Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1999
10/21/1999WO1999053545A1 Film used as a substrate for integrated circuits
10/21/1999WO1999053508A1 Support for electronic components
10/21/1999WO1999053504A1 Ptc thermistor chip
10/21/1999WO1999052970A1 Sheet and method for producing the same
10/21/1999WO1999044100B1 Curable compositions
10/21/1999WO1999034657A3 Hybrid circuit with a heat dissipation system
10/21/1999DE19916014A1 Hydraulic modulator for a motor vehicle, e.g. for an antilock braking system or anti-slip control system
10/21/1999DE19834663A1 Holder and contacting arrangement for components on printed circuit board
10/21/1999DE19817359A1 Ceramic multi-layer circuit manufacturing method
10/21/1999DE19817198A1 Electric connection arrangement in gearing
10/21/1999DE19816794A1 Printed circuit board system, for electronic combination instrument
10/21/1999DE19816445A1 SMD component module manufacturing method e.g. for telephone equipment
10/21/1999DE19815852A1 Trägerkörper für elektronische Bauelemente Body for electronic components
10/21/1999DE19804607A1 Electrical connection of a sensor of an internal combustion engine component, e.g. a suction unit or cylinder head cover, simplifies assembly and the electrical contacts of the sensor
10/21/1999CA2327796A1 Support for electronic components
10/20/1999EP0951206A2 Liquid crystal polymer film, laminate, method of making them and multi-layered parts-mounted circuit board
10/20/1999EP0951205A1 Process for automatic assembling of the upper and lower side of printed circuit boards with SMD components
10/20/1999EP0951161A1 Contact device for connecting a liquid crystal display to a printed circuit board
10/20/1999EP0951103A2 Electric connector
10/20/1999EP0950920A1 Apparatus and method for replacing components on a printed circuit board of a reusable camera
10/20/1999EP0950729A2 Galvanisation device for plate-like workpieces, especially printed circuit boards
10/20/1999EP0950271A1 Component for contacting a measuring unit and method for its production
10/20/1999EP0950262A1 A via structure
10/20/1999EP0950082A1 Reducing void formation in curable adhesive formulations
10/20/1999EP0874920B1 Process and device for the electrochemical treatment of items with a fluid
10/20/1999EP0870419B1 End-wall frame for led alphanumeric display
10/20/1999CN1232242A Contact device between liquid crystal display and printed circuit
10/20/1999CN1231965A Screen printing apparatus
10/20/1999CN1231964A Screen printing apparatus
10/20/1999CN1231952A Method and apparatus for reflow metallic surfaces
10/20/1999CN1231949A Electrode of electronic component part and conductive paste coating device
10/19/1999US5970310 Method for manufacturing multilayer wiring board and wiring pattern forming apparatus
10/19/1999US5969952 Hybrid IC and electronic device using the same
10/19/1999US5969945 Electronic package assembly
10/19/1999US5969924 Spark gap for overcoated printed circuit boards
10/19/1999US5969802 Exposure apparatus
10/19/1999US5969418 Method of attaching a chip to a flexible substrate
10/19/1999US5969417 Chip package device mountable on a mother board in whichever of facedown and wire bonding manners
10/19/1999US5968858 Potassium boron silicate glass in organic vehicle wherein glass follows specific stoichiometry according to ternary compositional diagram
10/19/1999US5968670 Enhanced ceramic ball grid array using in-situ solder stretch with spring
10/19/1999US5968589 Method for manufacturing wiring pattern board
10/19/1999US5968389 Method and machine for hybridization by refusion
10/19/1999US5968386 Method for protecting electronic components
10/19/1999US5968382 Laser cleavage cutting method and system
10/19/1999US5968333 Method of electroplating a copper or copper alloy interconnect
10/19/1999US5967858 Power module
10/19/1999US5967854 Circuit connector
10/19/1999US5967841 Continuous molded plastic components or assemblies
10/19/1999US5967837 Assembly for connecting an electric/electronic device to a printed circuit board
10/19/1999US5967577 Apparatus for dispensing fluid in an array pattern
10/19/1999US5967402 Aluminum nitride sintered compact and the copper foil mutually diffuse when a liquid and a component which is mutually reactive with the liquid are applied and cause an exothermic reaction
