H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2002
11/20/2002	CN1380181A Screen printing device and screen printing method
11/20/2002	CN1094717C PC board and fixing body thereof
11/20/2002	CN1094674C Vibratory motor maintainer and portable electronic equipment with same apparatus
11/20/2002	CN1094421C Printing squeegee apparatus
11/20/2002	CN1094420C Net plate printing apparatus and method
11/19/2002	US6484299 Method and apparatus for PCB array with compensated signal propagation
11/19/2002	US6483713 Multilayered board comprising folded flexible circuits
11/19/2002	US6483708 Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
11/19/2002	US6483328 Probe card for probing wafers with raised contact elements
11/19/2002	US6483195 Transfer bump street, semiconductor flip chip and method of producing same
11/19/2002	US6483191 Semiconductor device having reinforced coupling between solder balls and substrate
11/19/2002	US6483128 Connecting device for power semiconductor modules with compensation for mechanical stresses
11/19/2002	US6483074 Laser beam system for micro via formation
11/19/2002	US6483046 Circuit board having burr free castellated plated through holes
11/19/2002	US6483044 Interconnecting substrates for electrical coupling of microelectronic components
11/19/2002	US6483041 Micro soldered connection
11/19/2002	US6483039 Substrate of semiconductor package
11/19/2002	US6483037 Multilayer flexible FR4 circuit
11/19/2002	US6482679 Electronic component with shield case and method for manufacturing the same
11/19/2002	US6482564 Disposing active primer between receptor substrate and a thermal transfer donor; disposing transfer assist layer on active primer; selectively thermally transferring portion of transfer layer from donor to receptor
11/19/2002	US6482529 Polyamideimide prepolymer, 1 to 25 parts by wt of a trifunctional ester, 0.5 to 15 parts by wt organo-reactive silane; corrosion resistance, electroconductivity
11/19/2002	US6482521 Structure with blended polymer conformal coating of controlled electrical resistivity
11/19/2002	US6482490 Printing sheet with base material, and method of manufacturing the same
11/19/2002	US6482289 Nonconductive laminate for coupling substrates and method therefor
11/19/2002	US6482032 Electrical connector with board locks
11/19/2002	US6481323 Stamping apparatus having replaceable punches
11/19/2002	US6481101 Manufacture of a wiring loom
11/19/2002	US6481098 Method of manufacturing circuit boards
11/19/2002	CA2157264C Method and apparatus for fluxing and soldering terminals on a printed circuit board
11/14/2002	WO2002091811A2 Throughplating of flexible printed boards
11/14/2002	WO2002091810A2 Printed circuit board
11/14/2002	WO2002091526A1 Mechanical-contact adapter
11/14/2002	WO2002091405A1 High-frequency module device
11/14/2002	WO2002090623A1 Copper plating bath and method for plating substrate by using the same
11/14/2002	WO2002090117A1 Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink
11/14/2002	WO2002090037A1 Micromachining with high-energy, intra-cavity q-switched co2 laser pulses
11/14/2002	US20020168845 Semiconductor copper bond pad surface protection
11/14/2002	US20020168807 Pattern of an organic molecular film is formed on a substrate, a solution for forming a thin film applied, and the thin film is selectively formed on the organic molecular film pattern
11/14/2002	US20020168510 High dielectric constant composite material and multilayer wiring board using the same
11/14/2002	US20020168504 Prepreg and process for manufacturing same
11/14/2002	US20020168475 Impregnating a glass fiber substrate; curing; heating
11/14/2002	US20020168238 Incremental step drilling system and method
11/14/2002	US20020168223 Suppressing reduction of copper ions; using solution of ammonium persulfate and 1,4,8,11 tetraazundecane complexing agent
11/14/2002	US20020167830 Semiconductor device and process for manufacturing the same
11/14/2002	US20020167802 Printed circuit board
11/14/2002	US20020167788 Apparatus for exposing a face of a printed circuit panel
11/14/2002	US20020167783 Flexible conductor foil with an electronic circuit
11/14/2002	US20020167581 Methods and systems for thermal-based laser processing a multi-material device
11/14/2002	US20020167092 Interposer, packages including the interposer, and methods
11/14/2002	US20020167076 Semiconductor package and semiconductor package mounting method
11/14/2002	US20020167063 Sensor circuit module and electronic device using the same
11/14/2002	US20020166978 Aligner
11/14/2002	US20020166886 Method of forming bumps
11/14/2002	US20020166845 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
11/14/2002	US20020166840 Clad sheet for printed circuit board, a multilayered printed circuit board using thereof and maunfacturing method thereof
11/14/2002	US20020166774 Alloy composition and plating method
11/14/2002	US20020166773 Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings
