| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/17/1999 | EP0957663A2 Electronic part and a method of manufacturing the same |
| 11/17/1999 | EP0957520A2 Semiconductor package and mount board, and mounting method |
| 11/17/1999 | EP0957513A1 Electronic parts device |
| 11/17/1999 | EP0956952A1 Cleaning apparatus and cleaning method |
| 11/17/1999 | EP0956748A1 Printed circuit multilayer assembly and method of manufacture therefor |
| 11/17/1999 | EP0956747A1 Circuit board for electrical apparatus with hf components, particularly for mobile radiocommunications equipment |
| 11/17/1999 | EP0956746A1 Means and method for mounting electronics |
| 11/17/1999 | EP0956538A1 Modular data medium |
| 11/17/1999 | EP0956175A1 Drill or milling head |
| 11/17/1999 | EP0956161A1 Ipc (chip) termination machine |
| 11/17/1999 | EP0795262A4 Chemically grafted electrical devices |
| 11/17/1999 | EP0766907B1 Metallized laminate material having ordered distribution of conductive through holes |
| 11/17/1999 | EP0698132B1 Carbon compositions and processes for preparing a non-conductive substrate for electroplating |
| 11/17/1999 | EP0569509B1 Electrical connectors |
| 11/17/1999 | CN1235702A Battery connector and holder for printer circuit boards |
| 11/17/1999 | CN1235699A Electronic part device |
| 11/17/1999 | CN1235375A Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment |
| 11/17/1999 | CN1235282A Photoimageable compositions having improved stripping properties in aqueous alkaline solutions |
| 11/17/1999 | CN1235079A Solder alloy |
| 11/17/1999 | CN1046618C Printed circuit board including code and method of forming them |
| 11/17/1999 | CN1046557C Electrodeposited copper foil and process therefor by electrolyte solutions |
| 11/16/1999 | USRE36396 Electrical substrate material comprising amorphous fused silica powder |
| 11/16/1999 | US5987337 Radio pager |
| 11/16/1999 | US5986894 Microelectronic component carrier and method of its manufacture |
| 11/16/1999 | US5986892 Mount for a circuit board including a mounting bracket and receptor for the bracket |
| 11/16/1999 | US5986886 Three-dimensional flexible electronic module |
| 11/16/1999 | US5986613 Electric contact and process for producing electric contact |
| 11/16/1999 | US5986506 Semiconductor microwave amplifier |
| 11/16/1999 | US5986367 Motor mounting mechanism for a cylindrical vibration motor |
| 11/16/1999 | US5986342 Liquid crystal display apparatus structure for mounting semiconductor device |
| 11/16/1999 | US5986339 Laminated multilayer substrates |
| 11/16/1999 | US5986337 Semiconductor element module and semiconductor device which prevents short circuiting |
| 11/16/1999 | US5986334 Semiconductor package having light, thin, simple and compact structure |
| 11/16/1999 | US5986218 Circuit board with conductor layer for increased breakdown voltage |
| 11/16/1999 | US5986217 Printed circuit board for mitigating thermally-induced mechanical damage of solder joints connecting electronic components |
| 11/16/1999 | US5986209 Package stack via bottom leaded plastic (BLP) packaging |
| 11/16/1999 | US5985785 Manufacturing a laminate which is catalytically effective for subsequent electroless deposition thereon of metals, such as copper, and which is useful as a substrate for printed circuit boards |
| 11/16/1999 | US5985760 Method for manufacturing a high density electronic circuit assembly |
| 11/16/1999 | US5985697 Method and apparatus for mounting an integrated circuit to a printed circuit board |
| 11/16/1999 | US5985694 Semiconductor die bumping method utilizing vacuum stencil |
| 11/16/1999 | US5985521 Method for forming electrically conductive layers on chip carrier substrates having through holes or via holes |
| 11/16/1999 | US5985461 Electroconductive paste, and method for producing ceramic substrate using it |
| 11/16/1999 | US5985458 Polyparaphenylenevinylene and electroconductive filler; protective coatings |
| 11/16/1999 | US5985456 Heat curable; nonhydrolzying; corrosion resistance |
| 11/16/1999 | US5985414 Laminated electronic component |
| 11/16/1999 | US5985212 Consisting of at least about 75 weight percent sn, between about 0.01 and 9.5 weight percent cu, between about 0.01 and 5.0 weight percent ga, between about greater than 0 and 6 percent in; tensile strength |
| 11/16/1999 | US5985180 Coating agent for plastic films |
| 11/16/1999 | US5985161 Method of forming printed circuits having multiple conductor thicknesses |
| 11/16/1999 | US5985125 Forming barrier metal patterns on wafer, depositing copper only on barrier metal patterns by electrochemistry |
| 11/16/1999 | US5985124 Nickel or nickel alloy electroplating bath and plating process using the same |
| 11/16/1999 | US5985123 Apparatus which uniformly distributes electroplating material on substrates of varying sizes and/or substrates being transferred through electroplating tank at different speeds, while maintaining in proper vertical alignment |
