| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/15/1999 | EP0942256A1 Electric igniter for triggering a propellant charge |
| 09/15/1999 | EP0942070A1 Recovery of metal values from polyester circuit boards by treatment in alkaline solutions of higher alcohols |
| 09/15/1999 | EP0942060A1 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
| 09/15/1999 | EP0942036A1 Polymerisable preparation containing fluor, its use and method of preparation of a polymer composition containg the preparation |
| 09/15/1999 | EP0941798A2 Laser soldering procedure applicable to the joining of pins over printed circuit boards |
| 09/15/1999 | EP0941644A1 Electronic circuit with a screening case to attenuate high-frequency interference |
| 09/15/1999 | EP0941576A1 Crystal resonator |
| 09/15/1999 | EP0941545A2 Method of manufacturing a plurality of electronic components |
| 09/15/1999 | EP0890198B1 Arrangement of two disconnectable flat conductors and a connection unit for connecting a flat conductor |
| 09/15/1999 | CN2338941Y Machine for washing plated through-hole of printed circuit plate |
| 09/15/1999 | CN1228882A Power pad/power delivery system |
| 09/15/1999 | CN1228632A Method of mounting electrical receptacle on substrate |
| 09/15/1999 | CN1045150C Method for manufacturing multilayer circuit board and manufactured multiplayer circuit board |
| 09/15/1999 | CN1045134C Circuit protector |
| 09/14/1999 | US5953623 Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection |
| 09/14/1999 | US5953594 Method of making a circuitized substrate for chip carrier structure |
| 09/14/1999 | US5953545 Exposure controlling device for camera |
| 09/14/1999 | US5953447 Method for recognizing a printed circuit board fiducial mark in order to decide origin point in chip mounter |
| 09/14/1999 | US5953216 Method of repairing an electrical assembly |
| 09/14/1999 | US5953214 Dual substrate package assembly coupled to a conducting member |
| 09/14/1999 | US5953213 Multichip module |
| 09/14/1999 | US5953210 Reworkable circuit board assembly including a reworkable flip chip |
| 09/14/1999 | US5953203 A support, a burried screen printed capacitor made from a dielectric selected from barium titanate and lead-magnesium niobiate, a silver conductor layer printed below and above the capacitor, an overlying green tape layer |
| 09/14/1999 | US5953028 Interconnect scheme for mounting differently configured printheads on the same carriage |
| 09/14/1999 | US5952901 Laminated electronic component with trimmable parallel electrodes |
| 09/14/1999 | US5952836 In a rotor strap of a helicopter |
| 09/14/1999 | US5952745 Cylindrical coreless vibrating motor |
| 09/14/1999 | US5952719 Metal ball grid electronic package having improved solder joint |
| 09/14/1999 | US5952717 Semiconductor device and method for producing the same |
| 09/14/1999 | US5952716 Pin attach structure for an electronic package |
| 09/14/1999 | US5952715 Chip type electronic part |
| 09/14/1999 | US5952713 Non-contact type IC card |
| 09/14/1999 | US5952709 High-frequency semiconductor device and mounted structure thereof |
| 09/14/1999 | US5952632 CPU set-up key for controlling multiple circuits |
| 09/14/1999 | US5952629 Switch apparatus |
| 09/14/1999 | US5952446 Elastomeric epoxy composition |
| 09/14/1999 | US5952154 Photoimageable composition having improved flexibility |
| 09/14/1999 | US5951807 Method of mounting core slider with robot mounter |
| 09/14/1999 | US5951803 Laminating with a sheet of copper foil and a sheet of aluminum, applying a band of flexible adhesive joining the sheets around their borders to form a protected central zone at the interface of the sheets |
| 09/14/1999 | US5951305 Lidless socket and method of making same |
| 09/14/1999 | US5951304 Fanout interconnection pad arrays |
| 09/14/1999 | US5950968 Wire holder and wire holder assembly |
| 09/14/1999 | US5950908 Solder supplying method, solder supplying apparatus and soldering method |
| 09/14/1999 | US5950907 Using alloy of tin, silvewr and lead |
| 09/14/1999 | US5950306 Circuit board |
| 09/14/1999 | US5950305 Environmentally desirable method of manufacturing printed circuits |
| 09/14/1999 | US5950303 Method and fixturing to perform two side laminations of stacked substrates forming 3-D modules |
| 09/14/1999 | US5950292 Methods of fabricating applique circuits |
| 09/14/1999 | CA2147396C Supporting member for cooling means and electronic package using the same |
