H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2002
11/28/2002	DE10120256C1 Anschlußgehäuse für ein elektronisches Bauelement Connection housing for an electronic component
11/28/2002	CA2449198A1 Processes for the production of components of electronic apparatuses
11/28/2002	CA2437105A1 Direct electrolytic metallization of non-conducting substrates
11/27/2002	EP1261244A2 Metal foil laminated plate and method of manufacturing the same
11/27/2002	EP1261243A2 Method of manufacturing printed wiring board
11/27/2002	EP1261242A1 Method for manufacturing circuit board
11/27/2002	EP1261143A1 Transceiver front end module
11/27/2002	EP1261028A2 Cooling arrangement for an electronic apparatus
11/27/2002	EP1261026A1 Device having resin package and method of producing the same
11/27/2002	EP1261021A2 Method of production of circuit board, semiconductor device, and plating system
11/27/2002	EP1260998A1 Electronic component-use substrate and electronic component
11/27/2002	EP1260607A2 Plating method
11/27/2002	EP1260359A2 Method for manufacturing a laminated board
11/27/2002	EP1260303A1 Solder material for forming solder coated circuit board and circuit board
11/27/2002	EP1259967A1 Coil assembly with a circuit board and a coil body
11/27/2002	EP1169893B1 Method for introducing plated-through holes in an electrically insulating base material that is provided with metal layers on both sides
11/27/2002	EP1157459B1 Filter structures for integrated circuit interfaces
11/27/2002	EP1020104B1 Method for mounting semiconductor element to circuit board, and semiconductor device
11/27/2002	EP0932500A4 Method to control cavity dimensions of fired multilayer circuit boards on a support
11/27/2002	EP0921887B1 Method and apparatus for forming termination stripes
11/27/2002	EP0919375B1 Method for controlling screen printing machine
11/27/2002	EP0766829B1 Method of cleaning probe tips of probe cards
11/27/2002	CN1382317A Control device and soldering method
11/27/2002	CN1382233A Conveyorized electroplating device
11/27/2002	CN1382232A Method and device for electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
11/27/2002	CN1382231A Method and device for electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on surface of electrically insulating film materials and use of
11/27/2002	CN1382168A Radiation curable hot melt composition and process for application thereof
11/27/2002	CN1382011A Manufacturing method for multilayer ceramic substrate
11/27/2002	CN1382010A Printed circuit board and its making method and circuit module with printed circuit board
11/27/2002	CN1382009A Flexible printed circuit board with reinforced board
11/27/2002	CN1382008A Improved bonding strength between conductive paste and printed substrate and its production method
11/27/2002	CN1381935A Impact protection device containing hot melt sheet spring, melt sheet pulling and hoop device
11/27/2002	CN1381891A Semiconductor packaging device and mounting method of semiconductor packaging device
11/27/2002	CN1381877A Method for coupling exposed pad type semiconductor device with PCB
11/27/2002	CN1381860A Metal or metal compound pattern and the patten formed method and electron emission device, electronic source and imaging device using the pattern
11/27/2002	CN1381833A 结合柔性布线电路板 Combined with the flexible wired circuit board
11/27/2002	CN1095319C Circuit board assembly and heat conducting device
11/27/2002	CN1095316C Method and device for wave soldering
11/27/2002	CN1095315C Producing system and method for print board assembly in system controlled by computer
11/27/2002	CN1095176C Thin-film capacitor and its manufacturing method and hybrid circuit substrate and its assembling method
11/27/2002	CN1095175C Manufacturing method and apparatus for ceramic electronic components
11/27/2002	CN1095173C Rigid/flex printed circuit board and manufacturing method therefor
11/27/2002	CN1095095C Device for supporting artwork for light exposure installation of flat piece
11/27/2002	CN1095084C Optical/electrical hybrid wiring board and its manufacturing method
11/26/2002	US6487088 Package substrate
11/26/2002	US6487084 Printed circuit board comprising an embedded functional element therein
11/26/2002	US6487078 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
11/26/2002	US6487048 Conductive coating of flexible circuits for ils transmission lines
