Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1999
11/02/1999US5976974 Method of forming redundant signal traces and corresponding electronic components
11/02/1999US5976965 Method for arranging minute metallic balls
11/02/1999US5976915 Low mutual inductance lead frame device
11/02/1999US5976912 Fabrication process of semiconductor package and semiconductor package
11/02/1999US5976762 Photosensitive element and process for producing multilayer printed wiring board
11/02/1999US5976703 Material and method for planarization of substrate
11/02/1999US5976699 Insulating adhesive for multilayer printed circuit board
11/02/1999US5976637 Dielectric over metal
11/02/1999US5976629 Applying fluoropolymer as protective coating
11/02/1999US5976393 Method of manufacturing multilayer circuit substrate
11/02/1999US5976391 Manufacturing a multi-layer circuit assembly in a continuous process.
11/02/1999US5976286 Multi-density ceramic structure and process thereof
11/02/1999US5976284 Liquid crystal displays, which contain such a patterned conducting polymer surface.
11/02/1999US5976269 Printing mask cleaning apparatus and method
11/02/1999US5976228 Solution of an alkali metal borohydride and a quaternary ammonium ion; enhances corrosion resistance of copper oxide in printed circuits
11/02/1999US5975944 Connector for pitch spaced electrical cables
11/02/1999US5975922 Device containing directionally conductive composite medium
11/02/1999US5975921 High density connector system
11/02/1999US5975920 Electronic component for surface mounting technology
11/02/1999US5975913 Multilayer interconnection board and connection pin
11/02/1999US5975715 Taillight fixture for motor vehicles with printed circuit boards with connectors and LED's
11/02/1999US5975409 Ceramic ball grid array using in-situ solder stretch
11/02/1999US5975201 Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures
11/02/1999US5975178 Manufacturing method of film carrier tape, manufacturing apparatus of film carrier tape, and film carrier tape
11/02/1999US5974931 Flex die punching apparatus and method
11/02/1999US5974689 Chemical drying and cleaning system
11/02/1999US5974662 Method of planarizing tips of probe elements of a probe card assembly
11/02/1999US5974655 Method of mounting loudspeakers and a loudspeaker mounting
10/1999
10/28/1999WO1999054966A1 Simplified microelectronic connector and method of manufacturing
10/28/1999WO1999054935A1 Portable communication equipment
10/28/1999WO1999054933A1 Semiconductor non-laminate package and method
10/28/1999WO1999054932A1 Leadless array package
10/28/1999WO1999054525A2 Method for producing metallized substrate materials
10/28/1999WO1999045176A3 Electrolytic copper foil having a modified shiny side
10/28/1999DE19918340A1 Electrical terminal clip for connecting film and conductive tracks
10/28/1999DE19831565C1 Connection surface area exposure for antenna embedded in chip card
10/28/1999DE19817388A1 Metallizing a fluoropolymer substrate for forming conductor structures or a plasma etching mask on a circuit substrate
10/28/1999DE19817354A1 Flexible strip conductor
10/28/1999DE19816670A1 Standard printed circuit board and plug, especially power supply unit
10/27/1999EP0952762A1 Printed wiring board and method for manufacturing the same
10/27/1999EP0952761A1 Method for mounting terminal on circuit board and circuit board
10/27/1999EP0952498A1 Direct electrostatic printing process for forming a resist pattern on a conducting surface and use thereof in a fabrication process for printed circuit boards
10/27/1999EP0952155A1 Beta-form tris-(2,3-epoxypropyl)-isocyanurate crystals and process for their production
10/27/1999EP0951807A1 Improvements in or relating to thermal trip arrangements
10/27/1999EP0951739A1 High density electrical connectors
10/27/1999EP0951734A1 Process for selective application of solder
10/27/1999EP0951366A1 Method for making a sonoprobe
10/27/1999CN2346142Y Platen mechanism of warping anti-stetch machine for printed circuit board
10/27/1999CN1233349A Low profile connector
10/27/1999CN1232990A Photoimageable compositions having hydrophilic binder polymers and hydrophilic monomers
10/27/1999CN1232981A Liquid crystal display panel holder
10/27/1999CN1232860A Liquid crystal polymer film and stacked body and its producing method, and laminated installation loop base plate
