| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/29/1999 | WO1999038176A1 Ink for electronic component, method for producing electronic component by using the ink for electronic component, and ink-jet device |
| 07/29/1999 | WO1999037704A1 Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate |
| 07/29/1999 | WO1999003128A3 Singulation system for chip-scale packages |
| 07/29/1999 | DE19827521C1 Aluminum wire bonded to a substrate having a bondable metallic coating |
| 07/29/1999 | DE19802755A1 Treatment apparatus especially for electronic circuit board treatment including a hot photoresist stripping step |
| 07/29/1999 | DE19802272A1 Two-layer coating equipment producing circuit boards |
| 07/29/1999 | CA2318187A1 Rotative cutting method and device for printed circuit boards and electric conductors |
| 07/29/1999 | CA2317401A1 Process for producing a plastic object containing an electronic component |
| 07/28/1999 | EP0932328A1 Substrate for mounting electronic part and process for manufacturing the same |
| 07/28/1999 | EP0932221A2 Terminal pins mounted in flexible substrates |
| 07/28/1999 | EP0932193A2 Method of forming bump electrodes |
| 07/28/1999 | EP0932178A2 High frequency switching device |
| 07/28/1999 | EP0931621A2 Soldering process and paste to be used in this process |
| 07/28/1999 | EP0931617A1 Hollow contact for solder connection |
| 07/28/1999 | EP0931439A1 Method for building at least two wiring levels on electrically insulated supports |
| 07/28/1999 | EP0931367A1 Electrical connector assembly |
| 07/28/1999 | EP0931366A1 Low profile connector |
| 07/28/1999 | EP0930974A1 Inverted stamping process |
| 07/28/1999 | EP0895665A4 Thin film electric motors and method of manufacture |
| 07/28/1999 | EP0833716B1 Gas knife cooling system |
| 07/28/1999 | EP0830642B1 Film-stripping process |
| 07/28/1999 | EP0536418B1 Method of manufacturing a semiconductor device terminal structure |
| 07/28/1999 | CN1224568A Apparatus for mfg. adhesive layer, apparatus for mfg. double-sided substrate, and apparatus for mfg. multi-layered substrate |
| 07/28/1999 | CN1224567A Resin-carrying metal foil for multilayered wiring board, process for mfg. same, multilayered wiring board, and electronic device |
| 07/28/1999 | CN1224566A Method for making printed circuits and resulting printed circuit |
| 07/28/1999 | CN1224565A Thick-film conductor circuit and production method therefor |
| 07/28/1999 | CN1224532A Interelectrode connecting structure, interelectrode connecting method, semiconductor device, semiconductor mounting method, liquid crystal display, and electronic equipment |
| 07/28/1999 | CN1224327A Adhesion enhancement for metal foil |
| 07/28/1999 | CN1224326A Conductive formation and electronic equipment using such conductive formation |
| 07/27/1999 | US5930676 Multilayered interconnection substrate and process for fabricating the same |
| 07/27/1999 | US5930665 Wide frequency band transition between via RF transmission lines and planar transmission lines |
| 07/27/1999 | US5930603 Method for producing a semiconductor device |
| 07/27/1999 | US5930601 From a heat dissipating circuit |
| 07/27/1999 | US5930600 Diode-laser module with a bonded component and method for bonding same |
| 07/27/1999 | US5930598 Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same |
| 07/27/1999 | US5930382 Wiring pattern inspecting method and system for carrying out the same |
| 07/27/1999 | US5930119 Backplane having reduced LC product |
| 07/27/1999 | US5929746 Surface mounted thin film voltage divider |
| 07/27/1999 | US5929743 Mounting structure for thermistor with positive resistance-to-temperature characteristic |
| 07/27/1999 | US5929735 Apparatus for facilitating mounting of an inductor assembly to a printed circuit board |
| 07/27/1999 | US5929627 Surface mount polarized electrical components on a printed circuit board and method thereof |
| 07/27/1999 | US5929522 Semiconductor non-laminate package and method |
| 07/27/1999 | US5929521 Projected contact structure for bumped semiconductor device and resulting articles and assemblies |
| 07/27/1999 | US5929518 Circuit board and method |
| 07/27/1999 | US5929516 Polymer stud grid array |
| 07/27/1999 | US5929375 EMI protection and CTE control of three-dimensional circuitized substrates |
| 07/27/1999 | US5929141 Consists of a flexible polyepoxide resin, stoichiometric amount of amine-terminated acrylonitrile-butadiene copolymer as curing agent, electroconductive noble metal filler; high impact strength, elongation, resilience and adhesion |
| 07/27/1999 | US5928970 Dustfree prepreg and method for making an article based thereon |
| 07/27/1999 | US5928839 Coating metal layers with layers of curable photoimageable composition, polymerizable acrylate monomer, oligomer formed by reaction of an epoxy resin and acrylic or methacrylic acid, photosensitive initiator, epoxy resin, curing agent, curing |
