| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/13/2002 | CN1379829A Carrier serving for supplying current to workpieces or counter-electrodes that are to be treated electrolytically and method for electrolytically treating workpieces |
| 11/13/2002 | CN1379617A 半导体器件 Semiconductor devices |
| 11/13/2002 | CN1379616A Multi layer circuit board and its manufacturing method |
| 11/13/2002 | CN1379506A Electric contact device uisng resin welding flux, electric connector and connecting method |
| 11/13/2002 | CN1379503A Electric contact device using resin welding flux, electric connector and connecting method of distributing board |
| 11/13/2002 | CN1379502A Binding member electric connector and its connecting method |
| 11/13/2002 | CN1379498A Composite battery having internal breaker |
| 11/13/2002 | CN1379416A Surface installed positive coefficient heat sensitive resistor and its making method |
| 11/13/2002 | CN1379223A Method of determining deviation of printed circuit board drilling machine |
| 11/13/2002 | CN1094084C Soldering tin alloy for electronic part bonding electrodes and soldering method |
| 11/12/2002 | US6480396 Printed circuit board and electronic equipment using the board |
| 11/12/2002 | US6480395 Device and method for interstitial components in a printed circuit board |
| 11/12/2002 | US6480394 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuits board |
| 11/12/2002 | US6480388 Back plate assembly for motherboard |
| 11/12/2002 | US6480359 Hard disk drive suspension with integral flexible circuit |
| 11/12/2002 | US6480254 Liquid crystal display apparatus having stepped section in glass substrate |
| 11/12/2002 | US6480014 High density, high frequency memory chip modules having thermal management structures |
| 11/12/2002 | US6479894 Layout method for thin and fine ball grid array package substrate with plating bus |
| 11/12/2002 | US6479788 Method and apparatus of making a hole in a printed circuit board |
| 11/12/2002 | US6479765 Vialess printed circuit board |
| 11/12/2002 | US6479764 Via structure with dual current path |
| 11/12/2002 | US6479763 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part |
| 11/12/2002 | US6479762 Printed circuit board having a pattern of traces formed by screen-printing |
| 11/12/2002 | US6479760 Printed wiring board for semiconductor plastic package |
| 11/12/2002 | US6479758 Wiring board, semiconductor package and semiconductor device |
| 11/12/2002 | US6479757 Method of mounting a plurality of electronic parts on a circuit board |
| 11/12/2002 | US6479756 Flexible wiring substrate and its manufacturing method |
| 11/12/2002 | US6479755 Printed circuit board and pad apparatus having a solder deposit |
| 11/12/2002 | US6479622 Compositions for making ene-thiol elastomers |
| 11/12/2002 | US6479318 Method of manufacturing a substrate with directionally anisotropic warping |
| 11/12/2002 | US6479120 Printed pattern defect repair sheet, and repair device and method for printed pattern defect |
| 11/12/2002 | US6479093 Composite laminate circuit structure and methods of interconnecting the same |
| 11/12/2002 | US6478909 Method for surface mounting electrical components to a substrate |
| 11/12/2002 | US6478906 Method for bonding a flexible substrate to a chip |
| 11/12/2002 | US6478878 Blasting medium and blasting method |
| 11/12/2002 | US6478843 Anti-adherent coating and method for the production thereof |
| 11/12/2002 | US6478585 Electrical connection box for a vehicle |
| 11/12/2002 | US6478215 Automatic wave soldering apparatus and method |
| 11/12/2002 | US6477771 Terminal crimping method and terminal crimping apparatus |
| 11/12/2002 | CA2256956C Apparatus and method for rf shielding of a printed circuit board |
| 11/07/2002 | WO2002089553A1 Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board |
| 11/07/2002 | WO2002089551A1 Tooling fixture |
| 11/07/2002 | WO2002089546A1 Substrate adhesion enhancement to film |
| 11/07/2002 | WO2002089545A1 A jetting device and a method at a jetting device |
| 11/07/2002 | WO2002089544A1 Wiring board and soldering method therefor |
| 11/07/2002 | WO2002089543A1 Protection of conductive connection by electrophoresis coating and structure formed thereof |
| 11/07/2002 | WO2002089542A1 Copper ball insertion machine |
| 11/07/2002 | WO2002089541A2 Defferential connector footprint for a multi-layer circuit board |
| 11/07/2002 | WO2002089540A1 Printed circuit board, its manufacturing method, and csp manufacturing methdo |
| 11/07/2002 | WO2002089338A2 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
| 11/07/2002 | WO2002089260A2 Separable power delivery connector |
| 11/07/2002 | WO2002089257A2 Connection housing for an electronic component |
| 11/07/2002 | WO2002089222A1 Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler |
| 11/07/2002 | WO2002089209A1 High-frequency module and its manufacturing method |
| 11/07/2002 | WO2002089152A1 Conductive materials with electrical stability for use in electronics devices |
| 11/07/2002 | WO2002089021A1 High-frequency electronic component and its designing method |
