| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/04/2002 | EP1262094A1 Method for producing bond pads on a printed circuit |
| 12/04/2002 | EP1261999A2 Method and apparatus for delivering power to high performance electronic assemblies |
| 12/04/2002 | EP1261485A1 Improvements relating to screen printing apparatus |
| 12/04/2002 | EP1062289B1 Luminescent electroconductive adhesive |
| 12/04/2002 | EP0858901B1 Thermal print head |
| 12/04/2002 | CN1383708A Method and device for drying materials and method of producing circuit boards using same |
| 12/04/2002 | CN1383707A Method for mfg. printed-circuit board |
| 12/04/2002 | CN1383706A Carrier-foiled composite copper foil, method for mfg. printed circuit board with resistance circuit, and printed circuit board having resistance circuit |
| 12/04/2002 | CN1383705A Carrier-field copper foil circuit, printed circuit board mfg. method using circuit, and printed circuit board |
| 12/04/2002 | CN1383436A Epoxy resin compsn. and laminate using same |
| 12/04/2002 | CN1383355A Technology for making strengthened glass circuit board and its product and application |
| 12/04/2002 | CN1383353A Wiring substrate |
| 12/04/2002 | CN1383264A Electronic packaged assembly and prodn. method of substrate electrode |
| 12/04/2002 | CN1383221A Light source |
| 12/04/2002 | CN1383202A Conductor pattern formed by magnetic force |
| 12/04/2002 | CN1383197A Mfg. method of semiconductor device and semiconductor device |
| 12/04/2002 | CN1382831A Etching method and etching appts. |
| 12/04/2002 | CN1382556A Tube-like solder iron with detachable handle |
| 12/04/2002 | CN1095623C Composite coating composition for metal contg. copper |
| 12/04/2002 | CN1095583C Actuator having MR element protecting means |
| 12/03/2002 | US6490173 Method and apparatus for providing electromagnetic shielding |
| 12/03/2002 | US6490170 Package substrate |
| 12/03/2002 | US6490169 Conductive circuit structure having an electrically conductive surface fixed by collar walls |
| 12/03/2002 | US6490168 Interconnection of circuit substrates on different planes in electronic module |
| 12/03/2002 | US6490164 Attachment structure of electronic component to circuit board and clip used in attachment of the electronic component |
| 12/03/2002 | US6490161 Peripheral land grid array package with improved thermal performance |
| 12/03/2002 | US6490160 Vapor chamber with integrated pin array |
| 12/03/2002 | US6489880 Mounting structure for thermistor with positive resistance-to-temperature characteristic |
| 12/03/2002 | US6489685 Component built-in module and method of manufacturing the same |
| 12/03/2002 | US6489681 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 12/03/2002 | US6489680 Semiconductor device |
| 12/03/2002 | US6489586 Method and apparatus for verification of assembled printed circuit boards |
| 12/03/2002 | US6489573 Electrode bonding structure for reducing the thermal expansion of the flexible printed circuit board during the bonding process |
| 12/03/2002 | US6489277 Quasi-azeotropic mixture based on 1,1,1,3,3-pentafluorobutane, methylene chloride and methanol for the treatment of solid surfaces |
| 12/03/2002 | US6489184 Removing inherent stress via high temperature annealing |
| 12/03/2002 | US6489042 Covercoats to protect the circuitry |
| 12/03/2002 | US6489035 Printed circuit boards; copper surface stabilization with layer of zinc oxide, chromium oxide or nickel oxide; vapor deposition metal, alloy, nitride, silicide or oxide electrical resistance material |
| 12/03/2002 | US6489034 Stabilizing copper surface with layer of zinc oxide, chromium oxide or nickel oxide; vapor depositing aluminum, nickel, chromium, copper, iron, indium, zinc, tantalum, vanadium, tin, tungsten, zirconium and/or molybdenum |
| 12/03/2002 | US6489014 Wiring board |
| 12/03/2002 | US6489013 Polyamideimide with siloxane bonds, high molecular weight acrylic polymer, thermoset resin and solvent; low thermal stress and modulus of elasticity; heat resistance |
| 12/03/2002 | US6489012 Printed circuit board for RAMBUS |
| 12/03/2002 | US6488879 Method of producing an electronic device having a sheathed body |
| 12/03/2002 | US6488869 Conductive paste, its manufacturing method, and printed wiring board using the same |
| 12/03/2002 | US6488795 Multilayered ceramic substrate and method of producing the same |
| 12/03/2002 | US6488781 Soldering paste, soldering method, and surface-mounted type electronic device |
| 12/03/2002 | US6488199 Method for improving the manufacturing safety of weld joints |
| 12/03/2002 | US6487774 Method of forming an electronic component using ink |
| 12/03/2002 | CA2267292C Low profile connector |
| 11/28/2002 | WO2002096178A1 Shield material and method of manufacturing the shield material |
| 11/28/2002 | WO2002096176A2 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield |
| 11/28/2002 | WO2002096172A1 Method for manufacturing ceramic multilayered board |
| 11/28/2002 | WO2002096171A1 Method for producing components for electronic devices |