| 07/27/1999 | US5928838 Process for manufacturing a printed circuit board using a mask with gradual increase in transmittance from opaque to transparent region |
| 07/27/1999 | US5928818 Photoresist compositions |
| 07/27/1999 | US5928791 Low dielectric constant material with improved dielectric strength |
| 07/27/1999 | US5928790 Multilayer circuit boards and processes of making the same |
| 07/27/1999 | US5928769 Aluminum nitride wiring substrate and method for production thereof |
| 07/27/1999 | US5928767 Conductive film composite |
| 07/27/1999 | US5928757 Polyimide |
| 07/27/1999 | US5928727 Etching a surface of said article with an etching solution comprising trivalent chromium ions, hexavalent chromium ions and chromic acid-sulfuric acid, catalyzing surface with noble metal salt solution, electrolessly depositing metal layer |
| 07/27/1999 | US5928567 Solvent free liquid conductive material for printed circuit boards |
| 07/27/1999 | US5928529 Composition and method for stripping tin and tin-lead from copper surfaces |
| 07/27/1999 | US5928527 Surface modification using an atmospheric pressure glow discharge plasma source |
| 07/27/1999 | US5928526 Method for manufacturing a substrate having an irregular shape |
| 07/27/1999 | US5928440 Method of forming solder film |
| 07/27/1999 | US5928434 Directing carbon dioxide particles at surface, spraying steam toward surface to be cleaned, cooling of steam by carbon dioxide particles results in thin film of water on surface for conducting electrostatic charges away from surface |
| 07/27/1999 | US5928432 Washing in turbulent, solvent bath of isopropyl myristate and dipropylene-1,2-glycol butyl ether and then perfluoro(iso)butyl methyl ether; low ozone depletion potential; air pollution control |
| 07/27/1999 | US5928404 Comprising primary metal powder of tin, lead, silver alloy, additive powder of bismuth and flux, the additive not melting at soldering temperature |
| 07/27/1999 | US5928030 Bridging clip for wire wrapped terminals |
| 07/27/1999 | US5928005 Self-assembled low-insertion force connector assembly |
| 07/27/1999 | US5927588 Constant-heat type heating device and soldering method and soldering apparatus with heating device |
| 07/27/1999 | US5927193 Process for via fill |
| 07/27/1999 | US5926951 Method of stacking electronic components |
| 07/27/1999 | CA2109462C Method of forming solder film |
| 07/22/1999 | WO1999037008A1 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 07/22/1999 | WO1999036962A1 Semiconductor component with several substrate layers and at least one semiconductor chip and method for producing a semiconductor component |
| 07/22/1999 | WO1999036958A1 Semiconductor device and method of production thereof and semiconductor mounting structure and method |
| 07/22/1999 | WO1999036598A1 Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product |
| 07/22/1999 | WO1999036484A1 Curable epoxy-based compositions |
| 07/22/1999 | WO1999036483A1 Circuit protection film |
| 07/22/1999 | WO1999036454A1 Modified polyimide resin and thermosetting resin composition containing the same |
| 07/22/1999 | WO1999036259A1 Direct write imaging medium |
| 07/22/1999 | DE19902125A1 Thick film circuit board useful as an IC substrate installed in an automobile engine compartment |
| 07/22/1999 | DE19901980A1 Display module arrangement on circuit board, e.g. for motor vehicle dashboard |
| 07/22/1999 | DE19842800A1 Surface mountable casing for high frequency integrated circuits |
| 07/22/1999 | DE19801312A1 Semiconductor element with semiconductor chip for multi-chip module |
| 07/22/1999 | CA2318167A1 Curable epoxy-based compositions |
| 07/21/1999 | EP0930812A2 Surface mount holding feature |
| 07/21/1999 | EP0930811A1 Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same |
| 07/21/1999 | EP0930641A2 Pattern formation method and substrate manufacturing apparatus |
| 07/21/1999 | EP0929999A2 A protective device for shielding an electrical apparatus against environmental conditions |
| 07/21/1999 | EP0929998A1 Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid |
| 07/21/1999 | EP0929428A1 Valve control device with tridimensional printed board in mid technology |
| 07/21/1999 | EP0764148B1 Process for preparing biscyanoacrylates |
| 07/21/1999 | CN2330143Y Cantilever soldering machine |
| 07/21/1999 | CN1223727A Photopolymerizable thermosetting resin composition |
| 07/21/1999 | CN1223543A Vias and method for making the same in organic board and chip carriers |
| 07/21/1999 | CN1223542A Fabrication process for hybrid circuit |
| 07/21/1999 | CN1223541A Printed circuit boards for mounting semiconductor integrated circuit die |
| 07/21/1999 | CN1223482A Board-to-board electrical connector |
| 07/21/1999 | CN1044265C Cleaning agent comprising plural components and cleaning method using the same |
| 07/20/1999 | US5926731 Method for controlling solder bump shape and stand-off height |
| 07/20/1999 | US5926696 Ball grid array plastic package |