| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/08/1999 | WO1999033604A1 Method for making soldering flux and resulting weld joint |
| 07/08/1999 | WO1999017361A3 Intermediate carrier substrate with high wiring density for electronic components |
| 07/08/1999 | DE19757612C1 Hybridschaltung mit einem System zur Wärmeableitung Hybrid circuit with a system for heat dissipation |
| 07/08/1999 | DE19757227A1 Production of polyester impregnating resin giving self-extinguishing product and avoiding emissions |
| 07/07/1999 | EP0928129A1 Apparatus for manufacturing adhesive layer, apparatus for manufacturing double-sided substrate, and apparatus for manufacturing multi-layered substrate |
| 07/07/1999 | EP0928128A1 Soldering of liquid crystal display modules on the edge of printed circuit boards |
| 07/07/1999 | EP0928127A2 Method for protecting electronic components |
| 07/07/1999 | EP0928029A2 Multi-layer circuit board layout |
| 07/07/1999 | EP0928025A2 Wiring board and process for the production thereof |
| 07/07/1999 | EP0927507A1 Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing same |
| 07/07/1999 | EP0927502A1 Modularized hearing aid circuit structure |
| 07/07/1999 | EP0647251B1 Surface mount conductive adhesives |
| 07/07/1999 | CN1043972C Process and appts. for resin impregnation of porous web |
| 07/07/1999 | CN1043971C Process and appts. for resin impregnation of porous web |
| 07/06/1999 | US5920789 Technique for producing interconnecting conductive links |
| 07/06/1999 | US5920770 Resin seal semiconductor package and manufacturing method of the same |
| 07/06/1999 | US5920465 Connecting structure between flexible printed circuit board and hard printed circuit board |
| 07/06/1999 | US5920463 Component mounting device for an electrical controller |
| 07/06/1999 | US5920462 Printed circuit board |
| 07/06/1999 | US5920461 Surface mount power supply device |
| 07/06/1999 | US5920290 Resonant tag labels and method of making the same |
| 07/06/1999 | US5920125 Interconnection of a carrier substrate and a semiconductor device |
| 07/06/1999 | US5920120 Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved |
| 07/06/1999 | US5920037 Conductive bonding design for metal backed circuits |
| 07/06/1999 | US5919868 Acrylate monomeric units and a photoabsorber bound to the monomeric units which is: 1-(dimethylamino)-pyrene, 4-(12-hydroxyethyl)ethylamino)-4-(trifluoromethylsulfonyl)tola ne, or 7-hydroxy-4-methyl-2h-1-benzopyrene-2-one. |
| 07/06/1999 | US5919603 Acrylic polymer |
| 07/06/1999 | US5919546 Porous ceramic impregnated wiring body |
| 07/06/1999 | US5919538 Method of manufacturing TAB tapes and laminated body for producing the same |
| 07/06/1999 | US5919529 The present invention relates to an apparatus for and a method of serially transporting a substrate to respective units for rinsing, drying, cooling, application of resist, development and/or the like. |
| 07/06/1999 | US5919525 Technique for forming resin-impregnated fiberglass sheets using multiple resins |
| 07/06/1999 | US5919402 Electronically conducting polymers with silver grains |
| 07/06/1999 | US5919379 Copper-foil having a protective layer and copper-clad laminates using same |
| 07/06/1999 | US5919347 Method of electrophoretic deposition of laminated green bodies |
| 07/06/1999 | US5919325 Process for producing a ceramic multilayer substrate |
| 07/06/1999 | US5919120 Tool changer method |
| 07/06/1999 | US5919062 Electrical connector with an improved shell means |
| 07/06/1999 | US5919050 Method and apparatus for separable interconnecting electronic components |
| 07/06/1999 | US5918966 To be mounted adjacent to an opening in a circuit board |
| 07/06/1999 | US5918796 Method of fabricating package for housing semiconductor element |
| 07/06/1999 | US5918795 Soldering alloy, cream solder and soldering method |
| 07/06/1999 | US5918792 Apparatus and method for filling a ball grid array |
| 07/06/1999 | US5918364 Method of forming electrically conductive polymer interconnects on electrical substrates |
| 07/06/1999 | US5918362 Jig for dual-side mounting PC boards |
| 07/01/1999 | WO1999033111A2 Thin-film component comprising a substrate with an elastic coating |
| 07/01/1999 | WO1999033109A1 Bga connector with heat activated connection and disconnection means |
| 07/01/1999 | WO1999032936A1 Photoimageable compositions and films for printed wiring board manufacture |
| 07/01/1999 | WO1999032688A1 Metal surface coating, especially for micro electronics |
| 07/01/1999 | WO1999032208A1 Method for sealing and/or joining an end of a ceramic filter |
| 07/01/1999 | DE19757938A1 Multiple contact plug with insulation comb |
