| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/05/2002 | WO2002096640A1 Recessed patterns in a multilayered ceramic package |
| 12/05/2002 | WO2002066251A3 Printing plates |
| 12/05/2002 | US20020184426 Method of terminating bus, bus termination resistor, and wiring substrate having terminated buses and method of its manufacture |
| 12/05/2002 | US20020182958 Multilayer printed wiring board |
| 12/05/2002 | US20020182903 Printed wiring board and manufacturing method therefor |
| 12/05/2002 | US20020182900 Enhanced electrical/mechanical connection for electronic devices |
| 12/05/2002 | US20020182843 Method for connecting semiconductor unit to object via bump |
| 12/05/2002 | US20020182842 Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module |
| 12/05/2002 | US20020182832 Method and article for filling apertures in a high performance electronic substrate |
| 12/05/2002 | US20020182804 Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device |
| 12/05/2002 | US20020182770 Lead-bond type chip package and manufacturing method thereof |
| 12/05/2002 | US20020182540 For forming an electrode arrangement for a plasma display panel device |
| 12/05/2002 | US20020182436 Freestanding reactive multilayer foils |
| 12/05/2002 | US20020182434 Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer |
| 12/05/2002 | US20020182433 Composite metal layer, comprises (I) copper, (II) tungsten or molybdenum and (III) nickel, cobalt, iron or zinc; and a roughened layer of copper formed on the composite metal layer. |
| 12/05/2002 | US20020182432 Laser hole drilling copper foil |
| 12/05/2002 | US20020182398 Rigid-printed wiring board and production method of the rigid-printed wiring board |
| 12/05/2002 | US20020182385 Atomic layer passivation |
| 12/05/2002 | US20020182374 Lamination method of embedding passive components in an organic circuit board |
| 12/05/2002 | US20020182344 Laser deposition of elements onto medical devices |
| 12/05/2002 | US20020182308 Method for electroless gold plating of conductive traces on printed circuit boards |
| 12/05/2002 | US20020182025 Detailing tool for substrates having a self-alignment feature |
| 12/05/2002 | US20020181760 Hole inspection apparatus and method |
| 12/05/2002 | US20020181233 Illumination for inspecting surfaces of articles |
| 12/05/2002 | US20020181231 Diode lighting system |
| 12/05/2002 | US20020181218 Electronic structure |
| 12/05/2002 | US20020181216 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 12/05/2002 | US20020181214 Module having integrated circuit packages coupled to multiple sides with package types selected based on inductance of leads to couple the module to another component |
| 12/05/2002 | US20020181211 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 12/05/2002 | US20020181210 Flexible printed circuit board |
| 12/05/2002 | US20020181208 Multi-feature-size electronic structures |
| 12/05/2002 | US20020181185 Multi-layer wiring board |
| 12/05/2002 | US20020181155 Head suspension for disk drive and method of manufacturing head suspension |
| 12/05/2002 | US20020180962 Device and method for inspecting a three-dimensional surface structure |
| 12/05/2002 | US20020180686 Liquid crystal display device having a drive IC mounted on a flexible board directly connected to a liquid crystal panel |
| 12/05/2002 | US20020180576 Chip thermistor and chip thermistor mounting structure |
| 12/05/2002 | US20020180567 Microwave circuit |
| 12/05/2002 | US20020180517 Signal buffers for printed circuit boards |
| 12/05/2002 | US20020180465 Wideband bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure |
| 12/05/2002 | US20020180454 Inspection unit and method of manufacturing substrate |
| 12/05/2002 | US20020180430 Fixture for plate type magnetic resistance sensor chip element |
| 12/05/2002 | US20020180098 Mixture of thermplastic polyester, rubber, filler and flam retarders |
| 12/05/2002 | US20020180063 Semiconductor module |
| 12/05/2002 | US20020180039 Pre-curved spring bolster plate |
| 12/05/2002 | US20020180029 Semiconductor device with intermediate connector |
| 12/05/2002 | US20020180027 Semiconductor module and method of making the device |
| 12/05/2002 | US20020180015 Semiconductor module |
| 12/05/2002 | US20020180004 Circuitized substrate for high-frequency applications |
| 12/05/2002 | US20020179917 High-voltage hybrid circuit |
| 12/05/2002 | US20020179904 Contact structure production method |
| 12/05/2002 | US20020179696 Solder-ball bonding device and method |
| 12/05/2002 | US20020179695 Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed |
| 12/05/2002 | US20020179692 Pin attachment by a surface mounting method for fabricating organic pin grid array packages |
| 12/05/2002 | US20020179690 Flux applying method, flow soldering method and devices therefor and electronic circuit board |
| 12/05/2002 | US20020179676 PCB support plate for PCB via fill |
| 12/05/2002 | US20020179584 Method and process of contact to a heat softened solder ball array |
