| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/13/1999 | US5894038 Direct deposition of palladium |
| 04/13/1999 | US5893983 Technique for removing defects from a layer of metal |
| 04/13/1999 | US5893779 Conforming press-fit contact pin for printed circuit board |
| 04/13/1999 | US5893727 Method for manufacturing a massive parallel interconnection attachment using flexible circuit |
| 04/13/1999 | US5893725 C4 substrate contact pad which has a layer of NI-B plating |
| 04/13/1999 | US5893709 Heat-transfer device for use in a convective-heat installation, in particular in a convective soldering installation |
| 04/13/1999 | US5893687 Plate suppressing device for drilling apparatus |
| 04/13/1999 | US5893623 Structure and method for mounting semiconductor devices, and liquid crystal display |
| 04/13/1999 | US5893466 Support for printed circuit board during processing |
| 04/10/1999 | CA2249133A1 Connectors for flat flexible circuitry |
| 04/10/1999 | CA2248851A1 Male connector for flat flexible circuit |
| 04/08/1999 | WO1999017598A1 Cover member for sealed circuit board assembly |
| 04/08/1999 | WO1999017597A1 Microelectronic packages and packaging methods including thermally and electrically conductive pad |
| 04/08/1999 | WO1999017595A1 Solder ball placement with flux, template and laser tag |
| 04/08/1999 | WO1999017594A1 Laser reflow with template for solder balls of bga packaging |
| 04/08/1999 | WO1999017593A1 Fluxless laser reflow with template for solder balls of bga packaging |
| 04/08/1999 | WO1999017384A1 Housing for piezoelectric transformer device |
| 04/08/1999 | WO1999017363A1 Method for producing a multilevel cable carrier (substrate), especially for multichip modules |
| 04/08/1999 | WO1999017361A2 Intermediate carrier substrate with high wiring density for electronic components |
| 04/08/1999 | WO1999017352A1 Method and compositions for metallizing microvias and high density interconnects in photodefined dielectrics |
| 04/08/1999 | WO1999017317A1 Microelectronic component carrier and method of its manufacture |
| 04/08/1999 | WO1999016935A2 Simplified process and apparatus for production of copper foil |
| 04/08/1999 | WO1999016601A1 Manufacture of thin metal objects |
| 04/08/1999 | WO1999016556A1 Method for metallizing holes |
| 04/08/1999 | WO1999006844A3 Magnetic current sensing and short circuit detection in plate structure |
| 04/08/1999 | WO1999005643A3 Chip module, module and method for producing a module, chip card |
| 04/08/1999 | WO1999004415A3 Integrated circuit package |
| 04/08/1999 | DE19816192A1 Electromagnetic wave analysis instrument to analyze electromagnetic wave expanding from multilayer substrate |
| 04/08/1999 | DE19743886A1 Solder paste contains copper or nickel-plated aluminium balls |
| 04/08/1999 | DE19743365A1 Verfahren zur Herstellung eines Mehrebenen-Verdrahtungsträgers (Substrat), insbesondere für Multichipmodule A process for preparing a multi-level wiring support (substrate), especially for multi-chip modules |
| 04/08/1999 | DE19721731C1 Joining plastic film with a release agent on the surface to a metal foil and resulting multilayer material |
| 04/08/1999 | CA2305696A1 Manufacture of thin metal objects |
| 04/08/1999 | CA2304537A1 Microelectronic component carrier and method of its manufacture |
| 04/08/1999 | CA2304528A1 Microelectronic packages and packaging methods including thermally and electrically conductive pad |
| 04/07/1999 | EP0907308A1 Method for mounting terminal on circuit board and circuit board |
| 04/07/1999 | EP0907199A2 Wiring substrate and gas discharge display device |
| 04/07/1999 | EP0906968A1 Composition and method for stripping solder and tin from printed circuit boards |
| 04/07/1999 | EP0906827A1 Screen printing method and apparatus therefor |
| 04/07/1999 | EP0906808A2 Method of stacking packs of printed circuit boards and related pack loading and unloading device for a machine tool |
| 04/07/1999 | EP0906807A2 Tool-change system for a machine tool with a number of machining heads |
| 04/07/1999 | EP0906806A2 Machine tool featuring a number of machining heads for machining printed circuit boards |
| 04/07/1999 | EP0906805A2 System for selecting tools from a tool store of a machine tool for machining printed circuit boards |
| 04/07/1999 | EP0906666A1 Printed circuit board having integrated broadside microwave coupler |
| 04/07/1999 | EP0638225B1 Feedthrough via connection method and apparatus |
| 04/07/1999 | CN2313358Y Water-overflowing mud-removing device for circuitboard washing tank |
| 04/07/1999 | CN1213457A Method and apparatus for babricating silion dioxide and silicon glass layer in integrated circuits |
| 04/07/1999 | CN1213440A Mutli-tool positioning system |
