Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1999
10/12/1999US5965269 Epoxy resin having a weight average molecular weight of less than 5000 and a curing agent; a high molecular weight (hmw) component compatible with the epoxy resin; a hmw component incompatible with the epoxy resin and a cure accelerator
10/12/1999US5965219 Misted deposition method with applied UV radiation
10/12/1999US5965197 Mixing dispersoid particles with solder particles to coat surface, subjecting to plastic deformation to reduce thickness
10/12/1999US5965193 Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material
10/12/1999US5965064 For establishing electric connection between terminals of an integrated circuit chip and a circuit pattern at low cost with high reliabilities in the establishment of electric connection and in the insulation upon connection without short circuiting
10/12/1999US5965043 Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias
10/12/1999US5965036 Microetching composition for copper or copper alloy
10/12/1999US5964396 In an electronic module
10/12/1999US5964395 Spraying with liquid metal; bonding
10/10/1999CA2268700A1 Heat spreader mounting pad configurations for laser soldering
10/07/1999WO1999051074A1 Surface mount technology compatible emi gasket and a method of installing an emi gasket on a ground trace
10/07/1999WO1999051071A1 Smd-capable hybrid circuit
10/07/1999WO1999051070A1 Hybrid circuit with contact surfaces (solder pads)
10/07/1999WO1999050909A1 Semiconductor socket converter module
10/07/1999WO1999050871A1 Hybrid circuit arrangement with a thermal release
10/07/1999WO1999050708A1 Liquid crystal display and manufacture thereof
10/07/1999WO1999050480A1 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances
10/07/1999WO1999050369A1 Adhesive composition and precursor thereof
10/07/1999WO1999050337A1 Composition and method for producing polythioethers having pendent methyl chains
10/07/1999WO1999049934A1 Implantable medical electrode comprising a flexible printed circuit
10/07/1999WO1999018253A3 Method and solution for producing gold coating
10/07/1999DE19914520A1 Rolled copper foil e.g. for flexible printed connection components of flexible printed circuits useful in printer heads and hard disk drives
10/07/1999DE19911731A1 Multilayer printed circuit board for electronic device, such as information processing or communications device
10/07/1999DE19911700A1 Electrophotographic apparatus for forming circuit structures on ceramic green sheet
10/07/1999DE19900833A1 Vacuum test-fixture for testing of printed circuit board (PCB)
10/07/1999DE19853153C1 Contacting a constructional element using solder joint covered with conducting polymer
10/07/1999DE19818502C1 Heat dissipating printed circuit board e.g. PCB
10/07/1999DE19815239A1 Electrical circuit board assembly method, such as for surface mounted components
10/07/1999DE19813528A1 Vorrichtung zur Behandlung von plattenförmigen Werkstücken, insbesondere Leiterplatten Apparatus for treating plate-like workpieces, in particular printed circuit boards
10/07/1999DE19812093C1 Crimpverbindung Crimp
10/06/1999EP0948250A1 Electronic component and mounting method and device therefor
10/06/1999EP0948247A1 Method for producing vias in the manufacture of printed wiring boards
10/06/1999EP0948103A2 Fastening arrangement of a connector to a circuit board
10/06/1999EP0947408A2 Control device for hydraulic brake control and its manufacturing method
10/06/1999EP0947127A1 Vibration damped and stiffened circuit articles
10/06/1999EP0947126A1 Improved stencil and method of producing such
10/06/1999EP0947125A1 Method of making a printed circuit board having a tin/lead coating
10/06/1999EP0947124A1 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion
10/06/1999EP0946794A1 Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductor foils in continuous systems
10/06/1999EP0946330A1 A solder composition
10/06/1999EP0876689B1 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
10/06/1999EP0812527B1 Sealed packaging for environmental protection of electronics
10/06/1999EP0574459B1 Registration system
10/06/1999CN1230872A Composite copper foil, process for preparing same, and copper-clad laminate and printed wiring board using the same
10/06/1999CN1230838A Connection between LCD module and PCB in flip-up type portable phone
10/06/1999CN1230828A Device and method for monitoring operation of industrial installation
10/06/1999CN1230806A Connector for flat flexible circuitry
10/06/1999CN1230756A Surface mounting coil
10/06/1999CN1230740A LCD module
10/06/1999CN1230568A Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards
