| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/19/2002 | US20020192442 Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
| 12/19/2002 | US20020192439 Structure having embedded flush circuitry features and method of fabricating |
| 12/19/2002 | US20020192392 Method of making a printed circuit board |
| 12/19/2002 | US20020192379 Pretreating agent for metal plating |
| 12/19/2002 | US20020192363 Electroless process for the preparation of particle enhanced electric contact surfaces |
| 12/19/2002 | US20020191382 Surface-mount device and method for manufacturing the surface-mount device |
| 12/19/2002 | US20020191380 Method and device for interconnecting, electronic components in three dimensions |
| 12/19/2002 | US20020191379 Surface mount power supplies for standard assembly process |
| 12/19/2002 | US20020191378 Semiconductor power element heat dissipation board, and conductor plate therefor and heat sink material and solder material |
| 12/19/2002 | US20020191368 Electronic assembly with laterally connected capacitors and manufacturing method |
| 12/19/2002 | US20020191173 Balanced positioning system for use in lithographic apparatus |
| 12/19/2002 | US20020191126 Structure of liquid crystal display device for easy assembly and disassembly |
| 12/19/2002 | US20020190801 Method for adjusting oscillator frequencies |
| 12/19/2002 | US20020190739 CSP BGA test socket with insert and method |
| 12/19/2002 | US20020190574 Assembly, with lead frame, for antilock brake system and associated method |
| 12/19/2002 | US20020190429 Two-stage transfer molding method to encapsulate MMC module |
| 12/19/2002 | US20020190392 Semiconductor device and manufacturing method thereof |
| 12/19/2002 | US20020190388 Method of mounting a circuit component and joint structure therefor |
| 12/19/2002 | US20020190378 Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same |
| 12/19/2002 | US20020190377 Circuit device and method for fabricating the same |
| 12/19/2002 | US20020190376 Package having terminated plating layer and its manufacturing method |
| 12/19/2002 | US20020190373 Electronic device, semiconductor device comprising such a device and method of manufacturing such a device |
| 12/19/2002 | US20020190365 Non-contact type IC card and process for manufacturing-same |
| 12/19/2002 | US20020190244 Electrically conductive adhesive agent |
| 12/19/2002 | US20020190166 Electro-optical component holder |
| 12/19/2002 | US20020190107 Method for forming a micro column grid array (CGA) |
| 12/19/2002 | US20020190038 Laser ablation technique |
| 12/19/2002 | US20020190037 Method for drilling micro-holes with a laser beam |
| 12/19/2002 | US20020189862 Method for interconnecting printed circuit boards and interconnection structure |
| 12/19/2002 | US20020189861 Method and apparatus to establish circuit layers interconnections |
| 12/19/2002 | US20020189860 Printed-wiring substrate and method for fabricating the printed-wiring substrate |
| 12/19/2002 | US20020189859 Printed circuit board and its manufacturing method |
| 12/19/2002 | US20020189858 Uniform force hydrostatic bolster plate |
| 12/19/2002 | US20020189857 Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards |
| 12/19/2002 | US20020189856 Circuit board and method of manufacturing same |
| 12/19/2002 | US20020189855 Flexible printed circuit board |
| 12/19/2002 | US20020189854 Design for long fatigue life in flexible circuits |
| 12/19/2002 | US20020189852 Fabricating method of semiconductor devices, fabricating method of printed wired boards, and printed wired board |
| 12/19/2002 | US20020189851 Non-continuous conductive layer for laminated substrates |
| 12/19/2002 | US20020189850 Resin-molded board |
| 12/19/2002 | US20020189849 Printed wiring board and manufacturing method of printed wiring board |
| 12/19/2002 | US20020189755 Platen for use in laminating press and method of lamination |
| 12/19/2002 | US20020189742 Glass ceramic multilayer substrate manufacturing method and glass ceramic multilayer substrate product |
| 12/19/2002 | US20020189637 Utilization of an ultrasonic prewetting in a liquid bath preceding cleaning for the electroless plating, thereby enabling all the holes to be degassed, and allowing cleansing solution to easily flow into the respective holes |
| 12/19/2002 | US20020189094 Structure for high speed printed wiring boards with multiple differential impedance-controlled layers |
| 12/19/2002 | US20020189091 Method of making printed circuit board |
| 12/19/2002 | US20020189089 Mounting electrical devices to circuit boards |
| 12/19/2002 | US20020189088 Method of manufacturing metal foil laminated product and method of manufacturing wiring board |
| 12/19/2002 | US20020189083 Surface-mount type switching power-supply unit and mounting method for the same |