| 04/07/1999 | CN1213372A Heterocycle-condensed morphinoid derivatives (II) |
| 04/07/1999 | CN1213265A Method for manufacturing grain dimensional packaged circuit board |
| 04/07/1999 | CN1213166A Stacked via in copper/polyimide BEOL |
| 04/07/1999 | CN1213156A Flexible circuit and its preparation method |
| 04/07/1999 | CN1213016A Quasi-azeotropic mixture based on 1,1,1,3,3-pentafluorobutane, methylene choride and methanol for treatment of solid surfaces |
| 04/06/1999 | US5892999 Zoom lens barrel with shutter mounting unit |
| 04/06/1999 | US5892668 Noise-cut filter for power converter |
| 04/06/1999 | US5892663 Flexible insulator for telecommunications network printed |
| 04/06/1999 | US5892660 Single in line memory module adapter |
| 04/06/1999 | US5892657 Electronic-circuit assembly and its manufacturing method |
| 04/06/1999 | US5892629 Objective lens actuator |
| 04/06/1999 | US5892611 Laser drawing apparatus |
| 04/06/1999 | US5892476 Electromagnetic radiation absorptive composition containing inorganic coated microparticles |
| 04/06/1999 | US5892280 Semiconductor chip carrier affording a high-density external interface |
| 04/06/1999 | US5892277 Tab tape and semiconductor device using the tab tape |
| 04/06/1999 | US5892245 Ball grid array package emulator |
| 04/06/1999 | US5892192 Operation device for vehicle air conditioner |
| 04/06/1999 | US5891978 Room temperature curable compositions |
| 04/06/1999 | US5891795 High density interconnect substrate |
| 04/06/1999 | US5891761 Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |
| 04/06/1999 | US5891606 Method for forming a high-density circuit structure with interlayer electrical connections method for forming |
| 04/06/1999 | US5891543 Apparatus and method for screening using electrostatic adhesion |
| 04/06/1999 | US5891528 Printed circuit board process using plasma spraying of conductive metal |
| 04/06/1999 | US5891527 Printed circuit board process using plasma spraying of conductive metal |
| 04/06/1999 | US5891513 Semiconductors |
| 04/06/1999 | US5891509 Method of applying a coating material to a plate with conveying rollers clamping side edges of the plate |
| 04/06/1999 | US5891367 Based on a silver flake-filled polymeric reaction product of a liquid bisphenol a having very low hydrolyzable chlorine content and suitable polypropylene oxide-based primary amine curing agents. |
| 04/06/1999 | US5891366 Anisotropically conducting adhesive, and process for producing an anisotropically conducting adhesive |
| 04/06/1999 | US5891365 Anisotropically conducting adhesive |
| 04/06/1999 | US5891354 Methods of etching through wafers and substrates with a composite etch stop layer |
| 04/06/1999 | US5891291 Method for manufacturing laminate and apparatus for manufacturing same |
| 04/06/1999 | US5891281 System and method for uniform product compressibility in a high throughput uniaxial lamination press |
| 04/06/1999 | US5891257 Tools for removing protective coatings fron printed circuits |
| 04/06/1999 | US5891212 The invention relates to making uniformly sized metallic spheres for use in solder compositions. |
| 04/06/1999 | US5890915 Electrical and thermal conducting structure with resilient conducting paths |
| 04/06/1999 | US5890912 Contact terminal with linear contact region |
| 04/06/1999 | US5890429 Method of making and bonding a screen printed ink film carrier to an electronic device |
| 04/06/1999 | US5890284 Method for modifying circuit having ball grid array interconnections |
| 04/06/1999 | US5890283 Apparatus and method for mounting electrically conductive balls |
| 04/06/1999 | US5890282 Making an integrated control and panel assembly |
| 04/06/1999 | US5890281 Method for simplified and compact component addition to a printed circuit board |
| 04/06/1999 | CA2249421A1 Method for adhering a metallization to a substrate |
| 04/06/1999 | CA2247714A1 Laser-solderable electronic component |
| 04/06/1999 | CA2121301C Multilayer glass ceramic substrate and method of fabricating the same |
| 04/01/1999 | WO1999016292A1 Article and method for temporarily securing a flexible circuit to a rigid member |
| 04/01/1999 | WO1999016151A1 Board to board standoff and ground connection apparatus |
| 04/01/1999 | WO1999016130A1 Demountable, compliant area array interconnect |
| 04/01/1999 | WO1999016120A1 Component hybridising system allowing for defective planarity |
| 04/01/1999 | WO1999016020A1 Portable electronic device |
| 04/01/1999 | WO1999015908A1 Method for manufacturing semiconductor integrated circuit device |
| 04/01/1999 | WO1999015845A1 Improved chemical drying and cleaning system |
| 04/01/1999 | WO1999015334A1 Method for transferring a picture to a surface |
| 04/01/1999 | WO1999014996A2 Method of analyzing nonstationary data |