| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/29/1999 | EP0944749A1 Process for the electrolytic deposition of copper layers |
| 09/29/1999 | EP0944684A1 Anisotropic conductive adhesive compositions |
| 09/29/1999 | EP0944671A1 Thermally reworkable binders for flip-chip devices |
| 09/29/1999 | EP0944482A1 Apparatus and method for recovering photoresist developers and strippers |
| 09/29/1999 | EP0944453A1 Soldering/unsoldering arrangement |
| 09/29/1999 | CN2340745Y Conveyor for washing apparatus for printed circuit boards |
| 09/29/1999 | CN1230334A Method for structuring synthetic surfaces, specially for producing data carriers to store data |
| 09/29/1999 | CN1230330A Modularized hearing aid circuit structure |
| 09/29/1999 | CN1230093A Master board assemly method |
| 09/29/1999 | CN1230040A Electrical connector for leaded electronic component |
| 09/28/1999 | US5960307 Method of forming ball grid array contacts |
| 09/28/1999 | US5960251 Storage-stable laminated electronic circuit boards protected by coating with a benzimidazole, an alkylimidazole, a benzotriazole or an alkyltriazole and metal particles of solder-wettable metals |
| 09/28/1999 | US5959847 Form factor-configured channel bank card containing form factor non-conformal printed circuit board |
| 09/28/1999 | US5959844 Instrument cluster |
| 09/28/1999 | US5959842 Surface mount power supply package and method of manufacture thereof |
| 09/28/1999 | US5959840 Apparatus for cooling multiple printed circuit board mounted electrical components |
| 09/28/1999 | US5959839 Apparatus for heat removal using a flexible backplane |
| 09/28/1999 | US5959709 Display unit with flexible printed circuit board |
| 09/28/1999 | US5959366 Electrical connection system for motor-vehicle subassembly |
| 09/28/1999 | US5959358 Oxidation resistant high conductivity copper layers for microelectronic applications and process of making same |
| 09/28/1999 | US5959356 Solder ball grid array carrier package with heat sink |
| 09/28/1999 | US5959355 Semiconductor package having mechanically and electrically bonded supportive elements |
| 09/28/1999 | US5959353 Semiconductor device |
| 09/28/1999 | US5959348 Construction of PBGA substrate for flip chip packing |
| 09/28/1999 | US5959346 Method for fabricating metal bumps onto electronic device |
| 09/28/1999 | US5959256 Multilayer printed wiring board |
| 09/28/1999 | US5959071 End capped polythioether; end cappers are selected from thiol, a hydroxy group, an unsubstituted or monoalkylsubstituted amine group, a monovalent radical substituted with atleast one hydroxy group |
| 09/28/1999 | US5958807 High magnesium content glass ceramic having forsterite and cordierite crytstals has very low dissipation factor and thermal coefficient of expansion values compatible with metal or ceramic substrates of circuit boards |
| 09/28/1999 | US5958647 Thermosensitive etch resist for forming a mask |
| 09/28/1999 | US5958628 Pattern forming layer absorbs laser; etching |
| 09/28/1999 | US5958590 Dendritic powder materials for high conductivity paste applications |
| 09/28/1999 | US5958578 Sol, gel film; bonding strength |
| 09/28/1999 | US5958562 Electrically conductive material filling openings to couple wiring pattern sections |
| 09/28/1999 | US5958556 Vibration damped and stiffened circuit articles |
| 09/28/1999 | US5958151 Fluxing media for non-VOC, no-clean soldering |
| 09/28/1999 | US5958144 Flux-removing aqueous cleaning composition and method of use |
| 09/28/1999 | US5957739 Continuous electronic stamping with offset carrier |
| 09/28/1999 | US5957736 Electronic part |
| 09/28/1999 | US5957725 Continuous molded plastic components or assemblies |
| 09/28/1999 | US5957370 Plating process for fine pitch die in wafer form |
| 09/28/1999 | US5957364 Integrated solder preform array having a tin outer coating |
| 09/28/1999 | US5957360 System and method for transporting and clamping flexible film structures |
| 09/28/1999 | US5956843 Multilayer printed wiring board and method of making same |
| 09/28/1999 | CA2143175C Flex circuit board for liquid crystal display |
| 09/28/1999 | CA2131001C Stabilization of silicate solutions |
| 09/23/1999 | WO1999048146A1 No clean flux for flip chip assembly |
| 09/23/1999 | WO1999047731A1 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 09/23/1999 | DE19908979A1 Base for positioning semiconductor device on circuit board |
| 09/23/1999 | DE19907522A1 Electrophotographic toner for printing circuit on substrate, especially for making laminated circuit on ceramic |
| 09/23/1999 | DE19907427A1 Contact foot for a flat solder connection between two components |