| 12/19/2002 | DE10222669A1 Tragbare Karten-Typ-Vorrichtung Portable card-type device |
| 12/19/2002 | DE10130257A1 Method for manufacturing electric circuit on substrate, involves applying and structuring laminated layer on first layer, before applying second layer |
| 12/19/2002 | DE10129118A1 Housing part for electrical adjustment drive in vehicle, has at least one outer conducting track electrically connected to at least one inner conducting track in form of stamped grid |
| 12/19/2002 | DE10127889A1 Process for re-melting solder material applied on connecting sites used in the semiconductor industry comprises re-melting the solder material using an RTP method |
| 12/19/2002 | DE10126568A1 Elektronisches Bauelement Electronic component |
| 12/19/2002 | DE10125397A1 Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl A method of drilling microvia holes using a laser beam |
| 12/19/2002 | CA2457574A1 Method and apparatus for predicting sporting success conditions |
| 12/18/2002 | EP1267597A2 Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
| 12/18/2002 | EP1267596A2 Printed circuit board and its manufacturing method |
| 12/18/2002 | EP1267595A1 Circuit forming board producing method, circuit forming board, and material for circuit forming board |
| 12/18/2002 | EP1267594A2 Transfer material, method for producing the same and wiring substrate produced by using the same |
| 12/18/2002 | EP1267403A2 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system |
| 12/18/2002 | EP1267396A2 Magnetically patterning conductors |
| 12/18/2002 | EP1266926A1 Adhesive polyimide resin and adhesive laminate |
| 12/18/2002 | EP1266922A1 Photocurable/thermosetting composition for forming matte film |
| 12/18/2002 | EP1266546A1 Treatment of circuit supports with impulse excitation |
| 12/18/2002 | EP1266430A1 Method for making an electroconductive joint |
| 12/18/2002 | EP1266426A1 Method for forming radio frequency antenna using conductive inks |
| 12/18/2002 | EP1266397A2 Precision electroplated solder bumps and method for manufacturing thereof |
| 12/18/2002 | EP1266234A1 Testing device for printed boards |
| 12/18/2002 | EP1266052A1 Electro-plating apparatus and a method of electro-plating |
| 12/18/2002 | EP1166273B1 Disposable sound recording and reproduction device |
| 12/18/2002 | EP0917544B1 Water soluble and oxygen-impermeable polymeric layers |
| 12/18/2002 | EP0880526B1 Heterocycle-condensed morphinoid derivatives (ii) |
| 12/18/2002 | EP0750549B1 Bismuth coating protection for copper |
| 12/18/2002 | CN2527062Y Wiring structure for signal transmission line on circuit board |
| 12/18/2002 | CN1386396A Production method for copper-clad laminated sheet |
| 12/18/2002 | CN1386395A Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 12/18/2002 | CN1386394A Flip chip package, circuit thereof and packaging method thereof |
| 12/18/2002 | CN1386313A System comprising at least two printed circuit boards |
| 12/18/2002 | CN1386198A Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card |
| 12/18/2002 | CN1386131A Insulating resin composition for multilayer printed wiring boards, multilayer printed wiring boards made by using the composition and process for the production thereof |
| 12/18/2002 | CN1386048A Circuit board encapsulation process for shielding electromagnetic wave |
| 12/18/2002 | CN1386045A Wiring board and making method thereof |
| 12/18/2002 | CN1386044A Roughened copper foil and making method thereof |
| 12/18/2002 | CN1386043A Deposition method for IC copper inner conductive wire inculating crystal layer |
| 12/18/2002 | CN1386042A Sensor circuit modular unit and electronic device using same |
| 12/18/2002 | CN1386032A Front module |
| 12/18/2002 | CN1385276A Laser holing device and two-step holing method |
| 12/18/2002 | CN1096826C Method for detecting deterioration of solder paste printing |
| 12/18/2002 | CN1096824C Flexible printed circuit composition piece and process for producing the same |
| 12/18/2002 | CN1096691C Wire-wound element for mounting on printed circuit board |
| 12/18/2002 | CN1096689C Terminal installation structure |
| 12/18/2002 | CN1096686C 各向异性导电组合物 Anisotropic conductive composition |
| 12/18/2002 | CN1096310C Method and apparatus for sheet products treatment like circuit board |
| 12/17/2002 | US6496886 Directional coupling bus system using printed board |
| 12/17/2002 | US6496384 Circuit board assembly and method of fabricating same |
| 12/17/2002 | US6496377 Vehicle electric power distribution system |
| 12/17/2002 | US6496356 Multilayer capacitance structure and circuit board containing the same and method of forming the same |
| 12/17/2002 | US6495912 Structure of ceramic package with integrated passive devices |
| 12/17/2002 | US6495787 Electrical connection system between an electrochemical cell and a printed circuit |