| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 08/24/1999 | US5942965 Multilayer substrate |
| 08/24/1999 | US5942592 Reacting a diamine mixture comprising diaminopolysiloxane, an alicyclic diamine and an aromatic diamine with aromatic tetracarboxylic acid or anhydride and polyimidizing the resulting polyamic acid |
| 08/24/1999 | US5942375 Exposing a photoresist film applied to a surface of a printed wiring board and inner surfaces of through-holes to a light through a mask film and light scattering layer of glass beads; inner surfaces of holes exposed for fine through-holes |
| 08/24/1999 | US5942371 Containing an acrylic polymer |
| 08/24/1999 | US5942315 Component of printed circuit boards |
| 08/24/1999 | US5942314 Welding stainless steel and copper foil |
| 08/24/1999 | US5942185 A solder comprising zinc, bismuth and tin, has a sufficient reliability in mechanical strength even at a high temperature 150 degree. c. ; liquidus temperature at most 195 degree. c. and solidus temperature at least 160 degree. c. |
| 08/24/1999 | US5942083 Manual Electronic-part mounting apparatus |
| 08/24/1999 | US5942078 Apparatus for calibrating surface mounting processes in printed circuit board assembly manufacturing |
| 08/24/1999 | US5941735 Press-fit fuse or component holder |
| 08/24/1999 | US5941449 Method of making an electronic package having spacer elements |
| 08/24/1999 | US5941444 Flux unit for applying flux to precise areas of printed circuit boards |
| 08/24/1999 | US5941171 Stencil holder |
| 08/24/1999 | US5940967 Method for inserting an electrical contact pin with a compliant attachment zone into a hole in printed circuit board with controlled insertion length after a significant rise in insertion force is detected |
| 08/24/1999 | US5940966 Method of making an electronic interconnect device |
| 08/24/1999 | US5940964 Fabrication process for circuit substrate having interconnection leads |
| 08/24/1999 | CA2120393C Method for making membrane switch |
| 08/24/1999 | CA2060185C Rotation lock and wipe connector |
| 08/20/1999 | WO1999042402A1 Composition and method for reducing copper oxide to metallic copper |
| 08/19/1999 | WO1999041957A1 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 08/19/1999 | WO1999041812A1 Ic socket |
| 08/19/1999 | WO1999041784A1 Method and apparatus for coupling circuit components |
| 08/19/1999 | WO1999041781A1 Base sheet for semiconductor module, method for manufacturing base sheet for semiconductor module, and semiconductor module |
| 08/19/1999 | WO1999041642A1 Positive acting photodielectric composition |
| 08/19/1999 | WO1999041433A1 Electrolyte and tin-silver electroplating process |
| 08/19/1999 | WO1999041036A1 Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same |
| 08/19/1999 | WO1999041019A1 Individual, embedded capacitors for laminated printed circuit boards |
| 08/19/1999 | WO1999010568A3 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated |
| 08/19/1999 | DE19839118A1 Construction arrangement for mounting component on printed circuit board |
| 08/19/1999 | CA2320852A1 Positive acting photodielectric composition |
| 08/18/1999 | EP0936652A1 Film formation method, method for fabricating electron emitting element employing the same film, and method for manufacturing image forming apparatus employing the same element |
| 08/18/1999 | EP0936639A2 Process for forming device comprising metallized magnetic substrates |
| 08/18/1999 | EP0936506A2 Dry process for the development and stripping of photoresists |
| 08/18/1999 | EP0936286A1 Selectively demetallizing aluminum |
| 08/18/1999 | EP0936268A2 Cleaning solution for electromaterials and method for using the same |
| 08/18/1999 | EP0936018A2 Parts soldering apparatus and method |
| 08/18/1999 | EP0935913A1 Heater in a conveyor system |
| 08/18/1999 | EP0935532A1 Process and apparatus for the deposition of a viscous product on a substrate via a stencil |
| 08/18/1999 | EP0935526A1 Metal ceramic composites with improved interfacial properties |
| 08/18/1999 | EP0823193B1 Arrangement for the manufacture of multilayers |
| 08/18/1999 | CN2334140Y Push-pull circuit board feeder |
| 08/18/1999 | CN1226200A Manufacture of laminated film and printed wiring board |
| 08/18/1999 | CN1226129A Electronic circuit apparatus and method for assembling the same |
| 08/18/1999 | CN1226067A Resistor and its manufacturing method |
| 08/18/1999 | CN1044763C Method and apparatus for removing film |
| 08/18/1999 | CN1044762C Printed circuit board and method of manufacturing the same |
| 08/17/1999 | US5940787 Apparatuses and methods of monitoring the condition of tools and workpieces |
