H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2002
11/21/2002	WO2002092276A1 Method and device for laser beam machining of laminated material
11/21/2002	WO2002092274A1 Method and apparatus for improving laser hole resolution
11/21/2002	WO2002069680A3 Adapter for plastic-leaded chip carrier (plcc) and other surface mount technology (smt) chip carriers
11/21/2002	WO2002066256A3 Process for the manufacture of printed circuit boards with plated resistors
11/21/2002	WO2002058444A3 High-g mounting arrangement for electronic chip carrier
11/21/2002	US20020174413 Design method for multilayer wiring board
11/21/2002	US20020173257 Polishing apparatus
11/21/2002	US20020173202 Printed circuit board mounted electrical connector
11/21/2002	US20020173192 Power semiconductor module with pressure contact means
11/21/2002	US20020173178 Peripheral circuit board for a liquid crystal display device and liquid crystal display device equipped therewith
11/21/2002	US20020173175 Interposer member having apertures for relieving stress and increasing contact compliancy
11/21/2002	US20020173146 Metal plated spring structure
11/21/2002	US20020173145 Electrical connection materials and electrical connection method
11/21/2002	US20020173136 Forming photoresist in aperture overcoating substrate; stacking solder bumps; bonding electrodes
11/21/2002	US20020173135 Forming photoresist in aperture overcoating substrate; stacking solder bumps; bonding electrodes
11/21/2002	US20020173109 Method and system of drying materials and method of manufacturing circuit boards using the same
11/21/2002	US20020172892 Metallizing method for dielectrics
11/21/2002	US20020172887 Electroluminescence; optics; electronics
11/21/2002	US20020172832 Process for producing a thin film el device
11/21/2002	US20020172812 Forming and attaching a resin porous layer onto a metal foil by a wet coagulating, wherein metal foil including a conductive bump having an almost equal height on a film forming side surface is used
11/21/2002	US20020172026 Electronic package with high density interconnect and associated methods
11/21/2002	US20020172022 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
11/21/2002	US20020172021 Multi-layer wiring substrate
11/21/2002	US20020172019 Method of manufacturing printed wiring board
11/21/2002	US20020172015 Electromechanical device for mounting an electronic assembly on a mounting rack, in particular for mounting a display instrument recessed in a dashboard
11/21/2002	US20020171954 Rearview mirror assembly construction
11/21/2002	US20020171906 Rearview mirror constructed for efficient assembly
11/21/2002	US20020171634 Data input device using a laminated substrate capable of reliably filling through holes with electroconductive material
11/21/2002	US20020171591 Ball grid array antenna
11/21/2002	US20020171530 Production method of thin film passive element formed on printed circuit board and thin film passive element produced by the method
11/21/2002	US20020171528 Process for producing resonant tag
11/21/2002	US20020171508 Front end module
11/21/2002	US20020171188 Holder for holding a printed circuit for exposure to light
11/21/2002	US20020171157 Electronic device
11/21/2002	US20020171154 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
11/21/2002	US20020171152 Flip-chip-type semiconductor device and manufacturing method thereof
11/21/2002	US20020171138 Multilayer wiring board and semiconductor device
11/21/2002	US20020171127 Apparatus for routing signals
11/21/2002	US20020171065 Circuit elements having an embedded conductive trace and methods of manufacture
11/21/2002	US20020171025 Component placement
11/21/2002	US20020170947 Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument
11/21/2002	US20020170946 Soldering method and soldering apparatus
11/21/2002	US20020170945 Solder ball attachment system
11/21/2002	US20020170943 Solder bonding technique for assembling a tilted detector chip
11/21/2002	US20020170939 Method for producing metal laminate
11/21/2002	US20020170901 Equipotential fault tolerant integrated circuit heater
11/21/2002	US20020170898 High-speed, precision, laser-based method and system for processing material of one or more targets within a field
11/21/2002	US20020170891 Laser machining system and method
11/21/2002	US20020170890 Precision spray processes for direct write electronic components
11/21/2002	US20020170886 Method and apparatus for improving laser hole resolution
11/21/2002	US20020170879 Methods and apparatus for forming submicron patterns on films
11/21/2002	US20020170876 Method for manufacturing printed-circuit board
11/21/2002	US20020170827 Electrodeposition layer is formed by circular oscillation electroplating on the inside wall surface of the hole and on the predetermined surface of the insulation resin layer
11/21/2002	US20020170748 Capacitor plate for substrate components
11/21/2002	US20020170747 Printed circuit board comprising an embedded functional element therein
11/21/2002	US20020170746 Organic packages with solders for reliable flip chip connections
11/21/2002	US20020170745 Multilayer board combound and method for the manufacture thereof
