| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/28/1999 | WO1999004461A1 Interposers for land grid arrays |
| 01/28/1999 | WO1999004453A1 Contact and method for producing a contact |
| 01/28/1999 | WO1999004430A1 Semiconductor flip-chip package and method for the fabrication thereof |
| 01/28/1999 | WO1999004415A2 Integrated circuit package |
| 01/28/1999 | WO1999004048A1 Tin-bismuth based lead-free solders |
| 01/28/1999 | WO1999003637A1 Composition for preventing creeping of a flux for soldering |
| 01/28/1999 | WO1999003632A1 A coating used for manufacturing and assembling electronic components |
| 01/28/1999 | WO1999003626A1 Apparatus and method for making uniformly sized and shaped spheres |
| 01/28/1999 | WO1999003597A1 Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| 01/28/1999 | WO1998048378A3 Card inlay for chip cards |
| 01/28/1999 | DE19832561A1 Electric motor control circuit module |
| 01/28/1999 | DE19832560A1 Control circuit module for electrical system in automobile |
| 01/28/1999 | DE19731538A1 Industrial laminate manufacturing plant and production process |
| 01/27/1999 | EP0893947A1 Method for surface treatment of copper or copper alloys |
| 01/27/1999 | EP0893946A2 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding |
| 01/27/1999 | EP0893945A1 Printed board, manufacturing method therefor and structure for connecting conductor elements to the printed board |
| 01/27/1999 | EP0893848A2 Strain relief system for holding cables to circuit boards |
| 01/27/1999 | EP0893514A2 Aqueous solution for forming metallic complex, tin-silver alloy plating solution, and method of plating with said plating solution |
| 01/27/1999 | EP0893484A2 Multilayer anisotropic electroconductive adhesive and method for manufacturing same |
| 01/27/1999 | EP0893474A2 Epoxy resin composition and a process for manufacturing a multilayer printed-wiring board using it |
| 01/27/1999 | EP0892987A1 Method for manufacturing multi-chip modules utilizing direct lead attach |
| 01/27/1999 | EP0820359A4 Method and apparatus for circuit board treatment |
| 01/27/1999 | EP0758366B1 High temperature resistant antistatic pressure-sensitive adhesive tape |
| 01/27/1999 | EP0668808B1 No-clean soldering flux and method using the same |
| 01/27/1999 | CN1206545A Optical/electrical hybrid wiring board and its manufacturing method |
| 01/27/1999 | CN1206496A Semiconductor device, method of its manufacture, circuit substrate, and film carrier tape |
| 01/27/1999 | CN1206494A Film carrier tape and semiconductor device, method for manufacturing them, and circuit board |
| 01/27/1999 | CN1206326A Circuit cubstrate including printed circuit board having heat-shielding portion |
| 01/27/1999 | CN1206325A Printed circuit board |
| 01/27/1999 | CN1205927A Pb-In-Sn tall C-4 for fatigue enhancement |
| 01/26/1999 | US5864478 Power pod/power delivery system |
| 01/26/1999 | US5864463 Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs |
| 01/26/1999 | US5864445 Hygrothermal load compensating structures in an integrated lead suspension |
| 01/26/1999 | US5864377 Liquid crystal display |
| 01/26/1999 | US5864175 Wrap-resistant ultra-thin integrated circuit package fabrication method |
| 01/26/1999 | US5864088 Electronic device having the electromagnetic interference suppressing body |
| 01/26/1999 | US5863883 Slurry cleaning process |
| 01/26/1999 | US5863817 Semiconductor device |
| 01/26/1999 | US5863674 Battery terminals for a miniature electronic apparatus and structure for holding the same |
| 01/26/1999 | US5863620 Process and apparatus for coating printed circuit boards |
| 01/26/1999 | US5863597 Preventing mealing |
| 01/26/1999 | US5863493 Consisting of tin, silver, nickle and copper alloy |
| 01/26/1999 | US5863447 Method for providing a selective reference layer isolation technique for the production of printed circuit boards |
| 01/26/1999 | US5863446 Electrical means for extracting layer to layer registration |
| 01/26/1999 | US5863410 Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby |
| 01/26/1999 | US5863406 Method of manufacturing a printed circuit board |
| 01/26/1999 | US5863405 Process for forming conductive circuit on the surface of molded article |
| 01/26/1999 | US5863351 Method for cleaning an object soldered with a lead-containing solder |
| 01/26/1999 | US5863331 IPC (Chip) termination machine |
| 01/26/1999 | US5862973 Method for inspecting solder paste in printed circuit board manufacture |
| 01/26/1999 | US5862588 Method for restraining circuit board warp during area array rework |
