02/09/1999 | US5870290 Interface adapter board having arrays of interstitial connectors and an intermediate switching circuit |
| 02/09/1999 | US5870289 Chip connection structure having diret through-hole connections through adhesive film and wiring substrate |
| 02/09/1999 | US5870274 Capacitive PCB with internal capacitive laminate |
| 02/09/1999 | US5869961 Smart IC-test receptacle having holes adapted for mounting capacitors arranged adjacent to pin positions |
| 02/09/1999 | US5869899 High density interconnect substrate and method of manufacturing same |
| 02/09/1999 | US5869887 Semiconductor package fabricated by using automated bonding tape |
| 02/09/1999 | US5869790 Coordinate input apparatus having orthogonal electrodes on opposite surfaces of a dielectric substrate and through-hole connections and manufacturing method thereof |
| 02/09/1999 | US5869787 Electrically conductive projections |
| 02/09/1999 | US5869161 Tape comprising solvent-containing non-tacky, free-standing, fully imidized polyimide film |
| 02/09/1999 | US5869141 Surface pretreatment for sol coating of metals |
| 02/09/1999 | US5869140 Degreasing, cleaning with alkaline cleaner, etching with alkaline etchant, desmutting with solution containing nitric acid, sulfuric acid, ammonium bifluoride |
| 02/09/1999 | US5869134 CVD of metals capable of receiving nickel or alloys thereof using iodide |
| 02/09/1999 | US5869130 Process for improving the adhesion of polymeric materials to metal surfaces |
| 02/09/1999 | US5869126 Using electroless nickel for providing the necessary interconnection for building the circuitry to desired thickness; reduces number of steps and variety of chemicals currently necessary to produce these circuit boards |
| 02/09/1999 | US5868950 Masking and laser drilling |
| 02/09/1999 | US5868949 Metalization structure and manufacturing method thereof |
| 02/09/1999 | US5868587 Component mounting device |
| 02/09/1999 | US5868582 Contact device for electrically connecting a printed circuit board with a liquid crystal display |
| 02/09/1999 | US5868324 Nozzle for soldering apparatus |
| 02/09/1999 | US5868305 Jet soldering system and method |
| 02/09/1999 | US5868304 Socketable bump grid array shaped-solder on copper spheres |
| 02/09/1999 | US5868302 Method and apparatus for mounting electronic component |
| 02/09/1999 | US5868070 To a printed circuit board |
| 02/09/1999 | US5867898 Method of manufacture multilayer circuit package |
| 02/09/1999 | US5867895 Method of mounting an electrical component with surface-mountable terminals |
| 02/09/1999 | CA1340386C Selective catalytic activation of polymeric films |
| 02/04/1999 | WO1999005895A1 Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing same |
| 02/04/1999 | WO1999005722A1 Double-side, thermally conductive adhesive tape for plastic-packaged electronic components |
| 02/04/1999 | WO1999005719A1 Device and method for producing a chip-substrate connection |
| 02/04/1999 | WO1999005701A2 Composite electrical contact structure and method for manufacturing the same |
| 02/04/1999 | WO1999005687A1 Chemical compounds made of intrinsically conductive polymers and metals |
| 02/04/1999 | WO1999005643A2 Chip module, module and method for producing a module, chip card |
| 02/04/1999 | WO1999005254A1 n-PROPYL BROMIDE BASED CLEANING SOLVENT AND IONIC RESIDUE REMOVAL PROCESS |
| 02/04/1999 | WO1998050255A3 Sensor circuit, specially for an automobiles |
| 02/04/1999 | DE19824225A1 Method of manufacturing a printed circuit board |
| 02/04/1999 | DE19741557C1 Applying solder to electromechanical precision components made of electroconductive materials |
| 02/04/1999 | DE19733777A1 Chipmodul, Modul und Verfahren zur Herstellung eines Moduls sowie Chipkarte Chip module, module and process for producing a chip card module, and |
