Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/1999
08/11/1999EP0906666A4 Printed circuit board having integrated broadside microwave coupler
08/11/1999EP0797690B1 Printed circuit board manufacture
08/11/1999CN2333142Y Inlet and outlet delivery device of soldering tin machine
08/11/1999CN1225790A Electronic parts module and electric equipment
08/11/1999CN1225752A Latticework with plurality of overlying lines
08/11/1999CN1225724A Wafer-level burn-in and test
08/10/1999US5937321 Method for manufacturing ceramic multilayer circuit
08/10/1999US5937269 Graphics assisted manufacturing process for thin-film devices
08/10/1999US5936983 Frequency tripled laser
08/10/1999US5936850 Circuit board connection structure and method, and liquid crystal device including the connection structure
08/10/1999US5936849 Text fixture retainer for an integrated circuit package
08/10/1999US5936848 Printed circuit board
08/10/1999US5936847 Low profile electronic circuit modules
08/10/1999US5936846 Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips
08/10/1999US5936843 Printed wiring board with mounted circuit element using a terminal density conversion board
08/10/1999US5936818 Interior trim panel and electrical harness apparatus for an automotive vehicle
08/10/1999US5936627 Method and system for performing perspective divide operations on three-dimensional graphical object data within a computer system
08/10/1999US5936593 Antenna apparatus having a spiral conductor and a coating layer
08/10/1999US5936309 Mounted structure of printed circuit board in semiconductor package
08/10/1999US5936302 Speaker diaphragm
08/10/1999US5936048 Method for preparing modified resins and their applications
08/10/1999US5935761 Photosensitive resin composition
08/10/1999US5935687 Three dimensional package and architecture for high performance computer
08/10/1999US5935652 Method for reducing seed deposition in electroless plating
08/10/1999US5935640 Immersing surface in silver plating solution having imidazole derivative; soldering directly upon the silver plate; in fabricating printed circuit boards
08/10/1999US5935462 Repair of metal lines by electrostatically assisted laser ablative deposition
08/10/1999US5935452 Resin composition and its use in production of multilayer printed circuit board
08/10/1999US5935406 Classifying the starting metal particles into different narrow diameter size range fractions, and separately electroplating each different smaller size range with a metal or metal alloy to form a desired final diameter
08/10/1999US5935405 Conductor tracks interconnected during metallization by coating a support with electroconductive poly-3,4-ethylene-dioxythiophene, applying a photoresist, metallizing, resist removal, converting the thiophene polymer to nonconductive
08/10/1999US5935365 Manufacturing method and manufacturing apparatus for ceramic electronic components
08/10/1999US5935331 Apparatus and method for forming films
08/10/1999US5935294 Method of manufacturing and transferring metallic droplets
08/10/1999US5934936 Connector having adjustable solder tab
08/10/1999US5934914 Microelectronic contacts with asperities and methods of making same
08/10/1999US5934545 Ball placement method and apparatus for forming a ball grid array
08/10/1999US5934540 Horizontal soldering system with oil blanket
08/10/1999US5933947 Metallized film process for production thereof
08/10/1999US5933946 Process for providing an electronic module with a cover and terminal pins
08/06/1999CA2261104A1 Photoimageable compositions having hydrophilic binder polymers and hydrophilic monomers
08/05/1999WO1999039555A1 Circuit board
08/05/1999WO1999039382A1 Process for ashing organic materials from substrates
08/05/1999WO1999039021A1 Process for metal plating liquid crystalline polymers and compositions related thereto
08/05/1999WO1999038706A1 Flexible screen suitable for use in screen printing and method of making same
08/05/1999WO1999038623A1 A method of forming a coating onto a non-random monolayer of particles, and products formed thereby
08/05/1999WO1999019900A3 Method of forming an electronic device
08/05/1999WO1999010564A3 Method and device for regulating the concentration of substances in electrolytes
08/05/1999DE19903602A1 Monolithic ceramic substrate is produced especially for an LSI
08/05/1999DE19830038A1 Lösung und Verfahren zum Vorbehandeln von Kupferoberflächen Solution and method for pretreating copper surfaces
08/05/1999DE19830037A1 Verfahren zum Vorbehandeln von Kupferoberflächen A method of pretreating copper surfaces