11/21/2002	US20020170744 Flexible circuit using discrete wiring
11/21/2002	US20020170740 Heat-resistant, flex-resistant flexible flat cable and process for producing the same
11/21/2002	US20020170732 Connection box
11/21/2002	US20020170660 Method for producing ceramic substrate
11/21/2002	US20020170573 Spraying a rinsing fluid onto a surface of a microelectronic device in an atmosphere of a gaseous surface tension reducing agent, to rinse away etching agent or oxidizing agent; and drying the device
11/21/2002	US20020170173 Method of production of circuit board, semiconductor device, and plating system
11/21/2002	US20020170171 Multilayer printed circuit board and method for making the same
11/21/2002	DE10218767A1 Elektronischer Baustein für die Oberflächenmontage Electronic component for surface mount
11/21/2002	DE10216526A1 Conductor track extrusion, comprises dispensing a continual profile section with a conductor, and stabilizing and solidifying the section on a substrate
11/21/2002	DE10138042A1 Electronic component has at least one semiconducting chip on first side of and electrically connected to wiring plate, conducting track structures and solder connection contacts on other side
11/21/2002	DE10129313C1 Sputtering process used for coating and/or surface treating substrates comprises activating the substrate surface in the regions exposed by an electrode mask by igniting a plasma, and coating the substrate in the exposed regions
11/21/2002	DE10124631C1 Direct electrolytic metallization of insulating substrate surface, used in circuit board production, e.g. for metallizing fine holes, uses pretreatment with water-soluble polymer and acid solutions of permanganate and thiophen compound
11/21/2002	DE10124328A1 Device for unsoldering electronic component has heat source at distance from bearer's component side so solder joint heating to melting point takes place indirectly by heating component
11/21/2002	DE10123996A1 Housing for electronic unit has at least one of wall movably joined to housing frame so that the capacity of the housing is variable; a movable floor with side walls and floor can be provided
11/21/2002	DE10123684A1 Circuit board, e.g. for measurement equipment, has contact sleeve in aperture mechanically fixed and electrically connected to metallisation around aperture by solder joint
11/21/2002	DE10122596A1 Contact bearer for plug contacting components has through holes for contact elements in contact with conducting track that protrude on underside, accept component plug contact elements
11/21/2002	DE10122276A1 Coating perforated walls in circuit boards comprises coating a circuit board on both sides with a protective layer so that the holes are opened
11/21/2002	DE10122221A1 Power electronics module with base plate and substrate soldered to it has base plate recess with at least dimensions of substrate and with wall regions inclined from out to in
11/21/2002	DE10120692A1 Montageanordnung von elektrischen und/oder elektronischen Bauteilen auf einer Leiterplatte A mounting arrangement of the electrical and / or electronic components on a printed circuit board
11/21/2002	DE10111683C1 Verfahren zur Herstellung eines Datenträgerkörpers A method for producing a data carrier body
11/21/2002	CA2447438A1 Method and apparatus for improving laser hole resolution
11/21/2002	CA2441103A1 Polyimide adhesion enhancement to polyimide film
11/20/2002	EP1259102A1 Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same
11/20/2002	EP1258893A1 Chip capacitor
11/20/2002	EP1258821A1 System for generating printed board three-dimensional shape data
11/20/2002	EP1258180A1 Method of printing and printing machine
11/20/2002	EP1258179A1 Electronic supports and methods and apparatus for forming apertures in electronic supports
11/20/2002	EP1258178A2 Electronic supports and methods and apparatus for forming apertures in electronic supports
11/20/2002	EP1257694A2 Conditioning of through holes and glass
11/20/2002	EP1257693A1 Composite copper foil and manufacturing method thereof
11/20/2002	EP1257682A2 Laser deposition process
11/20/2002	EP1082734B1 Transformer bobbin
11/20/2002	EP1015130B1 Electroforming method for making a squeegee blade
11/20/2002	EP0719442B1 Electrical assembly comprising a ptc resistive element
11/20/2002	CN2521869Y Intensifying positioning casing
11/20/2002	CN1381160A Method for producing ceramic substrate
11/20/2002	CN1381014A Information providing system, method, device and recording medium thereof
11/20/2002	CN1380981A Device and method for inspection of circuit basic board
11/20/2002	CN1380980A Device and method for inspection
11/20/2002	CN1380914A Electrochemical method for forming inorganic covering layer on surface of copper material
11/20/2002	CN1380664A Method for manufacturing laminated ceramic electronic element, and method for mfg. laminated inductor
11/20/2002	CN1380354A Moulded piece with higher durability for short-time loaded thermal deformation
11/20/2002	CN1380237A Transmission and fixed device for chip

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