| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 11/25/1999 | WO1999060315A1 Holder for use in refrigeration appliance and method for the production of such a holder |
| 11/25/1999 | WO1999060189A2 Method for metal coating of substrates |
| 11/25/1999 | WO1999060188A2 Method for electro copperplating substrates |
| 11/25/1999 | WO1999060183A1 Anti-adherent coating and method for the production thereof |
| 11/25/1999 | WO1999060070A1 Adhesive and circuit material using the adhesive |
| 11/25/1999 | WO1999059761A1 Laser machining method |
| 11/25/1999 | WO1999059693A1 Apparatus and method for recovering photoresist developers and strippers |
| 11/25/1999 | DE19918193A1 Producing a multicolor organic light emitting device incorporating light-emitting polymers |
| 11/25/1999 | DE19823447A1 Filling sub-mm cavities in circuit board coating with solder |
| 11/25/1999 | DE19822990A1 Two part molded socket-type electrical connector |
| 11/25/1999 | DE19822345A1 Circuit board connection with hybrid device |
| 11/25/1999 | DE19820704A1 Electric distance regulating device fitted to front of motor vehicles |
| 11/25/1999 | DE19820345A1 Solid solder deposition on circuit boards |
| 11/25/1999 | DE19814156C1 Module for SMD assembly |
| 11/25/1999 | DE19750324C2 Schichtweise ausgebildetes elektronisches Bauelement Layer by layer formed electronic component |
| 11/25/1999 | CA2332891A1 Multiple blank for electronic components, in particular surface acoustic wave components, and method of building up bumps, solder frames, spacers and the like on the multiple blank |
| 11/25/1999 | CA2332245A1 Apparatus and method for recovering photoresist developers and strippers |
| 11/25/1999 | CA2331757A1 Process for coating substrates with metals |
| 11/25/1999 | CA2331750A1 Method for electro copperplating substrates |
| 11/24/1999 | EP0959650A1 Overmolded electronic assembly |
| 11/24/1999 | EP0959649A1 Temperature measuring type outside connecting mechanism for printed wiring board |
| 11/24/1999 | EP0959648A1 Printed wiring board and manufacturing method therefor |
| 11/24/1999 | EP0959153A2 An electroplating machine |
| 11/24/1999 | EP0959056A1 Method for controlling firing shrinkage of ceramic green body |
| 11/24/1999 | EP0958882A2 Method for forming through holes |
| 11/24/1999 | EP0958718A1 Process and apparatus for the coating of boards |
| 11/24/1999 | EP0958621A1 Component holder for a hall sensor and process for producing a component holder |
| 11/24/1999 | EP0958607A1 Transferred flexible integrated circuit |
| 11/24/1999 | EP0958603A1 Vibrating template method of placing solder balls on the i/o pads of an integrated circuit package |
| 11/24/1999 | EP0819267B1 Coating compositions |
| 11/24/1999 | EP0809862B1 Organic chip carriers for wire bond-type chips |
| 11/24/1999 | EP0579610B1 Demetallizing apparatus |
| 11/24/1999 | CN1236484A Method for forming bump and semiconductor device |
| 11/24/1999 | CN1236290A Circuit board |
| 11/24/1999 | CN1236219A Method of forming groove in surface of mother substrate |
| 11/24/1999 | CN1236203A Electronic part and method of manufacturing the same |
| 11/24/1999 | CN1236185A Integrated circuit test socket |
| 11/24/1999 | CN1236115A Photosensitive ink inhibitor composition |
| 11/24/1999 | CN1236026A Electroplating machine |
| 11/24/1999 | CN1235879A Fluid delivery apparatus and method |
| 11/23/1999 | US5991435 Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component |
| 11/23/1999 | US5991164 Electronic device with connecting/disconnecting screw |
| 11/23/1999 | US5991162 High-frequency integrated circuit device and manufacture method thereof |
| 11/23/1999 | US5991161 Multi-chip land grid array carrier |
| 11/23/1999 | US5991156 Ball grid array integrated circuit package with high thermal conductivity |
| 11/23/1999 | US5991154 Attachment of electronic device packages to heat sinks |
| 11/23/1999 | US5991097 Lens barrel having a linear guide mechanism |
| 11/23/1999 | US5990752 Method for mechanically tuning a voltage controlled oscillator |
| 11/23/1999 | US5990736 High frequency amplifier with a guard circuit and a radio wave transmission apparatus including the same |
| 11/23/1999 | US5990696 Test fixture with self contained shorting means for testing small scale test packs |
| 11/23/1999 | US5990550 Integrated circuit device cooling structure |
| 11/23/1999 | US5990547 Semiconductor device having plated contacts and method thereof |
| 11/23/1999 | US5990505 Solid-state image pickup device |
| 11/23/1999 | US5990421 Built in board resistors |
| 11/23/1999 | US5990189 Unsaturated material comprising the reaction product of a polyepoxide, an unstaturated carboxylic acid, a saturated acid and an anhydride; production of a solder photoresist for the manufacture of a printed circuit board; quick-setting |
