| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/12/2002 | US20020185302 Method for manufacturing a multi-layer printed circuit board |
| 12/12/2002 | US20020185301 Method and apparatus for testing bumped die |
| 12/12/2002 | US20020185221 Continuously bonding metal foil to a surface(s) of a prepreg having multiple layers of thermosetting resin; printed circuit boards; high sheet thickness precision (thickness accuracy); stable impedance; electronics/communication |
| 12/12/2002 | US20020185065 Electrolyte-spraying casing for an electroplating apparatus |
| 12/12/2002 | US20020185020 Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board |
| 12/12/2002 | US20020184759 Process for producing a contact-making device |
| 12/12/2002 | US20020184757 Hole plugging method for printed circuit boards, and hole plugging device |
| 12/12/2002 | US20020184756 Wiring process |
| 12/12/2002 | DE10224789A1 Vergossene integrierte Hybridschaltung und Verfahren zur Herstellung der vergossenen integrierten Hybridschaltung Encapsulated hybrid integrated circuit and methods for preparing the encapsulated hybrid integrated circuit |
| 12/12/2002 | DE10222670A1 Elektrische Vorrichtung, welche eine Metallkontaktstelle besitzt, auf die eine Metallverdrahtung gebondet ist, und ein Herstellungsverfahren davon An electrical device which has a metal pad to which a metal wiring is bonded, and a manufacturing method thereof |
| 12/12/2002 | DE10128161A1 Processing circuit board involves using continuous circulating grinding strip, pressing strip onto coating to be removed, removing coating to defined extent, cleaning board with water, drying |
| 12/12/2002 | DE10127334A1 Leiterplatte Circuit board |
| 12/12/2002 | DE10126859A1 Production of conducting structures used in organic FETs, illuminated diodes, organic diodes and integrated circuits comprises directly or indirectly forming conducting pathways |
| 12/12/2002 | DE10126734A1 Umverdrahtungsverfahren Umverdrahtungsverfahren |
| 12/12/2002 | DE10109786A1 Verfahren zur Herstellung von Leiterplatten Process for the preparation of printed circuit boards |
| 12/11/2002 | EP1265470A2 Method of manufacturing a wiring board |
| 12/11/2002 | EP1265469A2 Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed |
| 12/11/2002 | EP1265468A2 Method for manufacturing a composite member |
| 12/11/2002 | EP1265467A2 Multilayer board having precise perforations and circuit substrate having precise through-holes |
| 12/11/2002 | EP1265466A2 Method for fabrication wiring board provided with passive element and wiring board provided with passive element |
| 12/11/2002 | EP1265465A2 Printed circuit board |
| 12/11/2002 | EP1265464A2 Electronic component and method of manufacturing the same |
| 12/11/2002 | EP1265463A2 Method for manufacturing circuit board and circuit board and power conversion module using the same |
| 12/11/2002 | EP1264918A1 Electrolytic copper plating method |
| 12/11/2002 | EP1264685A1 Multilayered 4-methyl-1-pentene copolymer film and process for producing the same |
| 12/11/2002 | EP1264683A1 Copper-clad laminate |
| 12/11/2002 | EP1264377A1 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial-shielded energy pathways |
| 12/11/2002 | EP1264347A2 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 12/11/2002 | EP1264344A1 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same |
| 12/11/2002 | CN1384922A Wafer-level burn-in and test cartridge and methods |
| 12/11/2002 | CN1384782A Treated copper foil and process for making treated copper foil |
| 12/11/2002 | CN1384773A Composition for preventing creeping of flux for soldering and use thereof |
| 12/11/2002 | CN1384704A Parts installation device |
| 12/11/2002 | CN1384701A Multi-layered printed circuit board and its making process |
| 12/11/2002 | CN1384700A Manufacture of multi-layered ceramic substrate |
| 12/11/2002 | CN1384699A Tin solder jointing method and electronic circuit base board and electronic equipment made in the said method |
| 12/11/2002 | CN1384698A Method and apparatus for producing single ceramic electronic element |
| 12/11/2002 | CN1384697A Wire circuit board |
| 12/11/2002 | CN1384606A Surface mounted electronic element |
| 12/11/2002 | CN1384561A Transparent antenna for radio mobile communication terminal and its making process |
| 12/11/2002 | CN1384158A Resin material for decoration and sweller for deterging and eliminating the resin material |
| 12/11/2002 | CN1384144A Thermosetting epoxy resin composition and its formed body and multilayered printed circuit board |
| 12/11/2002 | CN1384138A Photosensitive insulated glue composition and photosensitive film of the glue |
| 12/11/2002 | CN1384123A Synthesis of polymer and film of the polymer |
| 12/11/2002 | CN1383956A Welding flux and welding slag separator |