08/05/1999DE19820358C1 Optoelectronics sensor, esp. for use as a light barrier or light sensor
08/05/1999DE19804170A1 Electrical unit e.g. for electrical connection of ignition (triggering) conductors to airbag ignition pellet
08/05/1999DE19803649A1 Plug-in foot for electronic circuit board mounting component
08/05/1999DE19802580A1 Electric circuit board with panel
08/05/1999CA2319539A1 A method of forming a coating onto a non-random monolayer of particles, and products formed thereby
08/05/1999CA2316868A1 Process for metal plating liquid crystalline polymers and compositions related thereto
08/04/1999EP0933834A2 Fastener for an electrical connector
08/04/1999EP0933816A2 Hybrid module and methods for manufacturing and mounting thereof
08/04/1999EP0933681A1 Positive-tone photoimageable crosslinkable coating
08/04/1999EP0933214A2 A method of and apparatus for directing ink towards substrate
08/04/1999EP0933010A1 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
08/04/1999EP0932941A1 Slotline-mounted flip chip structures
08/04/1999EP0932880A1 Chip card with a contact zone and method of producing such a chip card
08/04/1999EP0932500A1 Method to control cavity dimensions of fired multilayer circuit boards on a support
08/04/1999EP0813618B1 Currentless metallization process for non electroconductive substrates
08/04/1999CN2332143Y Semi-automatic wave welding machine
08/04/1999CN1224989A Process for promoting chemical adhesion of legend inks using ultra-violet light
08/04/1999CN1224912A High frequency switching device
08/04/1999CN1044518C Printed circuit board test fixture and method
08/03/1999US5933710 Method of providing electrical connection between an integrated circuit die and a printed circuit board
08/03/1999US5933327 Wire bond attachment of a integrated circuit package to a heat sink
08/03/1999US5933324 Apparatus for dissipating heat from a conductive layer in a circuit board
08/03/1999US5933307 Printed circuit board sparkgap
08/03/1999US5933218 Laser beam machining apparatus
08/03/1999US5932496 Composite materials
08/03/1999US5932351 Heat resistant resin composition and adhesive sheet using the same
08/03/1999US5932348 Composite with non-segregating reinforcing elements
08/03/1999US5932339 Anisotropically electricity conductive film comprising thermosetting adhesive agent and electrically conductive particles
08/03/1999US5932326 Ceramic wiring boards and method for their manufacture
08/03/1999US5932324 Material for producing electrically conducting connections in thermoplastic moldings
08/03/1999US5932300 Process for the currentless metallization of electrically non-conductive substrates
08/03/1999US5932289 Semiconductor wafers
08/03/1999US5932280 Printed circuit board having printed resistors and method of making printed resistors on a printed circuit board using thermal transfer techniques
08/03/1999US5932081 Method and device for galvanizing plate-shaped products in horizontal continuous plants
08/03/1999US5932065 Universal fixture for supporting and holding populated sides of printed circuit board assemblies during processing
08/03/1999US5932047 Circuitized structure including flexible circuit with elastomeric member bonded thereto and method of making
08/03/1999US5932043 Method for flat firing aluminum nitride/tungsten electronic modules
08/03/1999US5932031 Fluorescent water soluble solder flux
08/03/1999US5932012 Paste applicator having positioning means
08/03/1999US5931721 For removing foreign material from the surface of a substrate
08/03/1999US5931685 Interconnect for making temporary electrical connections with bumped semiconductor components
08/03/1999US5931682 Connector connecting structure
08/03/1999US5931577 Display device and method for making the same
08/03/1999US5931371 Standoff controlled interconnection
08/03/1999US5930890 Structure and fabrication procedure for a stable post
08/03/1999US5930889 Method for mounting packaged integrated circuit devices to printed circuit boards
08/03/1999CA2123070C Printer system for printing circuit patterns or like on base board
07/1999
07/30/1999CA2243727A1 Positive-tone photoimageable crosslinkable coating
07/29/1999WO1999038368A1 Process for producing a plastic object containing an electronic component
07/29/1999WO1999038367A1 Rotative cutting method and device for printed circuit boards and electric conductors
07/29/1999WO1999038232A1 Small contactor for test probes, chip packaging and the like
1 ... 874 875 876 877 878 879 880 881 882 883 884 885 886 887 888 889 890 891 892 893 894 ... 1185