| 11/28/2002 | WO2002096170A1 Method for producing a contact substrate, and corresponding contact substrate |
| 11/28/2002 | WO2002096169A1 Printed circuit board with mounted components housed in a resin foil |
| 11/28/2002 | WO2002096168A2 Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
| 11/28/2002 | WO2002096167A1 Method for drilling microholes using a laser beam |
| 11/28/2002 | WO2002096165A1 Conductive foil, such as a conductive foil cable or a conductive foil plate |
| 11/28/2002 | WO2002095992A1 Data processing terminal, parent substrate, child substrate, terminal design apparatus and method, computer program, and information storage medium |
| 11/28/2002 | WO2002095816A1 Method for contacting an electrical component with a substrate comprising a conducting structure |
| 11/28/2002 | WO2002095091A2 Direct electrolytic metallization of non-conducting substrates |
| 11/28/2002 | WO2002094558A1 Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them |
| 11/28/2002 | WO2001022785A9 Solder-bearing wafer for use in soldering operations |
| 11/28/2002 | US20020178429 Wiring board design aiding apparatus, design aiding method, storage medium, and computer program |
| 11/28/2002 | US20020177360 Composite electronic component and method of producing same |
| 11/28/2002 | US20020177335 Card-type portable device |
| 11/28/2002 | US20020177295 Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof |
| 11/28/2002 | US20020177255 Process for manufacturing ic card |
| 11/28/2002 | US20020177006 Structure having flush circuitry features and method of making |
| 11/28/2002 | US20020177000 Treating a polyimide film having a biphenyltetracarboxylic acid unit with a solution containing a sodium and/or potassium permanganate and potassium and/or sodium hydroxide and treating surface with acid; peel strength |
| 11/28/2002 | US20020176961 Method of manufacturing multilayer substrates |
| 11/28/2002 | US20020176950 Method of manufacturing laminate and grommet used for the method |
| 11/28/2002 | US20020176618 Method and apparatus for distinguishing regions where a material is present on a surface. |
| 11/28/2002 | US20020176241 Holding device for a cable harness |
| 11/28/2002 | US20020176237 Capacitor for Dram Connector |
| 11/28/2002 | US20020176230 Vertical surface mount apparatus with thermal carrier |
| 11/28/2002 | US20020176229 Separable power delivery connector |
| 11/28/2002 | US20020176064 Board-stage for an aligner |
| 11/28/2002 | US20020175801 Surface-mount positive coefficient thermistor and method for making the same |
| 11/28/2002 | US20020175780 Directional coupler |
| 11/28/2002 | US20020175748 Filter circuit and electronic device using the same |
| 11/28/2002 | US20020175669 Film-based microwave and millimeter-wave circuits and sensors |
| 11/28/2002 | US20020175533 Method and apparatus for supporting an electrical circuit board in a vehicle panel closure |
| 11/28/2002 | US20020175438 Apparatus and method for filling high aspect ratio via holes in electronic substrates |
| 11/28/2002 | US20020175410 BGA substrate via structure |
| 11/28/2002 | US20020175407 Flip chip package, circuit board thereof and packaging method thereof |
| 11/28/2002 | US20020175402 Structure and method of embedding components in multi-layer substrates |
| 11/28/2002 | US20020175397 Wiring substrate and method for producing the same |
| 11/28/2002 | US20020175396 Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same |
| 11/28/2002 | US20020175333 Means for mounting photoelectric sensing Elements, light emitting diodes, or the like |
| 11/28/2002 | US20020175331 Structure and method for mounting a semiconductor element |
| 11/28/2002 | US20020175316 For accelerating heat conductance; tin, bismuth, indium, and lead alloys formed via heat treatment; adhesion |
| 11/28/2002 | US20020174937 Methods and apparatus for manufacturing patterned ceramic green-sheets and multilayered ceramic devices |
| 11/28/2002 | US20020174936 Cast-on-resist (COR) methods; Multilayered Microfluidic Device (MMD) for example |
| 11/28/2002 | US20020174935 Methods for manufacturing patterned ceramic green-sheets and multilayered ceramic packages |
| 11/28/2002 | US20020174539 Method of repairing disconnected wiring and multilevel wiring structure |
| 11/28/2002 | DE10145554C1 Device for transporting and wet chemical treating and/or electrolytically treating flat and very thin material comprises support arms, a guide, supporting elements, tensioning stands with hanging elements and fixing rods |
| 11/28/2002 | DE10123249A1 Circuit with bearer arrangement has at least two circuit boards electrically connected together by contacts attached to bearer arrangement, other components connected via the contacts |
| 11/28/2002 | DE10121970A1 Leistungshalbleitermodul in Druckkontaktierung Power semiconductor module in pressure contact |
| 11/28/2002 | DE10121776A1 Sensor Sensor |
| 11/28/2002 | DE10121108A1 Electronic unit for vehicle, has one pin pressed into aperture in first conducting surface of first polarity, another pressed into second surface of second polarity, and insulating layer between surfaces |