| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/26/2002 | US20020197024 Transparent substrate and hinged optical assembly |
| 12/26/2002 | US20020196997 Packaging and assembly method for optical coupling |
| 12/26/2002 | US20020196614 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 12/26/2002 | US20020196613 Through hole insertion type electronic component and method of packaging same |
| 12/26/2002 | US20020196609 Power module |
| 12/26/2002 | US20020196598 Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same |
| 12/26/2002 | US20020196119 Printed circuit boards having integrated inductor cores |
| 12/26/2002 | US20020196118 Electrical apparatus having an electromagnetic device operable at multiple inductance values |
| 12/26/2002 | US20020196085 High frequency module |
| 12/26/2002 | US20020196041 Method and apparatus for testing bumped die |
| 12/26/2002 | US20020196038 Press contact structure of probe unit |
| 12/26/2002 | US20020195722 Structure and mounting method |
| 12/26/2002 | US20020195718 Process for mounting electronic device and semiconductor device |
| 12/26/2002 | US20020195716 Copper plated PTH barrels and methods for fabricating |
| 12/26/2002 | US20020195707 Extension of fatigue life for C4 solder ball to chip connection |
| 12/26/2002 | US20020195706 Semiconductor apparatus with misalignment mounting detection |
| 12/26/2002 | US20020195704 Multi-die module and method thereof |
| 12/26/2002 | US20020195700 Electronic assembly with vertically connected capacitors and manufacturing method |
| 12/26/2002 | US20020195696 Packaging substrate for electronic elements and electronic device having packaged structure |
| 12/26/2002 | US20020195695 Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main body |
| 12/26/2002 | US20020195676 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system |
| 12/26/2002 | US20020195612 Method of making a nickel-coated copper substrate and thin film composite containing the same |
| 12/26/2002 | US20020195272 Multilayered substrate for semiconductor device |
| 12/26/2002 | US20020195271 Direct inner layer interconnect for a high speed printed circuit board |
| 12/26/2002 | US20020195270 High frequency module device and method for its preparation |
| 12/26/2002 | US20020195269 Via intersect pad for electronic components and methods of manufacture |
| 12/26/2002 | US20020195268 Thick film circuit connection |
| 12/26/2002 | US20020195266 Flat cable covering and flat cable using same |
| 12/26/2002 | US20020195171 Conductive paste and semiconductor component having conductive bumps made from the conductive paste |
| 12/26/2002 | US20020195170 Paste composition or a resin flux-cored solder of acrylic and rosin based resins useful in preventing the generation of voltage noises of electronic devices |
| 12/26/2002 | US20020195122 Test carrier for temporarily packaging bumped semiconductor components in which contact balls on the components are protected during test procedures; made of wear resistant material |
| 12/26/2002 | US20020195007 Screen printer and a screen printing method |
| 12/26/2002 | US20020194968 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby |
| 12/26/2002 | US20020194731 Fabrication method and structure of an integrated circuit package |
| 12/26/2002 | US20020194729 Electronic component mounting method |
| 12/25/2002 | CN1387746A Printed circuit board assembly |
| 12/25/2002 | CN1387745A Copper foil excellent in laser beam drilling performance and production method therefor |
| 12/25/2002 | CN1387398A Metal foil laminate and method for making same |
| 12/25/2002 | CN1387397A Method for mfg. PC board |
| 12/25/2002 | CN1387396A 阻抗测量结构 Impedance measurement structure |
| 12/25/2002 | CN1387284A Electric contactor and electric connection device using same |
| 12/25/2002 | CN1387240A Method for mfg. stacked semiconductor device |
| 12/25/2002 | CN1387239A Circuit board, semiconductor device mfg. method, and electroplating system |
| 12/25/2002 | CN1386818A Composition contg. azacyclic compound and glycol for grain decoration of resin material, removal of stain and removal of resin material |
| 12/25/2002 | CN1386632A Laminate and its production method |
| 12/25/2002 | CN1386609A Weld ball structure for electronic package |
| 12/25/2002 | CN1097326C Connector for circuit board |
| 12/25/2002 | CN1097313C Lead frame mfg. method |
| 12/25/2002 | CN1097305C Selectively filled adhesive film contg. fluxing agent |
| 12/25/2002 | CN1097235C Method and apparatus for providing remotely located outrigger card electrically coupled to control card |
| 12/24/2002 | US6498714 Copper wiring, dielectric oxide of anodic tantalum, and valve metal barrier layer; printed circuits |
