Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1998
11/12/1998CA2286030A1 Improvements in the manufacturing processes of service boxes and their parts
11/11/1998EP0877540A1 Method and apparatus for providing planar and non-planar compliant electrical connections between adjacent circuits
11/11/1998EP0877539A1 Improvements in the manufacturing processes of service boxes and their parts
11/11/1998EP0877417A1 Method for fabrication of electrodes and other electrically-conductive structures
11/11/1998EP0876691A1 Solder element
11/11/1998EP0876689A2 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
11/11/1998EP0876518A1 Rough electrical contact surface
11/11/1998EP0876306A1 Method of applying a silver layer to a glass substrate
11/11/1998EP0876195A1 Method of filtering the organic solutions arising in the production of circuit boards
11/11/1998EP0859686A4 Fabricating interconnects and tips using sacrificial substrates
11/11/1998EP0787219B1 Laser method for plating vias
11/11/1998EP0679128B1 An apparatus forming a junction box comprising a shunt busbar disposed therein
11/11/1998CN1198873A Method for plating independent conductor circuit
11/11/1998CN1198782A Process for manufacturing inductive counting systems
11/11/1998CN1198653A Method for making multi-layer circuit board by chemical etching process to form blind holes
11/11/1998CN1198652A Method for making multi-layer circuit board by sand-blasting to form blind hole
11/11/1998CN1198603A Method of flexible electric connection of plane and non-plane between adjacent circuit and equipment thereof
11/11/1998CN1198594A 多芯片模块 A multi-chip module
11/11/1998CN1198593A 多芯片模块 A multi-chip module
11/11/1998CN1198540A Display device
11/11/1998CN1198533A Apparatus and method for testing non-componented printed circuit boards
11/10/1998USRE35950 Recording medium cassette and a recording/reproducing apparatus
11/10/1998US5835979 Wiring pattern preventing EMI radiation
11/10/1998US5835359 Apparatus for coupling power transmission mediums to a contact point
11/10/1998US5835358 Power supply module for equipping an assembly PC board
11/10/1998US5835352 Power amplifying module
11/10/1998US5835350 Encapsulated, board-mountable power supply and method of manufacture therefor
11/10/1998US5835198 Articulated platform mechanism for laser pattern generation on a workpiece
11/10/1998US5834991 Thick film lange coupler
11/10/1998US5834848 Electronic device and semiconductor package
11/10/1998US5834833 Electrical component having a selective cut-off conductor
11/10/1998US5834832 Packing structure of semiconductor packages
11/10/1998US5834824 Use of conductive particles in a nonconductive body as an integrated circuit antifuse
11/10/1998US5834705 Arrangement for modifying eletrical printed circuit boards
11/10/1998US5834531 Positive photoresists of hydroxystyrene-hydroxyvinylcyclo-hexane copolymer crosslinked with an aliphatic vinyl ether to provide acid-labile acetal and/or ketal protective groups; heat resistance; resolution, uv radiation
11/10/1998US5834371 Method and apparatus for preparing and metallizing high aspect ratio silicon semiconductor device contacts to reduce the resistivity thereof
11/10/1998US5834366 Method for fabricating microbump interconnect for bare semiconductor dice
11/10/1998US5834340 Plastic molded semiconductor package and method of manufacturing the same
11/10/1998US5834335 Non-metallurgical connection between an integrated circuit and a circuit board or another integrated circuit
11/10/1998US5834163 Forming contact holes after heat treatment of thin film piezoelectric layer to prevent cracking and electrode short circuiting
11/10/1998US5834160 Method and apparatus for forming fine patterns on printed circuit board
11/10/1998US5834140 Foil having one shiny and one matte surface; plated from an electrolyte containing 3-mercapto-1-propanesulfonate(sodium salt), a carbohydrate or natural rubber, adhesive and chloride ions, bonding strength, printed circuits
11/10/1998US5834084 Dielectric layer comprising an epoxy interleaved with polytetrafluroethylene fibers
11/10/1998US5834062 Bonding of electronics; apparatus has pins which pass through openings in plate, cavities formed are filled with material which is then transferred to the electronic component
11/10/1998US5833903 Injection molding encapsulation for an electronic device directly onto a substrate
11/10/1998US5833816 Apparatus for treating printed circuit boards
11/10/1998US5833761 Method of cleaning an object including a cleaning step and a vapor drying step
11/10/1998US5833759 Method for preparing vias for subsequent metallization
11/10/1998US5833516 Method of manufacturing a plate of electrically insulating material having a pattern of apertures and/or cavities
