Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2002
11/07/2002DE10117873A1 Transport- and fixture-device for substrate e.g. for printing substrates in printing machine, has substrate placed on support device in lateral edge region
11/06/2002EP1255429A1 Electronic equipment and board insertion/removal apparatus therefor
11/06/2002EP1255428A2 Wiring board and method of manufacturing the same
11/06/2002EP1255427A1 Flexible printed circuit board
11/06/2002EP1255300A2 Semiconductor package
11/06/2002EP1255299A2 Power semiconductor device with pressure contact
11/06/2002EP1254926A1 Insulating resin composition for multilayer printed wiring boards, multilayer printed wiring boards made by using the composition and process for the production thereof
11/06/2002EP1254734A1 Solder dross removal apparatus
11/06/2002EP1254592A1 Printed circuit board
11/06/2002EP1254431A2 Method and system for detecting defects on a printed circuit board
11/06/2002EP1074043A4 Process for ashing organic materials from substrates
11/06/2002EP1030381B1 Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer
11/06/2002EP0818515B1 Waterborne photosensitive resin composition
11/06/2002EP0646962B1 Metal sheet processing method and lead frame processing method and semiconductor device manufacturing method
11/06/2002CN2519914Y Small size plug-in type light receiving/transmitting module shell
11/06/2002CN1378769A Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device
11/06/2002CN1378768A Bidirectional interface tool for PWB development
11/06/2002CN1378713A Differential signal electrical connectors
11/06/2002CN1378685A Bonding pad of suspension circuit
11/06/2002CN1378493A Method and apparatus for laser drilling
11/06/2002CN1378420A High frequency module and its producing method
11/06/2002CN1378416A 通孔布线板 Through-hole circuit board
11/06/2002CN1378415A Printed circuit board wth space structure and its producing method
11/06/2002CN1378103A Clamping piece for clamping printed circuit board to explosure
11/06/2002CN1094028C Multilayer printed circuit board and process for producing same
11/06/2002CN1093945C Device for light exposure double-sided printed circuit plate through wiring artworks
11/06/2002CN1093892C Unconducting surface electroplating method
11/05/2002US6477694 Method for designing a power supply decoupling circuit
11/05/2002US6477692 Method and apparatus for channel-routing of an electronic device
11/05/2002US6477412 Cardiac rhythm management system having multi-capacitor module
11/05/2002US6477284 Photo-electric combined substrate, optical waveguide and manufacturing process therefor
11/05/2002US6477058 Integrated circuit device package including multiple stacked components
11/05/2002US6477054 Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via
11/05/2002US6477052 Multiple layer thin flexible circuit board
11/05/2002US6477038 Electronic appliance
11/05/2002US6477031 Electronic component for high frequency signals and method for fabricating the same
11/05/2002US6477016 Junction assembly of bonding pad and bump, and magnetic head device using the same
11/05/2002US6476899 Display panel and method of producing the same
11/05/2002US6476775 Method for forming radio frequency antenna
11/05/2002US6476695 High frequency module
11/05/2002US6476487 Solder circuit
11/05/2002US6476485 Thin-film structure having reliably removable oxide layer formed on bump exposed at surface of insulating layer and manufacturing method therefor
11/05/2002US6476476 Integrated circuit package including pin and barrel interconnects
11/05/2002US6476346 Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding
11/05/2002US6476333 Raised contact structures (solder columns)
11/05/2002US6476332 Conductor systems for thick film electronic circuits
11/05/2002US6476331 Printed circuit board for semiconductor package and method for manufacturing the same
11/05/2002US6476330 Wiring substrate and process for producing the same
11/05/2002US6476314 Solar tile and associated method for fabricating the same
11/05/2002US6475924 Substrate and process for producing the same
11/05/2002US6475877 Method for aligning die to interconnect metal on flex substrate
11/05/2002US6475830 Flip chip and packaged memory module