10/19/1999US5967156 Processing a surface
10/19/1999US5966805 End connecting portion of a planar circuit body, and method of making same
10/19/1999US5966799 Method of molding free-floating insert
10/15/1999CA2234835A1 Electric terminal connection method
10/14/1999WO1999052337A1 Printed-circuit board with bypass capacitor for mounting integrated circuit, and method of manufacture
10/14/1999WO1999052336A1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
10/14/1999WO1999052335A1 Method and apparatus for manufacturing printed wiring board
10/14/1999WO1999052334A1 Circuit member and circuit board
10/14/1999WO1999052148A1 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
10/14/1999WO1999052147A1 Wire bond attachment of a integrated circuit package to a heat sink
10/14/1999WO1999051679A1 Method of roughening surface of resin layer
10/14/1999WO1999045656A3 A differential line driver
10/14/1999DE19915745A1 Assembly structure of electronic parts prevents the formation of cracks in adhesive substrate
10/14/1999DE19817530A1 Manufacture of thin film structures
10/14/1999DE19816066A1 Folie als Träger von integrierten Schaltungen Film as a substrate of integrated circuits
10/14/1999DE19815530A1 Two- or three-dimensional circuit structure manufacture on circuit carrier
10/14/1999DE19814991A1 Multilayer circuit board conductive connection production process
10/14/1999DE19814428A1 Circuit substrate with connector surfaces or solder pads
10/14/1999DE19811578A1 Multiple layer circuit board especially for chip card
10/14/1999CA2327574A1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
10/14/1999CA2327331A1 Wire bond attachment of a integrated circuit package to a heat sink
10/14/1999CA2327330A1 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
10/13/1999EP0949855A2 Multilayer circuit board
10/13/1999EP0949854A1 Multilayered printed wiring board
10/13/1999EP0949853A1 Heat spreader mounting pad configurations for laser soldering
10/13/1999EP0949745A1 Substrate for a subassembly of electronic components of an electric machine
10/13/1999EP0949714A2 Board to board interconnect
10/13/1999EP0949668A1 Method for forming bump and semiconductor device
10/13/1999EP0949642A2 Chip-type electronic component
10/13/1999EP0949067A2 Coating method utilizing a polymer film and method of making metal-polymer laminates
10/13/1999EP0948881A1 Method of soldering components to at least one carrier
10/13/1999EP0948815A1 Chip module and manufacturing process
10/13/1999EP0948744A1 Micro system for biological analyses and method for making same
10/13/1999EP0934614A4 Vehicle power distribution box
10/13/1999EP0799286B1 Mouldings made of polyurethane hot-melt-type adhesives
10/13/1999EP0524248B1 Solder-bearing lead
10/13/1999CN1231575A Terminal installation structure for printed circuit board
10/13/1999CN1231487A Ceramic electronic assembly and production method thereof
10/13/1999CN1231319A Process for increasing adhesive capacity of polyimide to active metal
10/13/1999CN1045694C Thin-film circuit with patch-clip
10/13/1999CN1045693C Contact structure for interconnections, interposer, semiconductor assembly and method
10/12/1999US5966633 Method for providing a metallization layer on an insulating layer and for opening through holes in the said insulating layer using the same mask
10/12/1999US5966294 Printed circuit board for prevention of unintentional electromagnetic interference
10/12/1999US5966293 Minimal length computer backplane
10/12/1999US5966052 Voltage-controlled oscillator with input and output on opposite corners of substrate
10/12/1999US5965945 Lead solder bump shield
10/12/1999US5965944 Printed circuit boards for mounting a semiconductor integrated circuit die
10/12/1999US5965842 Low impedance connection for an EMI containment shield including metal plating bonded to the shielded equipment through openings in a conductive ribbon
10/12/1999US5965328 Irradiating coating film with radiation through a mask, developing said coating film with an alkali developer solution, electroplating, peeling
1 ... 868 869 870 871 872 873 874 875 876 877 878 879 880 881 882 883 884 885 886 887 888 ... 1185