| 01/26/1999 | US5862583 Panel positioning method and apparatus |
| 01/26/1999 | CA2156200C laser beam irradiation apparatus with high accuracy and stability |
| 01/26/1999 | CA2133422C Process for producing a strong bond between copper layes and ceramic |
| 01/26/1999 | CA2066325C Interface connection through an insulating part |
| 01/21/1999 | WO1999003316A1 Printed wiring board and method for manufacturing the same |
| 01/21/1999 | WO1999003315A1 A device and method in electronics systems |
| 01/21/1999 | WO1999003145A1 Method for making a glued joint between an electronic component and a supporting substrate |
| 01/21/1999 | WO1999003128A2 Singulation system for chip-scale packages |
| 01/21/1999 | WO1999002452A1 Composition and method for reducing copper oxide to metallic copper |
| 01/21/1999 | WO1999002346A1 Doctor blade for applying products with high degree of viscosity and thixotropic properties on a substrate varying in height, through a stencil, applied to said substrate |
| 01/21/1999 | WO1999002342A1 Method and device for producing a metallic or ceramic body |
| 01/21/1999 | WO1998047320A3 Multifunctional printed circuit board with an opto-electronically active component |
| 01/21/1999 | DE19830878A1 Connection between switch and circuit board for vehicle central locking control device |
| 01/21/1999 | DE19731133A1 Method for making copper foil covered laminates esp. for electrical circuit boards |
| 01/20/1999 | EP0892593A2 Shield cover attachment on printed circuit board and method of manufacturing |
| 01/20/1999 | EP0892592A2 Construction for mounting electronic component on flexible substrate |
| 01/20/1999 | EP0892591A2 Method of manufacturing a circuit assembly from two or more layers of flexible film |
| 01/20/1999 | EP0892432A2 Pin arrangement for an SMD mountable hybrid circuit |
| 01/20/1999 | EP0892427A2 Method of sealing electronic parts with a resin |
| 01/20/1999 | EP0892331A2 Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace |
| 01/20/1999 | EP0892274A2 A system and method for easily inspecting a bonded state of a BGA/CSP type electronic part to a board |
| 01/20/1999 | EP0892089A2 Metallized material-making method |
| 01/20/1999 | EP0892027A1 Drop-resistant conductive epoxy adhesive |
| 01/20/1999 | EP0891877A2 Laser-induced thermal transfer recording process |
| 01/20/1999 | EP0891835A2 Method and apparatus for attaching electronic components to substrates |
| 01/20/1999 | EP0891631A1 Method and apparatus for fabricating silicon dioxide and silicon glass layers in integrated circuits |
| 01/20/1999 | EP0891603A1 Non-conductive substrate forming a band or panel, on which are formed a plurality of support elements |
| 01/20/1999 | EP0832545B1 Process and device for treating holes or recesses in workpieces with liquid treatment agents |
| 01/20/1999 | EP0784539A4 Thermal management for additive printed circuits |
| 01/20/1999 | EP0777955B1 Device with an electric circuit |
| 01/20/1999 | EP0776385A4 High fatigue ductility electrodeposited copper foil |
| 01/20/1999 | EP0749674B1 Apparatus having inner layers supporting surface-mount components |
| 01/20/1999 | EP0745315A4 Soldering process |
| 01/20/1999 | EP0664073B1 Method for producing a conductive circuit |
| 01/20/1999 | EP0614328B1 Composite molded product having three-dimensional multi-layered conductive circuits and method of its manufacture |
| 01/20/1999 | CN1205784A Photosensitive resin compsn. |
| 01/20/1999 | CN1205548A Organic chip carriers for wire bond-type chip |
| 01/20/1999 | CN1205543A Bump formation method |
| 01/20/1999 | CN1041743C Thermally conductive adhesive |
| 01/19/1999 | US5862014 Multi-channel magnetic tape head module including flex circuit |
| 01/19/1999 | US5861670 Semiconductor device package |
| 01/19/1999 | US5861669 Semiconductor package for surface mounting |
| 01/19/1999 | US5861663 Electronics apparatus |
| 01/19/1999 | US5861325 Technique for producing interconnecting conductive links |
| 01/19/1999 | US5861323 Process for manufacturing metal ball electrodes for a semiconductor device |
| 01/19/1999 | US5861322 Forming metal blocks via electrolysis using the conductive meltable material as an electrode; separating the interconnection substrate from the initial substrate by heating and melting the meltable material |
| 01/19/1999 | US5861192 Multistep surface treatment |
| 01/19/1999 | US5861149 Methods for wound treatment |
| 01/19/1999 | US5861076 Method for making multi-layer circuit boards |