| 12/11/2002 | CN1096222C Printed circuit multilayer assembly and method of manufacture therefor |
| 12/11/2002 | CN1096221C Cleaning device for contact surface on PCB |
| 12/11/2002 | CN1096123C Solder holding clips for applying solder to connectors |
| 12/11/2002 | CN1096091C Chip aluminium electrolytic capacitor |
| 12/11/2002 | CN1095882C Electrolytic treating device for plate-like workpieces, in particular print circuit boards |
| 12/11/2002 | CN1095698C Binder coating device |
| 12/10/2002 | US6493861 Interconnected series of plated through hole vias and method of fabrication therefor |
| 12/10/2002 | US6493857 Matching circuit parts between circuitry-related documents |
| 12/10/2002 | US6493240 Interposer for connecting two substrates and resulting assembly |
| 12/10/2002 | US6493238 Method and apparatus to compliantly interconnect area grid arrays and printed wiring boards |
| 12/10/2002 | US6493234 Electronic components mounting structure |
| 12/10/2002 | US6493233 PCB-to-chassis mounting schemes |
| 12/10/2002 | US6493228 Heat radiation packaging structure for an electric part and packaging method thereof |
| 12/10/2002 | US6493064 Method and apparatus for registration control in production by imaging |
| 12/10/2002 | US6493059 Installation for exposing a double-sided printed circuit card to light |
| 12/10/2002 | US6492829 Contactor for inspection |
| 12/10/2002 | US6492738 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 12/10/2002 | US6492728 Vertical surface mount assembly |
| 12/10/2002 | US6492714 Semiconductor device and semiconductor module |
| 12/10/2002 | US6492713 Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components |
| 12/10/2002 | US6492698 Flexible circuit with two stiffeners for optical module packaging |
| 12/10/2002 | US6492620 Equipotential fault tolerant integrated circuit heater |
| 12/10/2002 | US6492616 Processes for laser beam machining of resin film for wiring boards and manufacture of wiring boards |
| 12/10/2002 | US6492600 Laminate having plated microvia interconnects and method for forming the same |
| 12/10/2002 | US6492599 Multilayer wiring board, manufacturing method thereof, and wafer block contact board |
| 12/10/2002 | US6492598 Printed circuit board assembly and method for making a printed circuit board assembly |
| 12/10/2002 | US6492597 Wiring substrate, multi-layered wiring substrate and method of fabricating those |
| 12/10/2002 | US6492254 Ball grid array (BGA) to column grid array (CGA) conversion process |
| 12/10/2002 | US6492252 Method of connecting a bumped conductive trace to a semiconductor chip |
| 12/10/2002 | US6492201 Forming microelectronic connection components by electrophoretic deposition |
| 12/10/2002 | US6492197 Trilayer/bilayer solder bumps and fabrication methods therefor |
| 12/10/2002 | US6492071 Wafer scale encapsulation for integrated flip chip and surface mount technology assembly |
| 12/10/2002 | US6492009 Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process |
| 12/10/2002 | US6492008 Multilayer printed wiring board and electronic equipment |
| 12/10/2002 | US6492007 Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same |
| 12/10/2002 | US6491983 Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application |
| 12/10/2002 | US6491968 Methods for making spring interconnect structures |
| 12/10/2002 | US6491825 Method for using a magnetic treatment apparatus for fluids |
| 12/10/2002 | US6491737 High-speed fabrication of highly uniform ultra-small metallic microspheres |
| 12/10/2002 | US6491529 Molded and plated electrical interface component |
| 12/10/2002 | US6491215 Electronic verification machine for documents |
| 12/10/2002 | US6491205 Assembly of multi-chip modules using eutectic solders |
| 12/10/2002 | US6491204 Stencil wiping device |
| 12/10/2002 | US6490786 Circuit assembly and a method for making the same |
| 12/06/2002 | CA2383320A1 Printed circuit board |
| 12/05/2002 | WO2002098195A1 Hot air removable nozzle |
| 12/05/2002 | WO2002098194A1 Copper plated circuit layer-carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer-carrying copper clad laminated sheet |
| 12/05/2002 | WO2002098193A1 A method for applying thick copper on substrates |
| 12/05/2002 | WO2002097860A2 Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics |
| 12/05/2002 | WO2002097724A1 Multi-feature-size electronic structures |
| 12/05/2002 | WO2002097534A2 Apparatus and method for aligning an article with a reference object |
| 12/05/2002 | WO2002097366A1 Observation device using light and x-ray, exposure system and exposure method |
| 12/05/2002 | WO2002097002A1 Ultraviolet activatable adhesive film |
| 12/05/2002 | WO2002096987A1 Copper foil with resin and printed wiring boards made by using the same |
| 12/05/2002 | WO2002096969A1 Light- and heat-curing resin composition |