| 09/23/1999 | DE19810428A1 Electronic device housing with contact region e.g. for a portable electronic device |
| 09/23/1999 | DE19809193A1 Circuit track structure production for flat keyboard |
| 09/22/1999 | EP0944140A1 Electrical connector for leaded electronic component |
| 09/22/1999 | EP0944130A2 Crimp connection |
| 09/22/1999 | EP0943963A2 Photoimageable compositions having improved stripping properties in aqueous alkaline solutions |
| 09/22/1999 | EP0943430A2 Plastic mask for paste printing and paste printing method |
| 09/22/1999 | EP0943429A2 Plastic mask for paste printing and paste printing method |
| 09/22/1999 | EP0943392A2 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| 09/22/1999 | EP0943170A1 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 09/22/1999 | EP0907985A4 Latticework with plurality of overlying lines |
| 09/22/1999 | EP0616562B1 Solder paste formulations for use in the electronics industry |
| 09/22/1999 | EP0536272B1 Image-forming process |
| 09/22/1999 | CN1229516A Coil to be mounted on circuit board and structure mounting the same on circuit board |
| 09/22/1999 | CN1229515A Resistance wiring board and method for manufacturing the same |
| 09/22/1999 | CN1229330A Hybrid module and making method thereof and mounting method thereof |
| 09/22/1999 | CN1229296A Busbar laminate assembly |
| 09/21/1999 | US5956606 Method for bumping and packaging semiconductor die |
| 09/21/1999 | US5956605 Use of nitrides for flip-chip encapsulation |
| 09/21/1999 | US5956237 Primary printed wiring board |
| 09/21/1999 | US5956236 Integrated circuit package support system |
| 09/21/1999 | US5956235 Method and apparatus for flexibly connecting electronic devices |
| 09/21/1999 | US5956234 Method and structure for a surface mountable rigid-flex printed circuit board |
| 09/21/1999 | US5956233 High density single inline memory module |
| 09/21/1999 | US5955784 Ball contact for flip-chip device |
| 09/21/1999 | US5955733 Imaging support for removably mounting an image device |
| 09/21/1999 | US5955703 Circuitized electrical cable and method of assembling same |
| 09/21/1999 | US5955686 Brazing materials for producing metal-ceramics composite substrates |
| 09/21/1999 | US5955683 Method and apparatus for detecting a solder bridge in a ball grid array |
| 09/21/1999 | US5955192 Polysilane |
| 09/21/1999 | US5955179 Coating for the structured production of conductors on the surface of electrically insulating substrates |
| 09/21/1999 | US5955141 Contacting surface of metal having electropositivity less than silver with aqueous composition comprising silver ions and complexing agent |
| 09/21/1999 | US5955119 Carbide rod screening nozzles |
| 09/21/1999 | US5954886 Degreasing and defluxing printed circuits |
| 09/21/1999 | US5954536 Connector for flat flexible circuitry |
| 09/21/1999 | US5954262 Soldering apparatus for providing a fixed quantity of solder piece onto target plate and method of soldering circuit component |
| 09/21/1999 | US5953986 Screen printer |
| 09/21/1999 | US5953816 Process of making interposers for land grip arrays |
| 09/21/1999 | US5953815 Method for making an electrical connection |
| 09/21/1999 | US5953814 Process for producing flip chip circuit board assembly exhibiting enhanced reliability |
| 09/18/1999 | CA2262257A1 Photoimageable compositions having improved stripping properties in aqueous alkaline solutions |
| 09/16/1999 | WO1999046965A2 Integrated circuit connection using an electrically conductive adhesive |
| 09/16/1999 | WO1999046813A1 Method for fabricating double sided ceramic circuit boards using a titanium support substrate |
| 09/16/1999 | DE19834410A1 Laser machining unit, in particular, for drilling holes into printed circuit boards |
| 09/16/1999 | DE19813323C1 Thermoplastic switching carrier arrangement for use in Molded Interconnect Devices and manufacturing process |
| 09/16/1999 | DE19810874A1 Verfahren zur Aufbereitung von Edel- und/oder Halbedelmetallen aus Leiterplatten Process for the preparation of precious and / or semi-precious metals from printed circuit boards |
| 09/16/1999 | DE19810549A1 Polymerisierbare fluorhaltige Zubereitung, ihre Verwendung und Verfahren zur Herstellung ausgehärteter Polymermassen aus dieser Zubereitung A polymerizable fluorine-containing composition, to their use and processes for preparing cured polymer compositions of this preparation |
| 09/15/1999 | EP0942636A2 Solder bonding printed circuit board |
| 09/15/1999 | EP0942505A2 Busbar laminate assembly |
| 09/15/1999 | EP0942466A1 Process for manufacturing semiconductor device and semiconductor component |
| 09/15/1999 | EP0942328A1 Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards |