| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/17/2002 | US6495772 High performance dense wire for printed circuit board |
| 12/17/2002 | US6495771 Compliant multi-layered circuit board for PBGA applications |
| 12/17/2002 | US6495769 Wiring board and production method thereof, and semiconductor apparatus |
| 12/17/2002 | US6495768 Tape carrier package and method of fabricating the same |
| 12/17/2002 | US6495758 Anisotropically electroconductive connecting material |
| 12/17/2002 | US6495714 Method for producing alkanesulfonic acids |
| 12/17/2002 | US6495462 Components with releasable leads |
| 12/17/2002 | US6495456 Method of manufacturing chip type electronic parts |
| 12/17/2002 | US6495441 Semiconductor device with gold bumps, and method and apparatus of producing the same |
| 12/17/2002 | US6495397 Fluxless flip chip interconnection |
| 12/17/2002 | US6495394 Chip package and method for manufacturing the same |
| 12/17/2002 | US6495239 Dielectric structure and method of formation |
| 12/17/2002 | US6495211 Process for producing a substrate and plating apparatus |
| 12/17/2002 | US6495199 Method for deposition of a viscous material on a substrate |
| 12/17/2002 | US6495053 Electrical circuit board and a method for making the same |
| 12/17/2002 | US6495022 Electolysis to create an alloy of copper, tungsten and/or molybdenum, nickel, cobalt, iron and/or zinc and chlorine |
| 12/17/2002 | US6495020 Method of manufacturing a brain probe assembly |
| 12/17/2002 | US6494754 Solder-holding clips for applying solder to connectors or the like |
| 12/17/2002 | US6494725 Electrical connector |
| 12/17/2002 | US6494724 Electrical connector with terminal tail aligning device |
| 12/17/2002 | US6494723 Terminal that provides connection between a wire circuit and a printed circuit, and electric junction box including said terminal |
| 12/17/2002 | US6494522 Door module with electrical wires and connectors |
| 12/17/2002 | US6494361 Semiconductor module package substrate fabrication method |
| 12/17/2002 | US6494174 Wiring harness assembly for an intake manifold |
| 12/17/2002 | US6494134 Frame for foil stencil and stencil foil assembly |
| 12/17/2002 | US6494133 Screen printing method and screen printing machine |
| 12/17/2002 | US6494132 Screen printer and a screen printing method |
| 12/17/2002 | US6494118 Method and equipment for removing insulation from a flat cable |
| 12/17/2002 | US6493934 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 12/17/2002 | US6493933 Method of making flexible electronic circuitry |
| 12/17/2002 | US6493932 Lidless socket and method of making same |
| 12/17/2002 | US6493928 Electronic unit manufacturing apparatus |
| 12/17/2002 | CA2267293C High density connector and method of manufacture |
| 12/17/2002 | CA2245540C Dual-curing coating formulation and method |
| 12/12/2002 | WO2002100142A1 Wiring board and its production method |
| 12/12/2002 | WO2002100141A1 Method for manufacturing printed circuit boards from an extruded polymer |
| 12/12/2002 | WO2002100140A2 Circuit board with at least one electronic component |
| 12/12/2002 | WO2002100139A1 A method of forming flexible insulation protection film of flexible circuit board and flexible circuit board formed with flexible insulation protection film and production method therefor |
| 12/12/2002 | WO2002100138A1 Electronic component-use material and electronic componsnet usint it |
| 12/12/2002 | WO2002100137A1 Method and device for structuring printed circuit boards |
| 12/12/2002 | WO2002100136A1 Composite copper foil with copper or copper alloy support body, and printed circuit board using the composite copper foil |
| 12/12/2002 | WO2002100135A2 Flexible polyimide circuitsubstrates having predeterminded slopedvias |
| 12/12/2002 | WO2002099908A1 Method for producing conductive structures by means of a printing technique, and active components produced therefrom for integrated circuits |
| 12/12/2002 | WO2002099876A1 Semiconductor device |
| 12/12/2002 | WO2002099851A2 Temperature controlled vacuum chuck |
| 12/12/2002 | WO2002099850A2 Interchangeable microdeposition head apparatus and method |
| 12/12/2002 | WO2002099849A2 Apparatus for microdeposition of multiple fluid materials |
| 12/12/2002 | WO2002099848A2 Formation of printed circuit board structures using piezo microdeposition |
| 12/12/2002 | WO2002099665A1 Signal buffers for printed circuit boards |
| 12/12/2002 | WO2002099161A2 Method for the deposition of materials from mesomorphous films |
| 12/12/2002 | WO2002098638A1 Three-dimensional nonwoven substrate for circuit board |
