| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/20/1999 | US5926379 Electronic card assembly by means of solder connections |
| 07/20/1999 | US5926378 Low profile riser card assembly using paired back-to-back peripheral card connectors mounted on universal footprints supporting different bus form factors |
| 07/20/1999 | US5926377 Multilayer printed board |
| 07/20/1999 | US5926376 Printed circuit board card for mounting packages in faces thereof |
| 07/20/1999 | US5926375 Surface mounting structure |
| 07/20/1999 | US5926373 Encapsulated, board-mountable power supply and method of manufacture |
| 07/20/1999 | US5926358 Lead frame capacitor and capacitively-coupled isolator circuit using same |
| 07/20/1999 | US5926233 Receptacle |
| 07/20/1999 | US5926171 Coordinate data input device |
| 07/20/1999 | US5925930 IC contacts with palladium layer and flexible conductive epoxy bumps |
| 07/20/1999 | US5925927 Reinforced thin lead frames and leads |
| 07/20/1999 | US5925502 Method of metallizing a quartz resonator |
| 07/20/1999 | US5925499 Epoxy-containing waterborne photoimageable composition |
| 07/20/1999 | US5925451 Sintered substrate with thermosetting resin impregnated into pores; low dielectric constant |
| 07/20/1999 | US5925445 Printed wiring board |
| 07/20/1999 | US5925443 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
| 07/20/1999 | US5925414 Using nozzle having conformable sealing insert and extended flat surface to contact screen or stencil when forming patterns on substrate, for microelectronic components |
| 07/20/1999 | US5925403 Method of coating a copper film on a ceramic substrate |
| 07/20/1999 | US5925402 Depositing resin powder on substrate, exposing it to laser beam to form fused patterns, removing excess powder, then covering patterns with uniform thickness of removable coating powder, fusing and/or curing second layer |
| 07/20/1999 | US5925298 Method for reworking a multi-layer circuit board using a shape memory alloy material |
| 07/20/1999 | US5925210 Method for manufacturing a composite arrangement |
| 07/20/1999 | US5925206 Practical method to make blind vias in circuit boards and other substrates |
| 07/20/1999 | US5925187 Apparatus for dispensing flowable material |
| 07/20/1999 | US5925174 Composition and process for treating the surface of copper-containing metals |
| 07/20/1999 | US5924912 Photosensitive resin composition for sandblast resist |
| 07/20/1999 | US5924899 Modular connectors |
| 07/20/1999 | US5924875 Cryogenic flex cable connector |
| 07/20/1999 | US5924873 Flexible circuit board interconnect with strain relief |
| 07/20/1999 | US5924623 Diffusion patterned C4 bump pads |
| 07/20/1999 | US5924622 Method and apparatus for soldering ball grid array modules to substrates |
| 07/20/1999 | US5924431 Electronic component cleaning apparatus |
| 07/20/1999 | US5924193 Method of making mandrels and circuits therefrom |
| 07/20/1999 | US5924191 Forming metal layer, attaching to ceramic surface, forming slit in ceramic layer down to metal layer, bending metal layer near split to form contactors which attach to other ceramic layers |
| 07/20/1999 | CA2075526C Conveyorized vacuum applicator and method therefor |
| 07/15/1999 | WO1999035725A1 An improved connector scheme for a power pod power delivery system |
| 07/15/1999 | WO1999035712A2 Electric connector |
| 07/15/1999 | WO1999035689A1 Semiconductor package converter module |
| 07/15/1999 | WO1999035686A1 A vertical connector based packaging solution for integrated circuits |
| 07/15/1999 | WO1999035547A2 Power contact for testing a power source |
| 07/15/1999 | WO1999034970A1 Ceramic composites with improved interfacial properties and methods to make such composites |
| 07/15/1999 | WO1999025165A3 Modular and multifunctional structure |
| 07/15/1999 | WO1999017317A8 Microelectronic component carrier and method of its manufacture |
| 07/15/1999 | DE19900599A1 Procedure for soldering reflow or fusing side of workpiece |
| 07/15/1999 | DE19900175A1 Wire harness system for motor vehicle wiring |
| 07/15/1999 | DE19800707A1 Elektrische Steckverbindung Electrical plug connection |
| 07/15/1999 | DE19800691A1 Material for making multilayer circuit boards |
| 07/15/1999 | DE19753148A1 Metal-ceramic substrate for electrical circuit |
| 07/14/1999 | EP0929208A2 A flexible chemically-milled circuit assembly with multiple conductor layers and method of making same |
| 07/14/1999 | EP0929207A2 Multi-layer ceramic substrate and method for producing the same |
| 07/14/1999 | EP0929123A1 Heavy-current flowing circuit substrate, a method for producing the heavy-current flowing circuit substrate, and an assembled unit of a heavy-current flowing circuit substrate and a printed circuit substrate |