11/14/2002	US20020166697 Circuit board construction
11/14/2002	US20020166696 Land grid array (LGA) pad repair structure and method
11/14/2002	US20020166694 Monolithic ceramic substrate and method for making the same
11/14/2002	US20020166689 High frequency semiconductor device housing package and mounting structure for mounting the same
11/14/2002	US20020166685 Circuit element mounting board and circuit element mounting method
11/14/2002	US20020166681 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
11/14/2002	US20020166680 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
11/14/2002	US20020166618 Capacitive filtered feedthrough array for an implantable medical device
11/14/2002	US20020166580 Method for fabricating a solar tile
11/14/2002	US20020166505 Squeegee unit and solder-paste printing machine
11/14/2002	US20020166425 Method for removing punched fragments and a method for producing an article by punching
11/14/2002	US20020166230 Metallized ceramic substrate and its use in forming a reliable, long-lived soldered electrical connection
11/14/2002	US20020166228 Process for integrated PC board
11/14/2002	DE10219138A1 Verfahren zur Herstellung einer flexiblen Leiterplatte A process for producing a flexible circuit board
11/14/2002	DE10206442A1 Targetted passivation of conductive track intermediate space or track regions on circuit board by applying conductive adhesive in region of tracks formed
11/14/2002	DE10206441A1 Substrate surface used as support for components in microelectronics industry, e.g. thermal sensor, comprises layer containing conducting particles, and support layer acting as the base support for conducting layer
11/14/2002	DE10206440A1 Circuit board through-hole connection method, by filling holes or openings with conductive adhesive and mounting SMD components
11/14/2002	DE10206439A1 Method for producing strip conductor structures as a connection between electrical/electrooptical component terminals uses a thread-type conductor line to go between terminals to be linked and to contact them with its ends.
11/14/2002	DE10206438A1 Method for forming and creating strip conductor structures on a substrate prepares a draft circuit for electrostatic charge patterns to generate a strip conductor structure.
11/14/2002	DE10206437A1 Production of conducting pathways on a substrate e.g. in microelectronics comprises applying a defined conducting adhesive on the substrate, partially hardening and repeating the previous steps
11/14/2002	DE10206435A1 Adhesive bonding process for forming electrically conducting structures on a substrate comprises using a conducting adhesive or similar material having selected properties
11/14/2002	DE10206434A1 Process for the selective metallization of partial structures or regions comprises applying a conducting adhesive or producing a conducting path on a substrate, and selectively depositing metal on the conducting adhesive
11/14/2002	DE10206433A1 Device for producing electrical elements e.g. resistors comprises a capillary arrangement in a dispensing arrangement for applying a conducting adhesive
11/14/2002	DE10122414A1 Durchkontaktierung von flexiblen Leiterplatten Through connection of flexible printed circuits
11/14/2002	DE10122393A1 Flexible Leiterfolie mit einer elektronischen Schaltung Flexible conductor film with an electronic circuit
11/14/2002	DE10119262A1 Printed board fabrication method involves coating photoresist and coating agents being patterned in accord with image composition on PS board
11/14/2002	CA2385904A1 Solder work material for forming solder-coated circuit board and circuit board
11/13/2002	EP1257157A1 Method for manufacturing printed circuit boards
11/13/2002	EP1257156A2 Flexible conductor foil comprising an electronic circuit
11/13/2002	EP1256982A1 Electronic Module and its Assembling Process
11/13/2002	EP1256408A1 Soldering method for joining flex circuits by diode laser
11/13/2002	EP1256263A2 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
11/13/2002	EP1256262A1 Package for microwave components
11/13/2002	EP1256144A1 Method for contacting a printed circuit board to a conductor arranged on a support, and device
11/13/2002	EP1255797A1 Method for roughening copper surfaces for bonding to substrates
11/13/2002	EP1255690A2 Method for fabricating micro-structures with various surface properties in multilayer body by plasma etching
11/13/2002	EP1255677A2 Method and apparatus of immobilizing solder spheres
11/13/2002	EP1144198B1 Thermal transfer element for forming multilayer devices
11/13/2002	EP1089799A4 Apparatus and method for recovering photoresist developers and strippers
11/13/2002	EP0909838B1 Electroless copper plating solution and method for electroless copper plating
11/13/2002	EP0842772B1 Printing method and apparatus
11/13/2002	EP0715570B1 Printed circuit board and method of its manufacture
11/13/2002	CN1379905A Electrical devices and process for making such devices

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