10/05/1999US5963793 Microelectronic packaging using arched solder columns
10/05/1999US5963433 Bottom lead semiconductor package with recessed leads and fabrication method thereof
10/05/1999US5963423 Surface mountable electronic devices
10/05/1999US5963416 Electronic device with outer electrodes and a circuit module having the electronic device
10/05/1999US5963287 Display unit with flexible printed circuit board
10/05/1999US5963115 Ceramic filter having reduced insertion losses
10/05/1999US5963111 Orthogonal transition from coax to stripline for opposite sides of a stripline board
10/05/1999US5963045 Method for testing circuit board assemblies
10/05/1999US5962925 Mounting structure of electronic component having bumps
10/05/1999US5962924 Semi-conductor die interconnect
10/05/1999US5962922 Semiconductor device flat package
10/05/1999US5962917 Semiconductor device package having end-face halved through-holes and inside-area through-holes
10/05/1999US5962835 Board adapter
10/05/1999US5962815 Antifuse interconnect between two conducting layers of a printed circuit board
10/05/1999US5962192 Film forming polymer, an organo azide and a photosensitive dye that absorbs light at the frequency of the patterning laser and converts it to heat energy. the heat energy in turn elevates the temperature of the organo azide above its
10/05/1999US5962151 Method for controlling solderability of a conductor and conductor formed thereby
10/05/1999US5962133 Solder, electronic component mounted by soldering, and electronic circuit board
10/05/1999US5962085 Misted precursor deposition apparatus and method with improved mist and mist flow
10/05/1999US5962073 Selectively etching the elastomer and the ppa matrix with a solution containing chromic acid, then effectively removing from the substrate any retained chromium which would adversely affect the ability of metal plating to adhere to the
10/05/1999US5961737 Welded wire termination device and method for constructing a solar array
10/05/1999US5961349 Assembly of shielded connectors and a board having plated holes
10/05/1999US5961334 Suspension connection structure for a magnetic head
10/05/1999US5961255 Entry overlay sheet and method for drilling holes
10/05/1999US5961032 Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold
10/05/1999US5960712 Method for use with a target electronic structure
10/05/1999US5960538 Printed circuit board
10/05/1999US5960537 Fastener for an electrical connector
10/05/1999CA2104401C Novel demetallizing procedure
09/1999
09/30/1999WO1999049711A1 Clustering adapter for spherical shaped devices
09/30/1999WO1999049708A1 Method for making electrical connections between conductors separated by a dielectric
09/30/1999WO1999049707A1 Moulded part and flexible film with a protected printed conductor, and method for producing the same
09/30/1999WO1999049507A1 Flip chip mounting technique
09/30/1999WO1999049118A1 Base webs for printed circuit board production using the foam process and aramid fibers
09/30/1999WO1999048780A1 Device for treating plate-shaped work pieces, especially printed-circuit boards
09/30/1999WO1999048642A1 Methods and apparatuses for forming solder balls on substrates
09/30/1999WO1999048639A1 Leadless solder
09/30/1999WO1999048620A1 Multilayer metalized composite on polymer film product and process
09/30/1999WO1999048619A1 Method and apparatus for two-layered coating of copper foils with meltable coating
09/30/1999WO1999035547A3 Power contact for testing a power source
09/30/1999DE19813932A1 Befestigungsanordnung eines Steckverbinders an einer Leiterplatte Mounting arrangement of a connector to a circuit board
09/30/1999DE19812880A1 Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung Molding and flexible film with a protected trace and process for their preparation
09/30/1999DE19812471A1 Verfahren und Vorrichtung zur zweischichtigen Beschichtung von Kupferfolien mit schmelzbaren Beschichtungsmitteln Method and apparatus for two-layer coating of copper foil with the fusible coating compositions
09/30/1999DE19809138A1 Leiterplatte mit SMD-Bauelementen PCB with SMD components
09/30/1999DE19753149C2 Verfahren zum Herstellen eines Keramik-Metall-Substrates A method of manufacturing a ceramic-metal substrate
09/30/1999CA2325025A1 Moulded part and flexible film with a protected printed conductor, and method for producing the same
09/29/1999EP0946086A1 Plated leadframes with cantilever leads
09/29/1999EP0945920A1 Connector for flat flexible circuitry
09/29/1999EP0945912A1 Dielectric filter and method of manufacturing the same
09/29/1999EP0945880A2 Surface-mount coil
09/29/1999EP0945280A2 Hot dieless transfer printing
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