| 11/23/1999 | US5990028 Dielectric paste |
| 11/23/1999 | US5989994 Method for producing contact structures |
| 11/23/1999 | US5989937 Method for compensating for bottom warpage of a BGA integrated circuit |
| 11/23/1999 | US5989936 Microelectronic assembly fabrication with terminal formation from a conductive layer |
| 11/23/1999 | US5989935 Column grid array for semiconductor packaging and method |
| 11/23/1999 | US5989787 Solution comprises a mixture of lactate, palladium and alkaline medium; allows deposition of palladium catalyst in a short time radiation exposure and removing unwanted photosensitive film more effectively by water |
| 11/23/1999 | US5989783 Method of customizing integrated circuits by depositing two resist layers to selectively pattern layer interconnect material |
| 11/23/1999 | US5989777 Improved mechanical properties; comprising a transparent support, a thin metallic recording layer, an adhesive layer, a polymeric resin layer and a top layer of roughening agent in specific amount |
| 11/23/1999 | US5989772 Thermal recording element's dye layer contains polymethine or cyanine stabilizing dye having an absorption wavelength maximum longer than the infrared laser light-absorbing dye, so the energy absorbed is transferred to stabilizing ir dye |
| 11/23/1999 | US5989727 Electrolytic copper foil having a modified shiny side |
| 11/23/1999 | US5989653 Process for metallization of a substrate by irradiative curing of a catalyst applied thereto |
| 11/23/1999 | US5989449 Composition and method for stripping tin and tin-lead from copper surfaces |
| 11/23/1999 | US5989443 Etching nickel/iron alloy of printed circuit structure without etching underlying copper layer using aqueous solution of ferric ammonium sulfate and sulfuric or phosphoric acid |
| 11/23/1999 | US5989377 Method of protecting the surface of foil and other thin sheet materials before and during high-temperature and high pressure laminating |
| 11/23/1999 | US5989362 Polymerizable flux composition for encapsulating the solder in situ |
| 11/23/1999 | US5989358 Sheet cleaning apparatus with cartridge roller assembly and method of use |
| 11/23/1999 | US5989085 Tilt and trim control for marine propulsion system |
| 11/23/1999 | US5989061 Low profile backplane jumper board |
| 11/23/1999 | US5988856 Apparatus for real-time estimation of printing medium properties and method for the use thereof |
| 11/23/1999 | US5988487 Captured-cell solder printing and reflow methods |
| 11/23/1999 | US5988480 Continuous mode solder jet apparatus |
| 11/23/1999 | US5988060 Screen printing apparatus |
| 11/23/1999 | US5987744 Method for supporting one or more electronic components |
| 11/23/1999 | US5987743 Automatic wiring device and its wiring method |
| 11/23/1999 | US5987742 Technique for attaching a stiffener to a flexible substrate |
| 11/23/1999 | US5987740 Laser machining of molded assemblies |
| 11/23/1999 | US5987739 Method of making a polymer based circuit |
| 11/23/1999 | US5987736 Printed circuit board fabrication apparatus |
| 11/23/1999 | US5987732 Method of making compact integrated microwave assembly system |
| 11/23/1999 | CA2119050C Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
| 11/23/1999 | CA2099038C Low bridging soldering process |
| 11/18/1999 | WO1999059387A1 A heating method for a printed circuit board and a printed circuit board comprising a heating element |
| 11/18/1999 | WO1999059386A1 Substrate for formation of special pattern, and method of manufacture of substrate |
| 11/18/1999 | WO1999059239A1 Method for mechanically tuning a voltage controlled oscillator |
| 11/18/1999 | WO1999059225A1 Foamed housing for a circuit board |
| 11/18/1999 | WO1999058470A1 Method of manufacturing metal foil/ceramics joining material and metal foil laminated ceramic substrate |
| 11/18/1999 | WO1999058373A1 Electric junction box for an automotive vehicle |
| 11/18/1999 | WO1999058257A1 Apparatus and method for coating a multilayer article |
| 11/18/1999 | WO1999052336B1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| 11/18/1999 | DE19902348A1 Ball raster array device to facilitate of reading input and output signals of integrated circuit mounted on printed circuit board |
| 11/18/1999 | DE19822075A1 Metallization of polymeric substrates for production of circuit boards |
| 11/18/1999 | DE19820724A1 Squeezing roller device for manufacture of flexible circuit inner layers |
| 11/18/1999 | DE19820414A1 Kontaktierungsvorrichtung Contacting |
| 11/17/1999 | EP0957665A2 Electronic device |
| 11/17/1999 | EP0957664A1 Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device |