| 11/07/2002 | WO2002088845A1 Resin composition, process for producing resin composition, and method of forming resin film |
| 11/07/2002 | WO2002088835A1 Liquid crystal display device with alterable contrast and method for altering contrast during assembly of such a liquid crystal display device |
| 11/07/2002 | WO2002088243A2 Method for producing thin homogeneous layers with the help of screen printing technology, device for carrying out said method and the use thereof |
| 11/07/2002 | WO2002087870A1 Electric circuit components having multiple electric characteristics and methods of making such components |
| 11/07/2002 | WO2002087837A1 Method of deburring in punching operation and method of manufacturing punched product |
| 11/07/2002 | WO2002087686A1 Protection apparatus for implantable medical device |
| 11/07/2002 | WO2002037564A3 Film material comprising metal spikes and method for the production thereof |
| 11/07/2002 | US20020164895 Integrated power delivery with flex circuit interconnection for high density high power circuits for integrated circuits and systems |
| 11/07/2002 | US20020164837 Filling gap between chip and substrate with adhesive; applying ultrasonic oscillation |
| 11/07/2002 | US20020164836 Method of manufacturing printed circuit board |
| 11/07/2002 | US20020164542 Photosensitive insulating paste composition and photosensitive film made therefrom |
| 11/07/2002 | US20020164535 Thermal mass transfer donor element |
| 11/07/2002 | US20020164495 Polymeric matrix having a carbon pigment to absorb relatively long wavelengths of light to cause ablation of the medium and an ultraviolet absorbing dye to give high optical density in ultraviolet portions of the spectrum. |
| 11/07/2002 | US20020164488 Ceramic substrate board and a metal alloy layer consisting mainly of aluminum formed on a surface portion of the ceramic substrate board, wherein the Vickers hardness of the metal alloy layer is not less than 25 and not more than 40. |
| 11/07/2002 | US20020164469 Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets |
| 11/07/2002 | US20020164468 Plating is not continuous from the first laminate layer to the second laminate layer. |
| 11/07/2002 | US20020164467 Filling a through hole on a prepreg including a releasing resin film with a conductive paste containing a conductive filler; peeling said releasing resin film; laminating a metal foil; and heating and pressurizing the laminated product. |
| 11/07/2002 | US20020163787 Surface mount type electronic component |
| 11/07/2002 | US20020163783 Holding and heat dissipation structure for heat generation part |
| 11/07/2002 | US20020163342 Device and method for inspection |
| 11/07/2002 | US20020163341 Device and method for inspecting circuit board |
| 11/07/2002 | US20020163085 Pb-free solder-connected structure and electronic device |
| 11/07/2002 | US20020163084 Electronic component and process for manufacturing the same |
| 11/07/2002 | US20020163006 Light source |
| 11/07/2002 | US20020162973 Methods and systems for processing a device, methods and systems for modeling same and the device |
| 11/07/2002 | US20020162888 Compact externally-driven scanner |
| 11/07/2002 | US20020162880 Apparatus and method for removing interconnections |
| 11/07/2002 | US20020162879 Apparatus for selective soldering |
| 11/07/2002 | US20020162829 Thermally controlled circuit using planar resistive elements |
| 11/07/2002 | US20020162825 Control system for ablating high-density array of vias or indentation in surface of object |
| 11/07/2002 | US20020162780 Solder dross removal apparatus |
| 11/07/2002 | US20020162687 Multi-layer wiring board and method of producing the same |
| 11/07/2002 | US20020162685 Thermal dissipating printed circuit board and methods |
| 11/07/2002 | US20020162684 Mounting substrate and structure having semiconductor element mounted on substrate |
| 11/07/2002 | US20020162679 Package level pre-applied underfills for thermo-mechanical reliability enhancements of electronic assemblies |
| 11/07/2002 | US20020162678 Electronic apparatus |
| 11/07/2002 | US20020162628 Manufacturing method and manufacturing apparatus of thin-film laminate |
| 11/07/2002 | US20020162218 Substrate adhesion enhancement to film |
| 11/07/2002 | US20020162215 Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 11/07/2002 | US20020162214 Electrical devices and process for making such devices |
| 11/07/2002 | DE10121925A1 Conductor tracks formation for manufacture of carrier board is performed by laying wires on board and then performing deformation operation |
| 11/07/2002 | DE10121673A1 Gedruckte Leiterplatte Printed circuit board |
| 11/07/2002 | DE10121126A1 Identifikationsträger und Verfahren zu dessen Herstellung Identification carrier and process for its preparation |
| 11/07/2002 | DE10120686A1 Verfahren zur Erzeugung dünner homogener Schichten mit Hilfe der Siebdrucktechnik, Vorrichtung zur Durchführung des Verfahren und ihre Verwendung Method for producing thin homogenous layers with the aid of screen printing technology, apparatus for performing the method and their use |