| 02/03/1999 | EP0895447A2 A circuit board, a method for manufacturing same, and a method of electroless plating |
| 02/03/1999 | EP0895445A1 Improvement of the design of inter-tracks of power printed circuits |
| 02/03/1999 | EP0895444A1 Circuit assembly |
| 02/03/1999 | EP0895287A2 Semiconductor device and lead frame for the same |
| 02/03/1999 | EP0895284A1 Metal-ceramic composite circuit substrates |
| 02/03/1999 | EP0894851A1 Near azeotropic mixtures based on 1,1,1,3,3-pentafluorobutane, methylene chloride and methanol for treatment of solid surfaces |
| 02/03/1999 | EP0894808A1 Modified cellulose compound and photopolymerizable resin composition containing the same |
| 02/03/1999 | EP0894561A2 Horizontal soldering system with oil blanket |
| 02/03/1999 | EP0894043A1 Method of forming articles and patterning surfaces via capillary micromolding |
| 02/03/1999 | EP0894036A1 A solder dispensing apparatus |
| 02/03/1999 | EP0760104B1 Process and system for testing the correct position of printed circuit boards having contact islands and conductor paths in a testing device |
| 02/03/1999 | EP0754356A4 Electrical lead for surface mounting of substrates |
| 02/03/1999 | CN2306561Y Improved structure for film circuit board |
| 02/03/1999 | CN1207012A Electronic elements and equipment |
| 02/03/1999 | CN1206831A Method and apparatus for quantitative measurement of corrosivity effect of residues present on surface of electronic circuit assemblies |
| 02/03/1999 | CN1206754A Process for stripping/coating conductive material and device thereof |
| 02/03/1999 | CN1041980C Anisotropic conductive film, manufacturing method and connector using the same |
| 02/02/1999 | US5867390 Adhesive applying method |
| 02/02/1999 | US5867371 Cover member for sealed circuit board assembly |
| 02/02/1999 | US5867260 Conductive ball mounting apparatus and mounting method of conductive ball |
| 02/02/1999 | US5867235 Assembling construction of a display apparatus and assembling method therefor |
| 02/02/1999 | US5866948 Interposer for semiconductor device |
| 02/02/1999 | US5866942 Metal base package for a semiconductor device |
| 02/02/1999 | US5866852 Circuitized substrate assembly with carrier having substrates therein |
| 02/02/1999 | US5866850 Layered construction of busbars and insulating plates with ribs |
| 02/02/1999 | US5866475 Method of forming solder bumps |
| 02/02/1999 | US5866470 Method of using an interface layer for stacked lamination sizing and sintering |
| 02/02/1999 | US5866441 Inverted chip bonded module with high packaging efficiency |
| 02/02/1999 | US5866240 Thick ceramic on metal multilayer circuit board |
| 02/02/1999 | US5866237 Organic electronic package and method of applying palladium-tin seed layer thereto |
| 02/02/1999 | US5866203 Bonding strength |
| 02/02/1999 | US5866044 Lead free conductive composites for electrical interconnections |
| 02/02/1999 | US5866020 Method of manufacturing TAB tapes and laminated body for producing the same |
| 02/02/1999 | US5865934 Method of manufacturing printed wiring boards |
| 02/02/1999 | US5865920 Method of forming electrode on ceramic green sheet and method of manufacturing multilayer ceramic electronic component |
| 02/02/1999 | US5865902 Method for cleaning electronic hardware components |
| 02/02/1999 | US5865650 Ultrasound adapter |
| 02/02/1999 | US5865631 Method for reducing shorts on a printed circuit board edge connector |
| 02/02/1999 | US5865413 Surface mountable component holder |
| 02/02/1999 | US5865365 Method of fabricating an electronic circuit device |
| 02/02/1999 | US5865117 Screen cleaning apparatus and screen cleaning method |
| 02/02/1999 | US5864946 Method of making contact tip structures |