| 09/14/1999 | CA2144247C Direct circuit board connection |
| 09/14/1999 | CA2086138C Laser-formed electrical component and method for making same |
| 09/14/1999 | CA2062461C Hydroprimer for metallising substrate surfaces |
| 09/13/1999 | CA2265100A1 Laser soldering procedure applicable to the joining of pins over printed circuit boards |
| 09/10/1999 | WO1999045755A1 Shielding an electronic card with printed circuit mounted on a metal substrate |
| 09/10/1999 | WO1999045754A1 Connecting an electronic card point to a printed circuit on a metal substrate bearing said card |
| 09/10/1999 | WO1999045753A1 Method for manufacturing a resistor |
| 09/10/1999 | WO1999045656A2 A differential line driver |
| 09/10/1999 | WO1999045179A1 Method of etching |
| 09/10/1999 | WO1999045176A2 Electrolytic copper foil having a modified shiny side |
| 09/10/1999 | WO1999044959A1 Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
| 09/10/1999 | WO1999044955A1 Impregnated glass fiber strands and products including the same |
| 09/10/1999 | WO1999044828A1 Method and apparatus for transporting substrates |
| 09/10/1999 | WO1999035712A3 Electric connector |
| 09/10/1999 | WO1999033111A3 Thin-film component comprising a substrate with an elastic coating |
| 09/10/1999 | CA2322156A1 Impregnated glass fiber strands and products including the same |
| 09/10/1999 | CA2320748A1 Method and apparatus for transporting substrates |
| 09/10/1999 | CA2320746A1 Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
| 09/09/1999 | DE19908199A1 Oscillating gyroscope for angle sensor in motor vehicle navigation system |
| 09/09/1999 | DE19809722A1 Reflow soldering process with a reduced number of steps |
| 09/09/1999 | DE19807139A1 Continuous thermal lamination of thermoplastic printed circuit board, avoiding tendency for copper foil to roll up |
| 09/08/1999 | EP0941021A1 Manufacturing process for printed-circuit boards with electrical connection between faces |
| 09/08/1999 | EP0941020A2 Printed circuit board having SMD components |
| 09/08/1999 | EP0940889A2 Method of mounting an electrical receptacle on a substrate |
| 09/08/1999 | EP0940861A2 Light emitting diode |
| 09/08/1999 | EP0940771A1 Portable electronic device |
| 09/08/1999 | EP0940724A2 Developer for photosensitive polyimide precursor, and method of using it for patterning |
| 09/08/1999 | EP0940709A1 Liquid crystal display apparatus having stepped section in glass substrate |
| 09/08/1999 | EP0940418A2 Elastomeric epoxy composition |
| 09/08/1999 | EP0939876A1 Method for production of conducting element and conducting element |
| 09/08/1999 | EP0939684A1 Method for soft soldering metals and soft solder for carrying said method |
| 09/08/1999 | EP0605712B1 Packaging electrical components |
| 09/08/1999 | CN1228193A Method for making transponder coil and transponder produced by said method |
| 09/08/1999 | CN1044985C Solder paste |
| 09/07/1999 | US5950073 Self-adjusting semiconductor package stand-offs |
| 09/07/1999 | US5950072 Low-profile removable ball-grid-array integrated circuit package |
| 09/07/1999 | US5949905 Model-based adaptive segmentation |
| 09/07/1999 | US5949657 Bottom or top jumpered foldable electronic assembly |
| 09/07/1999 | US5949654 Multi-chip module, an electronic device, and production method thereof |
| 09/07/1999 | US5949650 Composite heat sink/support structure |
| 09/07/1999 | US5949618 Solder bump electrical connection and method for fabrication |
| 09/07/1999 | US5949512 Mounted substrate |
| 09/07/1999 | US5949242 Method and apparatus for testing unpackaged semiconductor dice |
| 09/07/1999 | US5949141 Laminated film/metal structures |
| 09/07/1999 | US5949030 Vias and method for making the same in organic board and chip carriers |
| 09/07/1999 | US5949029 Conductive elastomers and methods for fabricating the same |
| 09/07/1999 | US5948536 Glass composition for substrates with a built-in lead base dielectric material, and multilayer substrate with a built-in capacitor |
| 09/07/1999 | US5948533 Vertically interconnected electronic assemblies and compositions useful therefor |
| 09/07/1999 | US5948526 Protected sheet laminate |
| 09/07/1999 | US5948514 Photocurable thermosettting resin composition developable with aqueous alkali solution |
| 09/07/1999 | US5948466 Method for forming fiducial mark in resin stencil and stencil formed thereby |