| 07/01/1999 | DE19757302A1 Beschichtung von Metalloberflächen insbesondere für die Mikroelektronik Coating of metal surfaces, in particular to the microelectronics |
| 07/01/1999 | DE19754877A1 Circuit board SMT-component |
| 06/30/1999 | EP0926939A2 Electronic circuit apparatus and method for assembling the same |
| 06/30/1999 | EP0926935A1 Device and process for interconnecting between two electronic devices |
| 06/30/1999 | EP0926934A2 Method and device for connecting FPCs |
| 06/30/1999 | EP0926933A1 Multilayer high frequency electronic components |
| 06/30/1999 | EP0926932A2 A multi-layer circuit board including a reactance element and a method of trimming a reactance element in a circuit board |
| 06/30/1999 | EP0926931A1 Wiring board having vias |
| 06/30/1999 | EP0926930A2 Printed circuit board |
| 06/30/1999 | EP0926929A1 Multilayer printed circuit board |
| 06/30/1999 | EP0926735A2 Tin-nickel alloy and component surface-treated with alloy |
| 06/30/1999 | EP0926733A1 Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink |
| 06/30/1999 | EP0926729A2 Semiconductor plastic package and process for the production thereof |
| 06/30/1999 | EP0926681A2 Single in-line memory module |
| 06/30/1999 | EP0926430A1 Apparatus and method for the control of the function of an industrial installation |
| 06/30/1999 | EP0926267A1 Method and composition for etching tri-metal layers to form electronic circuits |
| 06/30/1999 | EP0926266A1 Method and composition for etching of Al-Cu layers to form electronic circuits |
| 06/30/1999 | EP0926265A1 Method and compositions for producing copper surfaces for improved bonding and articles made therefrom |
| 06/30/1999 | EP0926264A2 Displacement tin bath |
| 06/30/1999 | EP0926263A2 Method for the manufacture of multilayer printed circuit boards |
| 06/30/1999 | EP0925622A1 Miniature filament lamp |
| 06/30/1999 | EP0925562A1 Electronic article surveillance protection for printed circuit boards |
| 06/30/1999 | EP0925185A1 Method of transferring metal leaf to a substrate |
| 06/30/1999 | EP0925175A1 Maleimide containing formulations and uses therefor |
| 06/30/1999 | CN2327146Y Integrated block printed circuit board of electronic and electric appliance |
| 06/30/1999 | CN1221552A Screen printing method and screen printing apparatus |
| 06/30/1999 | CN1221551A Multi-layer circuit having via matrix interlayer connection and method for fabricating the same |
| 06/30/1999 | CN1221517A Bidirectional non-solid impedance controlled reference plane |
| 06/30/1999 | CN1221313A Method for manufacture a certain equipment containing a printed-circuit board |
| 06/30/1999 | CN1221311A Multi-layer circuit board including reactance element and method of trimming reactance element |
| 06/30/1999 | CN1221310A Tape automated bonding film |
| 06/30/1999 | CN1221309A Terminal electrode for circuit substrate on which chip pachage mounted and method for manufacturing the same |
| 06/30/1999 | CN1221129A Photosensitive resin composition and photosensitive element using resin composition |
| 06/30/1999 | CN1043946C 网版印刷装置 A screen printing device |
| 06/29/1999 | US5918168 Double super tuner |
| 06/29/1999 | US5918153 High density electronic circuit and process for making |
| 06/29/1999 | US5918113 Process for producing a semiconductor device using anisotropic conductive adhesive |
| 06/29/1999 | US5917709 Multiple circuit board assembly having an interconnect mechanism that includes a flex connector |
| 06/29/1999 | US5917707 Flexible contact structure with an electrically conductive shell |
| 06/29/1999 | US5917706 Chip card micromodule as a surface-mount device |
| 06/29/1999 | US5917704 Laser-solderable electronic component |
| 06/29/1999 | US5917386 Printed circuit transformer hybrids for RF mixers |
| 06/29/1999 | US5917246 Semiconductor package with pocket for sealing material |
| 06/29/1999 | US5917245 Semiconductor device with brazing mount |
| 06/29/1999 | US5917244 Integrated circuit inductor structure formed employing copper containing conductor winding layer clad with nickel containing conductor layer |
| 06/29/1999 | US5917229 Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect |
| 06/29/1999 | US5917157 Multilayer wiring board laminate with enhanced thermal dissipation to dielectric substrate laminate |
| 06/29/1999 | US5917156 Circuit board having electrodes and pre-deposit solder receiver |
| 06/29/1999 | US5917149 Flexible circuit board interconnect with strain relief |
| 06/29/1999 | US5916858 Washing the metal mask before, during and after completing the solder printing with a liquid cleaning compound containing fluorine based surfactant and isopropyl alcohol |
| 06/29/1999 | US5916738 Photosensitive resin composition for sandblast resist |