| 12/05/2002 | US20020179335 Method for filling high aspect ratio via holes in electronic substrates and the resulting holes |
| 12/05/2002 | US20020179334 Solid via layer to layer interconnect |
| 12/05/2002 | US20020179333 Circuit board and manufacturing method therefor |
| 12/05/2002 | US20020179332 Wiring board and a method for manufacturing the wiring board |
| 12/05/2002 | US20020179331 Printed wiring board interposer sub-assembly and method |
| 12/05/2002 | US20020179329 Method for fabricating wiring board provided wiht passive element, and wiring board provided with passive element |
| 12/05/2002 | US20020179328 Method of mounting electronic parts with Sn-Zn solder free of Pb without reduction in bonding strength |
| 12/05/2002 | US20020179327 Semiconductor chip soldering land pattern |
| 12/05/2002 | US20020179326 Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics |
| 12/05/2002 | US20020179325 Electrical connection with inwardly deformable contact |
| 12/05/2002 | US20020179324 Method and structure for repairing or modifying surface connections on circuit boards |
| 12/05/2002 | US20020179323 Structure comprising a printed circuit board with electronic components mounted thereon and a method for manufacturing the same |
| 12/05/2002 | US20020179322 Method of packaging electronic components without creating unnecessary solder balls |
| 12/05/2002 | US20020179320 Flexible conductive sheet |
| 12/05/2002 | US20020179319 ESD safe wireless type of component |
| 12/05/2002 | US20020179313 Cable connection structure and electronic apparatus having the same |
| 12/05/2002 | US20020179289 Power module and method of manufacturing the same |
| 12/05/2002 | US20020179241 Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method |
| 12/05/2002 | US20020179239 Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit |
| 12/05/2002 | US20020179234 Process for bonding conductor tracks to plastics surfaces |
| 12/05/2002 | US20020178943 Screen printing method and screen printing apparatus |
| 12/05/2002 | US20020178942 Printing plate, and printing method using the same |
| 12/05/2002 | US20020178879 Used PCB milling cutter reclamation method |
| 12/05/2002 | DE10222134A1 Schaltplattentisch für ein Ausrichtgerät Circuit board table for an aligner |
| 12/05/2002 | DE10220924A1 Sensorschaltungsmodul und elektronische Vorrichtung unter Verwendung desselben The same sensor circuit module and electronic device using |
| 12/05/2002 | DE10218078A1 Flexible Leiterplatte und Verfahren zu deren Herstellung Flexible printed circuit board and process for their preparation |
| 12/05/2002 | DE10126655A1 Circuit board for electronic equipment, has electronic component on first surface with first and second contact surfaces connected by solder or adhesive to first and second contact points with access to track |
| 12/05/2002 | DE10125745A1 Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung Method for shielding a realized on a circuit board electrical circuit and an appropriate combination of a circuit board with a shield |
| 12/05/2002 | DE10125497A1 Verfahren zur Herstellung eines Kontaktsubstrats sowie Kontaktsubstrat A method of forming a contact substrate, and contact substrate |
| 12/05/2002 | DE10125417A1 Coating support comprises feeding coating material to tool head, and melting on support before applying coating |
| 12/05/2002 | DE10124419A1 Cap-like screening device for electrical components has earth pins with slanting edges for insertion into ground holes of circuit board |
| 12/04/2002 | EP1263273A2 A structure comprising a printed circuit board with electronic components mounted thereon and method for manufacturing the same |
| 12/04/2002 | EP1263272A2 Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board |
| 12/04/2002 | EP1263271A2 A method of packaging electronic components with high reliability |
| 12/04/2002 | EP1263270A2 A method of packaging electronic components without creating unnecessary solder balls |
| 12/04/2002 | EP1263269A1 Foil conductor, such as foil conductor cable or foil circuit board |
| 12/04/2002 | EP1263136A2 Filter structures for integrated circuit interfaces |
| 12/04/2002 | EP1263038A2 Electronic component and mobile communication device using such electronic component |
| 12/04/2002 | EP1263000A1 Flat cable |
| 12/04/2002 | EP1262887A2 Design method for multilayer wiring board |
| 12/04/2002 | EP1262782A2 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 12/04/2002 | EP1262765A1 Method and apparatus for detecting defects in raw printed circuit boards |
| 12/04/2002 | EP1262358A1 Vehicle instrument panel with flexible foam closure cap in which an electrical circuit board is embedded and vehicle component having an electrical circuit board at least partially embedded in a flexible foam material |
| 12/04/2002 | EP1262297A1 Method for producing prepreg, preprig, metal-clad laminate and printed wiring board |