| 12/12/2002 | WO2002098601A1 Soldering flux vehicle additive |
| 12/12/2002 | WO2002098598A2 Improved solder printing method |
| 12/12/2002 | WO2002098596A1 Machining device and machining method |
| 12/12/2002 | WO2002098593A1 Method for solidifying liquid metal, method for jointing metal members utilizing the same and jointed structure |
| 12/12/2002 | WO2002098582A2 Dimensionally stable composite article and method of making the same |
| 12/12/2002 | WO2002098580A1 Method of and apparatus for substrate pre-treatment |
| 12/12/2002 | WO2002098576A1 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like |
| 12/12/2002 | WO2002098575A1 Over-clocking in a microdeposition control system to improve resolution |
| 12/12/2002 | WO2002098574A1 Microdeposition apparatus |
| 12/12/2002 | WO2002098573A1 Waveform generator for microdeposition control system |
| 12/12/2002 | WO2002067294A3 Arrangement and a method for reducing contamination with particles on a substrate in a process tool |
| 12/12/2002 | US20020187689 Bonded structure and electronic circuit board |
| 12/12/2002 | US20020187688 Electrical solder ball contact |
| 12/12/2002 | US20020187681 Quadrax to twinax conversion apparatus and method |
| 12/12/2002 | US20020187662 Photolithographically-patterned out-of-plane coil structures and method of making |
| 12/12/2002 | US20020187626 Vertical surface mount assembly and methods |
| 12/12/2002 | US20020187588 Stacked semiconductor device manufacturing method |
| 12/12/2002 | US20020187585 Ball grid array module and method of manufacturing same |
| 12/12/2002 | US20020187584 Two-stage transfer molding method to encapsulate mmc module |
| 12/12/2002 | US20020187353 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same |
| 12/12/2002 | US20020187352 Insulating film having improved adhesive strength and board having the insulating film |
| 12/12/2002 | US20020187334 Two-metal tab tape, double-sided csp tape, bga tape and method for manufacturing the same |
| 12/12/2002 | US20020187321 Utilizing a transparentizing composition comprising an acrylated epoxy oligomer and a blend of acrylate monomers; curing |
| 12/12/2002 | US20020187319 Electrical device having metal pad bonded with metal wiring and manufacturing method thereof |
| 12/12/2002 | US20020187318 Lead frame and production process thereof and production process of thermally conductive substrate |
| 12/12/2002 | US20020187316 Hole fill composition and method for filling holes in a substrate |
| 12/12/2002 | US20020187267 Method of producing the plated molded articles by non-electrode plating, and the resin compositions for that use |
| 12/12/2002 | US20020187266 Metal film pattern and manufacturing method thereof |
| 12/12/2002 | US20020187264 Soldering flux vehicle additive and fine pitch printing method |
| 12/12/2002 | US20020186552 Module component and method of manufacturing the same |
| 12/12/2002 | US20020186549 Alternative method used to package multi media card by transfer molding |
| 12/12/2002 | US20020186508 Attachment of a head-gimbal assembly to a printed circuit board actuator arm using Z-axis conductive adhesive film |
| 12/12/2002 | US20020186100 Isolating energy conditioning shield assembly |
| 12/12/2002 | US20020186034 Apparatus for producing and testing electronic units |
| 12/12/2002 | US20020185810 Conveyor and fixing unit for substrates |
| 12/12/2002 | US20020185752 Potted hybrid integrated circuit and method for manufacturing potted hybrid integrated circuit |
| 12/12/2002 | US20020185747 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 12/12/2002 | US20020185746 Ball grid array IC package and manufacturing method thereof |
| 12/12/2002 | US20020185731 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 12/12/2002 | US20020185718 Semiconductor device packaging structure |
| 12/12/2002 | US20020185482 Tab circuit for ink jet printer cartridges |
| 12/12/2002 | US20020185474 Micromachining with high-energy, intra-cavity Q-switched CO2 laser pulses |
| 12/12/2002 | US20020185311 Printed wiring board having a discontinuous plating layer and method of manufacture thereof |
| 12/12/2002 | US20020185309 Method for mounting electronic part and paste material |
| 12/12/2002 | US20020185307 Printed circuit board |
| 12/12/2002 | US20020185306 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 12/12/2002 | US20020185305 Packaging substrate with electrostatic discharge protection |
| 12/12/2002 | US20020185304 Method of packaging electronic components with high reliability |
| 12/12/2002 | US20020185303 Wiring circuit board and method for producing same |