| 11/16/1999 | US5985068 Forming two thin metal film layers on supporting member, forming monolithic ceramic structure incorporating said film, changing portion of first metal film into insulating material and diffusing into ceramic |
| 11/16/1999 | US5985043 Thermally curable adhesive comprising acid having two or more double bonds as fluxing agent, double bond containing diluent capable of crosslinking fluxing agent, optionally free radical initiator, resin |
| 11/16/1999 | US5985040 Permanganate desmear process for printed wiring boards |
| 11/16/1999 | US5985029 Conveyor system with lifting mechanism |
| 11/16/1999 | US5984697 Ground clip apparatus for circuit boards |
| 11/16/1999 | US5984692 Board stacking connector chip and tape cartridge containing the chip |
| 11/16/1999 | US5984691 Flexible circuitized interposer with apertured member and method for making same |
| 11/16/1999 | US5984608 Automated chamfering apparatus and method |
| 11/16/1999 | US5984523 Method for recording the heat generated in a hole wall of a substrate during a drilling operation |
| 11/16/1999 | US5984293 Apparatus for holding printed circuit board assemblies in manufacturing processes |
| 11/16/1999 | US5984166 Process for creating fine and coarse pitch solder deposits on printed ciruit boards |
| 11/16/1999 | US5984165 Method of bonding a chip part to a substrate using solder bumps |
| 11/16/1999 | US5984164 Method of using an electrically conductive elevation shaping tool |
| 11/16/1999 | US5983790 Foil screen registering apparatus and method |
| 11/16/1999 | US5983493 Method of temporarily, then permanently, connecting to a semiconductor device |
| 11/16/1999 | US5983492 Low profile socket for microelectronic components and method for making the same |
| 11/16/1999 | US5983490 Conductive ball mounting apparatus |
| 11/11/1999 | WO1999057954A1 Local-coordinate-based component-position verification |
| 11/11/1999 | WO1999057951A1 A printed circuit board and a method of processing printed circuit boards |
| 11/11/1999 | WO1999057949A1 Intermediate layer to improve peel strength of copper foils |
| 11/11/1999 | WO1999057948A1 Printed circuit board material and method of manufacturing board material and intermediate block body for board material |
| 11/11/1999 | WO1999057342A1 Method and device for plating substrate |
| 11/11/1999 | WO1999057334A1 Method and apparatus for treating metal surfaces by dry process |
| 11/11/1999 | DE19831330C1 Electrolytic etching of copper e.g. from printed circuits or circuit boards |
| 11/11/1999 | DE19820524A1 Micro-optical bench, e.g. for optical transmitters and receivers, enables miniaturized optical components to be adjusted w.r.t. each other and can be incorporated into electrical assembly and connection techniques |
| 11/11/1999 | DE19820216A1 A cast resin formulation useful for Glop, Top-flip, and/or adhesive applications in electrotechnical and electronic product manufacture |
| 11/11/1999 | DE19819054A1 Micro-manipulator, for e.g. mounting microcircuits |
| 11/11/1999 | DE19813527C1 SMD-plastics body, such as bobbin, for inductive components |
| 11/11/1999 | CA2298684A1 Copper coatings to improve peel strength |
| 11/11/1999 | CA2295576A1 Substrate material for printed circuit, process for production thereof, and intermediate block for said substrate material |
| 11/11/1999 | CA2293610A1 Method and apparatus for treating metal surfaces by dry process |
| 11/10/1999 | EP0955795A2 Conductive paste for filing via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same |
| 11/10/1999 | EP0955702A1 Printed circuit board connecting device |
| 11/10/1999 | EP0955691A2 Contacting device |
| 11/10/1999 | EP0955676A2 Wafer-scale assembly of chip-size packages |
| 11/10/1999 | EP0955642A2 Formation of thin films resistors |
| 11/10/1999 | EP0954385A1 Fluid delivery apparatus and method |
| 11/10/1999 | EP0907453B1 Process for soldering electronic components to a printed circuit board |
| 11/10/1999 | EP0876518A4 Rough electrical contact surface |
| 11/10/1999 | EP0842045A4 Debossable films |
| 11/10/1999 | EP0815709A4 A motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages |
| 11/10/1999 | CN1234960A Conducting path structure situated on non-conductive support material, specially fine conducting path structure and method for producing same |
| 11/10/1999 | CN1234721A Electronic component |
| 11/10/1999 | CN1234630A Method for attaching solderable wire leads to lead frame |
| 11/10/1999 | CN1234604A Solder-ball carrying belt and producing method therefor |
| 11/10/1999 | CN1234588A Formation of thin-film resistance |
| 11/10/1999 | CN1234567A Element mounting method, IC card and producing method therefor |
| 11/10/1999 | CN1234526A Motor connecting structure for camera |
| 11/10/1999 | CN1234336A Method of forming polymer film coating and method for preparing laminated body of polymer layer and metal foil layer |