Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1999
11/10/1999CN1046398C Electrical interconnect apparatus
11/09/1999US5983089 Slotline-mounted flip chip
11/09/1999US5982927 Methods and apparatuses for in-line solder paste inspection
11/09/1999US5982636 Support arrangement for mechanically securing and electrically connecting electronic components such as LEDs as well as method for electrically connecting components to the support member
11/09/1999US5982635 Signal adaptor board for a pin grid array
11/09/1999US5982632 Short power signal path integrated circuit package
11/09/1999US5982626 Two dimensional coupling for flexible printed circuit boards
11/09/1999US5982623 Module for packaged IC
11/09/1999US5982578 Disk drive housing with recess for circuit panel
11/09/1999US5982468 Liquid crystal display apparatus having dummy lead and dummy land for alignment
11/09/1999US5982249 Reduced crosstalk microstrip transmission-line
11/09/1999US5982186 Contactor for test applications including membrane carrier having contacts for an integrated circuit and pins connecting contacts to test board
11/09/1999US5982033 Semiconductor chip package
11/09/1999US5981979 Radiation-emitting semiconductor component
11/09/1999US5981880 Electronic device packages having glass free non conductive layers
11/09/1999US5981870 Flexible circuit board interconnect with strain relief
11/09/1999US5981315 Transfer molding
11/09/1999US5981311 Process for using a removeable plating bus layer for high density substrates
11/09/1999US5981147 Stable, ionomeric photoresist emulsion and process of preparation and use thereof
11/09/1999US5981103 Assemblies of electronic devices and flexible containers therefor
11/09/1999US5981102 Thin profile battery apparatus, battery powerable apparatus, radio frequency communication device, and method of forming battery powerable apparatus
11/09/1999US5981085 Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
11/09/1999US5981041 Multilayer printed circuit board and process for producing and using the same
11/09/1999US5981036 For electrical or electronic power circuits or modules and which allows improved heat dissipation independent of temperature with simple for problem-free mounting in housing
11/09/1999US5980998 Deposition of substances on a surface
11/09/1999US5980991 Process for heat-treating substrate having film-forming composition thereon
11/09/1999US5980721 Fabrication method for double metallic resist printed circuit boards
11/09/1999US5980679 Patterned metal layer is cut from foil using punch-press at selected pressure; cut patterned metal layer is then attached to substrate using press
11/09/1999US5980636 Electrical connection device for forming metal bump electrical connection
11/09/1999US5980309 Battery connector
11/09/1999US5980307 Strain relief system for holding cables to circuit boards
11/09/1999US5980296 Connecting structure for flat circuit body and connector
11/09/1999US5980274 Connector housing with spacers between contact pins
11/09/1999US5980273 Cover for an edge mounted printed circuit board connector
11/09/1999US5980270 Soldering with resilient contacts
11/09/1999US5980269 Interconnect arrangement for printed circuits
11/09/1999US5980267 Connector scheme for a power pod power delivery system
11/09/1999US5979312 Support frame and stencil having flexible end regions for attachment to the support frame
11/09/1999US5979048 Method of manufacturing connectors
11/09/1999US5979044 Fabrication method of multilayer printed wiring board
11/09/1999US5979043 Method of manufacturing a circuit assembly from two or more layers of flexible film
11/09/1999US5979042 Printed wiring assembly rework tool
11/09/1999US5979033 Method of recycling waste printed circuit boards
11/04/1999WO1999056517A1 Adapted electrically conductive layer
11/04/1999WO1999056510A1 Method of producing ceramic multilayer substrate
11/04/1999WO1999056509A1 Flip chip devices with flexible conductive adhesive
11/04/1999WO1999056508A1 Rigid interconnect device and method of making
11/04/1999WO1999056292A1 A protective containment apparatus for potted electronic circuits
11/04/1999WO1999055935A1 Method for coating surfaces of copper or of a copper alloy with a tin or tin alloy layer
11/04/1999WO1999055485A1 Fixed-gap solder reflow method
11/04/1999WO1999041957A8 Method of making microwave, multifunction modules using fluoropolymer composite substrates
11/04/1999DE19919743A1 Semiconducting component, e.g. for sensors, has reduced stresses in semiconducting chip
11/04/1999DE19919395A1 Hybrid printed circuit carrier for switch with integrated contacts which is assembled using pick-and-place apparatus
11/04/1999DE19908219A1 Oscillating gyroscope
11/04/1999DE19832970A1 Integrated electronic circuit for mounting on printed circuit board
11/04/1999DE19819057A1 Device to bend flexible electrical flat conductors in bending radius specified by device
11/04/1999DE19818825A1 Component-body, such as bobbin or coil former provided with soldered connections e.g. for coils or capacitors
11/04/1999CA2326049A1 Method for coating surfaces of copper or of a copper alloy with a tin or tin alloy layer
11/03/1999EP0954209A1 Laminated circuit board and method for producing the same
11/03/1999EP0954208A1 Method and device for mounting electronic component on circuit board
11/03/1999EP0954067A2 Grounding terminal and mounting structure of the same on a printed circuit board
11/03/1999EP0954049A2 Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system
11/03/1999EP0954026A2 Conductive paste and method for producing ceramic substrate using the same
11/03/1999EP0953844A2 Time domain reflectometry tester for X-Y prober
11/03/1999EP0953611A1 Repellent-containing material for electronic components, electronic components made by using the same, and process for the production of the components
11/03/1999EP0953420A2 Mold for non-photolithographic fabrication of microstructures
11/03/1999EP0953418A2 Method and apparatus for decomposition treating article having cured thermosetting resin
11/03/1999EP0953277A2 Optimized solder joints for surface mount chips
11/03/1999EP0953205A1 Substrate treatment device
11/03/1999EP0953186A1 Chip card module
11/03/1999EP0953166A2 Pattern-forming methods
11/03/1999EP0953008A1 Thermosetting resin compositions
11/03/1999EP0867106B1 Solder mask for manufacture of printed circuit boards
11/03/1999EP0839440B1 Copper foil for the manufacture of printed circuits and method of producing same
11/03/1999EP0765534B1 High impact digital crash data recorder
11/03/1999EP0714553B1 Method of forming electrically conductive polymer interconnects on electrical substrates
11/03/1999EP0578816B1 Method of inspecting articles
11/03/1999CN1233931A Method for improving adhesion of metal films to polyphenylene ether resins
11/03/1999CN1233930A Method and arrangement for mounting component on carrier
11/03/1999CN1233624A Method and equipment for decomposition and treatment of thermosetting resin cured matter
11/02/1999US5978666 Slotline-mounted flip chip structures
11/02/1999US5978230 Battery mounting apparatuses, electronic devices, and methods of forming electrical connections
11/02/1999US5978229 Circuit board
11/02/1999US5978227 Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends
11/02/1999US5978222 Semiconductor device and assembly board having through-holes filled with filling core
11/02/1999US5978216 Semiconductor package, leadframe, and manufacturing method therefor
11/02/1999US5978093 Method for calibrating surface mounting processes in printed circuit board assembly manufacturing
11/02/1999US5978060 Liquid crystal display apparatus and apparatus for manufacturing the same
11/02/1999US5977860 Surface-mount fuse and the manufacture thereof
11/02/1999US5977850 Multilayer ceramic package with center ground via for size reduction
11/02/1999US5977783 Multilayer probe for measuring electrical characteristics
11/02/1999US5977642 Dendrite interconnect for planarization and method for producing same
11/02/1999US5977637 Integrated electronic device having flip-chip connection with circuit board
11/02/1999US5977630 Plural semiconductor die housed in common package with split heat sink
11/02/1999US5977618 Semiconductor connection components and methods with releasable lead support
11/02/1999US5977613 Electronic component, method for making the same, and lead frame and mold assembly for use therein
11/02/1999US5977512 Multi-wavelength laser soldering device with substrate cleaning beam
11/02/1999US5977490 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
11/02/1999US5977489 Conductive elastomer for grafting to a metal substrate
11/02/1999US5977488 Printed circuit board having coordinate values of electronic components to be mounted thereon and a method of numbering the electronic components thereon
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