10/27/1999CN1046078C Multi-layer printed circuit board and it producing method
10/26/1999US5973951 Single in-line memory module
10/26/1999US5973932 Soldered component bonding in a printed circuit assembly
10/26/1999US5973931 Printed wiring board and electronic device using same
10/26/1999US5973930 Mounting structure for one or more semiconductor devices
10/26/1999US5973929 Printed circuit board having an embedded capacitor
10/26/1999US5973927 Mounting structure for an integrated circuit
10/26/1999US5973406 Electronic device bonding method and electronic circuit apparatus
10/26/1999US5973405 Composite electrical contact structure and method for manufacturing the same
10/26/1999US5973394 Small contactor for test probes, chip packaging and the like
10/26/1999US5973393 Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits
10/26/1999US5973391 Interposer with embedded circuitry and method for using the same to package microelectronic units
10/26/1999US5973295 Heated tool positioned in the X,Y, and 2-directions for depositing fine lines on a substrate
10/26/1999US5973290 Laser apparatus having improved via processing rate
10/26/1999US5973283 Tearable membrane switch with resinous bounded silver-palladium alloy contacts
10/26/1999US5973021 Radiation curable fluorinated organosiloxane compositions
10/26/1999US5972807 Photosensitive, heat-resistant resin composition and process for using same to form patterns as well as polymeric composite and production process thereof
10/26/1999US5972780 Thin film forming apparatus and method
10/26/1999US5972734 Interposer for ball grid array (BGA) package
10/26/1999US5972723 Enhanced thin film wiring net repair process
10/26/1999US5972564 Alkali development type photocurable conductive paste composition and plasma display panels having electrodes formed thereof
10/26/1999US5972562 Visible radiation-curable solder resist compositions, and method for forming solder resist patterns
10/26/1999US5972482 Uncured substrate material with closed voids which are disposed with a through-hole. by filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the
10/26/1999US5972246 Electro-conductive composition and electronic equipment using same
10/26/1999US5972152 Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
10/26/1999US5972150 Lamination stabilizer block
10/26/1999US5972053 Capacitor formed within printed circuit board
10/26/1999US5971904 Machine-tool provided with a single high storage capacity tool magazine, and tool magazine intended to be fitted to a machine-tool
10/26/1999US5971806 Electrical connector for connecting conductor areas of a flexible circuit with associated conductor pads of a circuit board
10/26/1999US5971774 Connector for a circuit board
10/26/1999US5971772 Low profile clamping mechanism for connecting a printed circuit board to a flexible printed circuit
10/26/1999US5971771 Component to substrate connection and display assembly using same
10/26/1999US5971680 Automatic printed circuit board two-bevel forming machine
10/26/1999US5971630 Camera with lens barrier apparatus
10/26/1999US5971628 Holder for optoelectronic device having connection pins bent toward a connection means
10/26/1999US5971253 Microelectronic component mounting with deformable shell terminals
10/26/1999US5971251 Method of welding a terminal to a flat flexible cable
10/26/1999US5971249 Method and apparatus for controlling a time/temperature profile inside of a reflow oven
10/26/1999US5971058 Apparatus and method for continuous casting solder onto discrete parts
10/26/1999US5970836 Machine for punching a printed circuit plate
10/26/1999US5970608 Cryogenic flex cable connector
10/26/1999US5970606 Pinstacking process
10/26/1999CA2148544C Conductive coatings
10/21/1999WO1999053738A1 Method and device for producing thin-layer structures
10/21/1999WO1999053737A1 Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards
10/21/1999WO1999053736A1 Pressure-bonded substrate, liquid crystal device, and electronic device
10/21/1999WO1999053735A1 Pressure-bonded substrate, liquid crystal device, and electronic device
10/21/1999WO1999053564A1 Orthogonal transition from coax to stripline for opposite sides of a stripline board
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