11/05/2002US6475824 X-ray detector and method of fabricating the same
11/05/2002US6475703 Method for constructing multilayer circuit boards having air bridges
11/05/2002US6475702 Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards
11/05/2002US6475701 Active energy beam curable composition and printed wiring board
11/05/2002US6475638 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
11/05/2002US6475607 Dielectric ceramic composition and multilayered ceramic substrate
11/05/2002US6475555 Process for screening features on an electronic substrate with a low viscosity paste
11/05/2002US6475429 Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same
11/05/2002US6475401 Process for the manufacture of substrates with textured metalizations and holding and fastening elements for use in this process
11/05/2002US6475369 Method for electrochemical fabrication
11/05/2002US6475357 Inflatable compliant bladder assembly
11/05/2002US6475328 Printed circuits; containing cockroach repellent
11/05/2002US6475317 Method for manufacturing electronic component of laminated ceramics
11/05/2002US6475314 Adhesive lamination useful in making circuit board structures
11/05/2002US6475299 Conversion coating composition based on nitrogen and silicon compounds and conversion coating method using the same
11/05/2002US6475023 Surface mount holding feature
11/05/2002US6475011 Land grid array socket actuation hardware for MCM applications
11/05/2002US6475001 Ultraminiature optical jack
11/05/2002US6474537 Soldering method using a Cu-containing lead-free alloy
11/05/2002US6474536 Flux composition and corresponding soldering method
11/05/2002US6474438 Power steering
11/05/2002US6473963 Method of making electrical circuit board
11/05/2002CA2055310C Injection-moulded printed circuit boards by injection-moulding thermoplastic materials onto the back of the flexible circuits
10/2002
10/31/2002WO2002087297A1 Electronic apparatus
10/31/2002WO2002087296A1 Circuit board, circuit board mounting method, and electronic device using the circuit board
10/31/2002WO2002087295A1 Method and apparatus for fabricating printed circuit board using atmospheric pressure capillary discharge plasma shower
10/31/2002WO2002087294A1 A method for forming a printed circuit board and a printed circuit board formed thereby
10/31/2002WO2002087293A2 Support for electrical circuit elements
10/31/2002WO2002087070A1 Piezoelectric oscillator and its manufacturing method
10/31/2002WO2002087024A1 Compliant interposer for single-sided electronic package attachment
10/31/2002WO2002086964A1 Wiring method and element arranging method using the same, and method of producing image display devices
10/31/2002WO2002086924A1 Method of producing electronic parts, and member for production thereof
10/31/2002WO2002086922A1 Micro-replicated miniaturised electric components
10/31/2002WO2002086910A2 A method and system for forming electrically conductive pathways
10/31/2002WO2002086196A1 Copper acid baths, system and method for electroplating high aspect ratio substrates
10/31/2002WO2002086003A1 A thermosetting adhesive film, and an adhesive structure based on the use thereof
10/31/2002WO2002085621A1 Laminated plate and part using the laminated plate
10/31/2002US20020161402 Protection apparatus for implantable medical device
10/31/2002US20020161077 Heat-resistant composition
10/31/2002US20020160903 Method for manufacturing aluminum nitride sintered body in which via hole is made
10/31/2002US20020160786 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
10/31/2002US20020160540 Electronic component and method for forming substrate electrode of the same
10/31/2002US20020160219 Copper foil with low profile bond enhancement
10/31/2002US20020160211 Flexible metal-clad laminate and process for preparing the same
10/31/2002US20020160165 Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof
10/31/2002US20020160103 Method and apparatus for forming thin film of metal
10/31/2002US20020159913 A lead-free solder consisting of: 1.0 to 4.0 wt % of silver, 0.4 to 1.3 wt % of copper; 0.02 to 0.06 wt % of nickel and a balance of tin, nickel serves to lower a copper dissolution rate of solder
10/31/2002US20020159707 Floating optical carrier
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