| 12/24/2002 | US6498710 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 12/24/2002 | US6498705 Electrical connection arrangement for a magnetic head of a floppy disk drive |
| 12/24/2002 | US6498636 Apparatus and method for substantially stress-free electrical connection to a liquid crystal display |
| 12/24/2002 | US6498547 Anisotropically electroconductive adhesive and a ladder filter using the same |
| 12/24/2002 | US6498355 High flux LED array |
| 12/24/2002 | US6498319 Method and an apparatus for manufacturing multi-layer boards using laser light |
| 12/24/2002 | US6498309 Printed circuit with polytetrafluoroethylene foundation; tin laminated with copper |
| 12/24/2002 | US6498308 Semiconductor module |
| 12/24/2002 | US6498307 Electronic component package, printing circuit board, and method of inspecting the printed circuit board |
| 12/24/2002 | US6498306 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
| 12/24/2002 | US6498305 Interconnect mechanics for electromagnetic coupler |
| 12/24/2002 | US6498294 Package for high frequency device |
| 12/24/2002 | US6498115 Method for manufacturing circuit component |
| 12/24/2002 | US6498051 Method of packaging semiconductor device using anisotropic conductive adhesive |
| 12/24/2002 | US6497991 Method of producing a printed circuit board and mask for carrying out the same |
| 12/24/2002 | US6497943 Surface metal balancing to reduce chip carrier flexing |
| 12/24/2002 | US6497826 Surface modification using an atmospheric pressure glow discharge plasma source |
| 12/24/2002 | US6497806 Method of producing a roughening-treated copper foil |
| 12/24/2002 | US6497578 Method and apparatus to increase cable connector density in equipment |
| 12/24/2002 | US6497357 Apparatus and method for removing interconnections |
| 12/24/2002 | US6497354 Bonding apparatus and bonding tool for component |
| 12/20/2002 | WO2002000756A1 Insulating resin composition, adhesive resin composition and adhesive sheeting |
| 12/20/2002 | CA2413759A1 Resin composition for insulation material, resin composition for adhesive and adhesion sheet |
| 12/19/2002 | WO2002101888A2 Multi-beam micro-machining system and method |
| 12/19/2002 | WO2002101830A2 Electronic components with plurality of contoured microelectronic spring contacts |
| 12/19/2002 | WO2002101828A2 Method for melting down solder material that is applied to connection points |
| 12/19/2002 | WO2002101766A1 Improved method for forming magnetic layers in printed circuit boards |
| 12/19/2002 | WO2002101730A2 Attachment of a head-gimbal assembly to a printed circuit board actuator arm using z-axis conductive adhesive film |
| 12/19/2002 | WO2002101399A1 Circuit pattern inspection device, circuit pattern inspection method, and recording medium |
| 12/19/2002 | WO2002101398A1 Circuit pattern inspection apparatus, circuit pattern inspection method, and recording medium |
| 12/19/2002 | WO2002101332A2 Method and apparatus for predicting sporting success conditions |
| 12/19/2002 | WO2002100952A2 Tab circuit for ink jet printer cartridges |
| 12/19/2002 | WO2002061010A3 Method for adhering substrates using light activatable adhesive film |
| 12/19/2002 | WO2002049405B1 Multi-layer circuits and methods of manufacture thereof |
| 12/19/2002 | US20020193541 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 12/19/2002 | US20020193467 Conductive materials with electrical stability for use in electronics devices |
| 12/19/2002 | US20020193229 As substrate in which an electric circuit or circuits are formed |
| 12/19/2002 | US20020193002 Connector structure for power supply apparatus |
| 12/19/2002 | US20020192939 Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board |
| 12/19/2002 | US20020192936 Recessed tape and method for forming a BGA assembly |
| 12/19/2002 | US20020192870 Impregnating a raw material of a thermosetting resin in a porous laminated product including two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers; curing |
| 12/19/2002 | US20020192865 Process for mounting electronic device and semiconductor device |
| 12/19/2002 | US20020192603 Method of forming image on support |
| 12/19/2002 | US20020192602 Forming nesting contour on a fiber optic array; nesting a surface of non-planar article against contour; exposing photoresist optically connected to proximal optical fiber surface within contours; developing; etching |
| 12/19/2002 | US20020192486 Copper foil with low profile bond enhancement |
| 12/19/2002 | US20020192485 Printed circuit board and method for producing the same |
| 12/19/2002 | US20020192460 Laminate and method of manufacturing the same |
| 12/19/2002 | US20020192444 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
| 12/19/2002 | US20020192443 Electronic package interconnect structure comprising lead-free solders |