| 08/17/1999 | US5940729 Method of planarizing a curved substrate and resulting structure |
| 08/17/1999 | US5940728 Process for manufacturing electronic circuits |
| 08/17/1999 | US5940727 Technique for producing interconnecting conductive links |
| 08/17/1999 | US5940686 Method for manufacturing multi-chip modules utilizing direct lead attach |
| 08/17/1999 | US5940278 Backing plate for gate arrays or the like carries auxiliary components and provides probe access to electrical test points |
| 08/17/1999 | US5939969 Preformed thermal fuse |
| 08/17/1999 | US5939789 Multilayer substrates methods for manufacturing multilayer substrates and electronic devices |
| 08/17/1999 | US5939786 Palladium dendrites are electrodeposited on circuitry |
| 08/17/1999 | US5939465 Photopolymerizable composition |
| 08/17/1999 | US5939371 Terpene, amine, hydrocarbon solvent, glycol ether and polyoxyethylene glycol |
| 08/17/1999 | US5939238 High photospeed due to n-phenylglycine |
| 08/17/1999 | US5939197 Sol-gel coated metal |
| 08/17/1999 | US5939150 Metallizing patterns on semiconductors and printed circuits; exposure to radiation beam |
| 08/17/1999 | US5939010 Laser machining method |
| 08/17/1999 | US5938871 Method and apparatus for application of adhesive |
| 08/17/1999 | US5938856 Process of removing flux residue from microelectronic components |
| 08/17/1999 | US5938848 Method and control system for applying solder flux to a printed circuit |
| 08/17/1999 | US5938455 Three-dimensional molded circuit board having interlocking connections |
| 08/17/1999 | US5938452 Flexible interface structures for electronic devices |
| 08/17/1999 | US5938106 Method and apparatus for applying solder and forming solder balls on a substrate |
| 08/17/1999 | US5938104 Direct metal bonding |
| 08/17/1999 | US5938102 High speed jet soldering system |
| 08/17/1999 | US5937758 Micro-contact printing stamp |
| 08/17/1999 | US5937540 Electrothermal drying device |
| 08/17/1999 | US5937514 Method of making a heat-resistant system |
| 08/17/1999 | US5937512 Method of forming a circuit board |
| 08/17/1999 | US5937494 Method for assembling an ink-jet pen having a double-sided electrical interconnect flexible circuit |
| 08/17/1999 | CA2156795C An electronic device assembly and a manufacturing method of the same |
| 08/17/1999 | CA2090349C Composition and method for stripping tin or tin-lead alloy from copper surfaces |
| 08/12/1999 | WO1999040765A1 Process for the preliminary treatment of copper surfaces |
| 08/12/1999 | WO1999040764A1 Process and solution for the preliminary treatment of copper surfaces |
| 08/12/1999 | WO1999040762A1 Printed board |
| 08/12/1999 | WO1999040761A1 Components with releasable leads |
| 08/12/1999 | WO1999040760A1 Thin film transferable electric components |
| 08/12/1999 | WO1999040620A1 Improved method and apparatus for adhering and centering particles to the tacky areas on a surface containing an array of tacky and non-tacky areas |
| 08/12/1999 | WO1999040150A1 Adhesive composition and precursor thereof |
| 08/12/1999 | WO1999029931A3 Clamp-like holding device for immersion plating |
| 08/12/1999 | DE19910412A1 Computer image alignment method for exposure of photoresist during circuit board manufacture |
| 08/12/1999 | DE19905064A1 Connection mechanism for flexible printed circuits |
| 08/12/1999 | DE19804757A1 Method of forming a flat mounting surface on at least one side of electrical component, especially SMD component |
| 08/12/1999 | CA2318862A1 Process to pretreat copper surfaces |
| 08/12/1999 | CA2318784A1 Solution and process to pretreat copper surfaces |
| 08/11/1999 | EP0935407A1 Method for producing multi-layer printed wiring boards having blind vias |
| 08/11/1999 | EP0935289A2 Substrate marking process |
| 08/11/1999 | EP0935288A2 Sealed structure of semiconductor circuit and method for production thereof |
| 08/11/1999 | EP0935286A1 Copper circuit junction substrate and method of producing the same |
| 08/11/1999 | EP0935171A1 Photoimageable compositions having hydrophilic binder polymers and hydrophilic monomers |
| 08/11/1999 | EP0935135A1 System for measuring solder bumps |
| 08/11/1999 | EP0934977A1 Method for improving the adhesion of metal films to polyphenylene ether resins |
| 08/11/1999 | EP0934910A2 Borate glass based ceramic tape |
| 08/11/1999 | EP0934687A1 Assembly consisting of a substrate for power components and a cooling element and method for the production thereof |
| 08/11/1999 | EP0934685A1 Printed circuit board with a leaded component and method of securing the component |
| 08/11/1999 | EP0934614A1 Vehicle power distribution box |