11/10/1998US5833479 Surface mount test point enabling hands-free diagnostic testing of electronical circuits
11/10/1998US5833471 Hold-down collar for attachment of IC substrates and elastomeric material to PCBS
11/10/1998US5833128 Flux-free contacting of components
11/10/1998US5832602 Method of making wire-circuit sheet
11/10/1998US5832601 Method of making temporary connections between electronic components
11/10/1998US5832600 Method of mounting electronic parts
11/10/1998US5832599 Method of interfacing detector array layers
11/10/1998US5832598 Method of making microwave circuit package
11/10/1998US5832595 Method of modifying conductive lines of an electronic circuit board and its apparatus
11/10/1998CA2048164C Photoimageable electrodepositable photoresist composition
11/10/1998CA2040482C Photosensitive resin composition and method of forming conductive pattern
11/05/1998WO1998049877A1 Apparatus for manufacturing adhesive layer, apparatus for manufacturing double-sided substrate, and apparatus for manufacturing multi-layered substrate
11/05/1998WO1998049876A2 Capacitive device on a circuit board
11/05/1998WO1998049875A1 Method of attaching metallic objects to a printed circuit board
11/05/1998WO1998049726A1 Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device
11/05/1998WO1998049725A1 Method for making connection balls on electronic circuits or components
11/05/1998WO1998049576A1 Logic circuit and its test method
11/05/1998WO1998049572A1 Logic circuit device and method of testing the same
11/05/1998WO1998049375A2 Device for electrolytic treatment of plate-shaped articles and method for electronic shielding of edge areas of articles during electrolytic treatment
11/05/1998WO1998049374A2 Device for electrolytic treatment of printed circuit boards and conductive films
11/05/1998WO1998049368A1 Method and device for cleaning and activating electrically conductive structures and circuit boards
11/05/1998WO1998049367A1 Bismuth coating protection for copper
11/05/1998WO1998049039A1 Method and device for contacting the coils of magnetic valves in adjustable braking systems
11/05/1998WO1998049018A1 Method and apparatus for a substrate having an irregular shape
11/05/1998WO1998048954A1 Method and machine for treating parts by immersion in a cleaning liquid
11/05/1998WO1998042510A3 Viewing and imaging systems
11/05/1998WO1998041069A3 Flat assembly and method for post-assembling additional components on a printed circuit board
11/05/1998DE19819517A1 Electrode connection production for electronic component
11/05/1998DE19810873A1 Electric motor esp. for mixer device
11/05/1998DE19729770C1 Manufacture of metal products of arbitrary form by layered build=up and laser engraving of layers
11/05/1998DE19718769A1 Treatment of plate-like components
11/05/1998DE19718242A1 Vorrichtung und Verfahren zur Kontaktierung von Spulen von Magnetventilen einer regelbaren Bremsanlage An apparatus and method for contacting of coil of solenoid valves of a controllable brake system
11/05/1998DE19717882A1 Circuit carrier in form of injection moulded plastic connector
11/05/1998CA2287274A1 Apparatus for electrolytically treating printed circuit boards and conductor foils
11/05/1998CA2287251A1 Apparatus for electrolytically treating a board-like item to be treated and method of electrically shielding edge regions of the item to be treated during the electrolytic treatment
11/05/1998CA2287249A1 Method for making connection balls on electronic circuits or components
11/04/1998EP0876089A2 Method for judging the propriety of cutting position on laminated board and laminated ceramic electronic part
11/04/1998EP0876088A2 Semiconductor microwave amplifier
11/04/1998EP0875928A2 Metallization in semiconductor devices
11/04/1998EP0875767A2 Device and procedure for testing naked circuit boards
11/04/1998EP0875331A2 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate
11/04/1998EP0874920A1 Process and device for the electrochemical treatment of items with a fluid
11/04/1998EP0823098B1 Laminating device for joining a metal strip and an insulating material strip
11/04/1998EP0804637B1 Method and device for galvanizing plate-shaped products in horizontal continuous plants
11/04/1998CN2296607Y Electroplating bath for circuit board
11/04/1998CN1198293A Copper foil for manufacture of printed circuits and method of producing same
11/04/1998CN1198259A Ceramic stripline filter
11/04/1998CN1198247A Provision of color elements on substrates by means of screen-printing or stencil-printing method
11/04/1998CN1198109A Vacuum flash evaporated polymer composites
11/04/1998CN1198073A Interlaminar connection of stacked electronic components
11/04/1998CN1198036A Motor with control device
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