| 07/14/1999 | EP0929087A2 Ceramic capacitor |
| 07/14/1999 | EP0929083A1 Resistor and its manufacturing method |
| 07/14/1999 | EP0929081A2 High temperature oven electrical feed through |
| 07/14/1999 | EP0928685A2 Printing and PCB members and methods for producing same |
| 07/14/1999 | EP0799487B1 Electric component, in particular a coil, preferably for an smd assembly technique |
| 07/14/1999 | EP0756540B1 Composite article and method for making same |
| 07/14/1999 | CN1223013A Process for manufacturing semiconductor device and semiconductor component |
| 07/14/1999 | CN1222825A Integrated manufacturing packaging process |
| 07/14/1999 | CN1222821A Integral holder-connector for capacitor microphone |
| 07/14/1999 | CN1222686A Flexible printed board |
| 07/14/1999 | CN1044163C Leading-out terminal electric units for surface fastening |
| 07/13/1999 | US5924003 Method of manufacturing ball grid arrays for improved testability |
| 07/13/1999 | US5923620 Module structure and electronic device |
| 07/13/1999 | US5923539 Multilayer circuit substrate with circuit repairing function, and electronic circuit device |
| 07/13/1999 | US5923536 End-wall frame for led alphanumeric display |
| 07/13/1999 | US5923535 Electronic device assembly |
| 07/13/1999 | US5923519 Surge protection device |
| 07/13/1999 | US5923501 Carriage structure for disk device |
| 07/13/1999 | US5923232 Electrical apparatus for use at high altitudes |
| 07/13/1999 | US5922991 Arrangement for mounting a wiring harness on a support plate |
| 07/13/1999 | US5922989 Electronic part and method for inhibiting intrusion of soldering flux |
| 07/13/1999 | US5922517 Catalytic seed material is either trapped between two layers of a photoimageable film, so that it is unavailable during plating or deposited on the surface of an aqueous photoimageable film which is removed prior to plating |
| 07/13/1999 | US5922514 Thick film low value high frequency inductor, and method of making the same |
| 07/13/1999 | US5922509 Photoimageable compositions having improved stripping properties in aqueous alkaline solutions |
| 07/13/1999 | US5922466 Composite comprising a metal substrate and a corrosion protecting layer |
| 07/13/1999 | US5922414 Process for plating |
| 07/13/1999 | US5922403 Adding encapsulant to highly dispersed colloidal suspension of solid particles to encapsulate individual particles; agglomerating; isolating encapsulated particles by separation from solvent layer |
| 07/13/1999 | US5922397 Metal-plating of cured and sintered transient liquid phase sintering pastes |
| 07/13/1999 | US5922245 A mixture comprising an electrically conductive metal powder and a calcined material capable of forming a crystal phase during sintering, a calcined material of kaolin and an alkaline metal or alkaline earth metal carbonate |
| 07/13/1999 | US5922168 Apparatus for making laminated electrical and electronic devices |
| 07/13/1999 | US5922029 Surface for use on an implantable device and method of production therefor |
| 07/13/1999 | US5921820 Passive component |
| 07/13/1999 | US5921818 Low crosstalk electrical connector |
| 07/13/1999 | US5921812 System for mounting two connectors on two sides of board |
| 07/13/1999 | US5921789 Connector for a circuit board |
| 07/13/1999 | US5921462 Ball grid array ball placement method and apparatus |
| 07/13/1999 | US5921460 Method of soldering materials supported on low-melting substrates |
| 07/13/1999 | US5921458 Integrated circuit solder ball implant machine |
| 07/13/1999 | US5920973 Hole forming system with multiple spindles per station |
| 07/13/1999 | CA2108915C A system and method for automatic optical inspection |
| 07/13/1999 | CA2098330C Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels |
| 07/09/1999 | CA2240511A1 Heavy-current flowing circuit substrate, a method for producing the heavy-current flowing circuit substrate, and an assembled unit of a heavy-current flowing circuit substrate anda printed circuit substrate |
| 07/08/1999 | WO1999034659A1 A method of shielding a printed board assembly with at least one component and a shielding element for shielding components on such a printed board assembly |
| 07/08/1999 | WO1999034657A2 Hybrid circuit with a heat dissipation system |
| 07/08/1999 | WO1999034656A1 Molded electronic package, method of preparation and method of shielding |
| 07/08/1999 | WO1999034655A1 Multilayer printed wiring board |
| 07/08/1999 | WO1999034654A1 Multilayer printed wiring board |
| 07/08/1999 | WO1999034494A1 Electric connection box |
| 07/08/1999 | WO1999034435A1 Circuit board, manufacture thereof, and electronic device using circuit board |
| 07/08/1999 | WO1999034373A1 Cable and method of manufacturing it |