11/26/2002	US6486553 Semiconductor device with increased connection strength between solder balls and wiring layer
11/26/2002	US6486552 Method and apparatus for testing bumped die
11/26/2002	US6486551 Wired board and method of producing the same
11/26/2002	US6486415 Compliant layer for encapsulated columns
11/26/2002	US6486414 Through-hole structure and printed circuit board including the through-hole structure
11/26/2002	US6486413 Substrate coated with a conductive layer and manufacturing method thereof
11/26/2002	US6486412 Wiring board, method for producing same, display device, and electronic device
11/26/2002	US6486411 Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate
11/26/2002	US6486410 Flexible printed circuit board with resilient tabs and method of mounting components thereon
11/26/2002	US6486409 Flexible wiring substrate
11/26/2002	US6486408 Flexible circuit using discrete wiring
11/26/2002	US6486406 Latching apparatus and method for providing radial alignment of a housing mounted on a circuit board
11/26/2002	US6486394 Process for producing connecting conductors
11/26/2002	US6486235 Composition of epoxy resin, curing agent, phosphate of resorcinol, Al (OH)
11/26/2002	US6486052 Package having terminated plating layer and its manufacturing method
11/26/2002	US6485999 Wiring arrangements having electrically conductive cross connections and method for producing same
11/26/2002	US6485892 Method for masking a hole in a substrate during plating
11/26/2002	US6485885 Photopolymerizable thermosetting resin compositions
11/26/2002	US6485843 Apparatus and method for mounting BGA devices
11/26/2002	US6485833 Resin-coated metal foil
11/26/2002	US6485831 Conductive powder and making process
11/26/2002	US6485814 High density thin film circuit board and method of production thereof
11/26/2002	US6485682 Hardened aluminum alloy for use in the manufacture of printed circuit boards
11/26/2002	US6485620 Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product
11/26/2002	US6485591 Method for manufacturing laminated-ceramic electronic components
11/26/2002	US6485589 Melt-flowable materials and method of sealing surfaces
11/26/2002	US6485311 Compression connector actuation system
11/26/2002	US6485112 Assembly, with lead frame, for antilock brake system and associated method
11/26/2002	US6484927 Method and apparatus for balling and assembling ball grid array and chip scale array packages
11/26/2002	US6484708 Resin sealed electronic device
11/26/2002	US6484613 Electromagnetic bounce back braking for punch press and punch press process
11/26/2002	US6484395 Ultra-miniature electrical contacts and method of manufacture
11/26/2002	US6484394 Encapsulation method for ball grid array semiconductor package
11/26/2002	US6484393 Method for wire bonding to flexible substrates
11/26/2002	CA2215804C Multi-rate positioner system having an improved profiling filter
11/26/2002	CA2105653C Registration system
11/21/2002	WO2002093992A1 Printed circuit board comprising a contact sleeve that is mounted thereon
11/21/2002	WO2002093991A1 Method for electroless deposition and patterning of a metal on a substrate
11/21/2002	WO2002093990A2 Polyimide adhesion enhancement to polyimide film
11/21/2002	WO2002093989A1 Method for laser drilling in materials used for production of printed circuits
11/21/2002	WO2002093927A1 Device for arranging a photoelectric transducer at an electric signal processing device
11/21/2002	WO2002093685A1 Ball grid array antenna
11/21/2002	WO2002093649A2 Electronic module and method for assembling same
11/21/2002	WO2002093647A2 Electronic package with high density interconnect and associated methods
11/21/2002	WO2002093645A1 Improved surface mount package
11/21/2002	WO2002093595A2 Package level pre-applied underfills for thermo-mechanical reliability enhancements of electronic assemblies
11/21/2002	WO2002093472A1 Method for producing a contactless chip card using transfer paper
11/21/2002	WO2002093258A1 Method for producing stamping tools
11/21/2002	WO2002093223A1 Device for holding an optical fiber
11/21/2002	WO2002093222A1 Device for arranging a photoelectric transducer at an electric signal processing device
11/21/2002	WO2002092878A2 Electroless plating method and device, and substrate processing method and apparatus
11/21/2002	WO2002092326A1 Extrusion die

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