| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/02/2003 | EP1271158A2 Press contact structure of probe unit |
| 01/02/2003 | EP1270760A1 Method for coating substrates by sputtering |
| 01/02/2003 | EP1270193A1 Heat resistant cushioning material for press molding |
| 01/02/2003 | EP1270167A1 Method for producing an apparatus housing |
| 01/02/2003 | EP1269808A1 Method for fabricating electrical connecting elements, and connecting element |
| 01/02/2003 | EP1269807A1 Method for fabricating electrical connecting element, and electrical connecting element |
| 01/02/2003 | EP1269806A2 Electronic printed-circuit board for electronic devices, especially communications terminals |
| 01/02/2003 | EP1269805A1 Electrical circuit and substrate therefor |
| 01/02/2003 | EP1269804A1 Electrical connecting element and method of fabricating the same |
| 01/02/2003 | EP1269496A1 Method for producing a tag or a chip card, device for implementing said method and tag or chip card produced according to said method |
| 01/02/2003 | EP1269257A1 Method of forming image on support |
| 01/02/2003 | EP1268643A1 Screen printable flame retardant coating |
| 01/02/2003 | EP1127479B1 An electrical component and an electrical circuit module having connected ground planes |
| 01/02/2003 | EP0855090B1 Multichip module |
| 01/01/2003 | CN1389005A High reliability interposer of low-cost and high reliability application |
| 01/01/2003 | CN1388975A 层压体及其用途 Laminate and its use |
| 01/01/2003 | CN1388918A Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method |
| 01/01/2003 | CN1388900A Inspection unit and method of manufacturing substrate |
| 01/01/2003 | CN1388899A Inspection device and inspection method |
| 01/01/2003 | CN1388841A Laser hole drilling copper foil |
| 01/01/2003 | CN1388777A Copper-clad laminate |
| 01/01/2003 | CN1388738A Multi-layer ceramic base plate and producing method, non-sintered ceramic laminated body and electronic apparatus |
| 01/01/2003 | CN1388737A Circuit board capable of inhibiting electromagnetic interference and its inhibition method |
| 01/01/2003 | CN1388578A Staircase shape pattern for semiconductor chip welding |
| 01/01/2003 | CN1388538A Composite electronic element and method for producing the same element |
| 01/01/2003 | CN1387993A Method for producing laminated plate |
| 01/01/2003 | CN1098023C Printed wiring board and its producing method thereof |
| 01/01/2003 | CN1098022C Laser processing method for PCB, apparatus therefor and carbon dioxide laser oscillator |
| 01/01/2003 | CN1097506C Sheet materials processing equipment |
| 12/31/2002 | US6502228 Route determination support device, route determination support method and storage medium storing therein program for executing method thereof, and printed substrate wiring method |
| 12/31/2002 | US6502221 Prototype development system |
| 12/31/2002 | US6501665 Structure of a ball grid array IC mounting seat |
| 12/31/2002 | US6501664 Decoupling structure and method for printed circuit board component |
| 12/31/2002 | US6501663 Three-dimensional interconnect system |
| 12/31/2002 | US6501661 Electronic control unit |
| 12/31/2002 | US6501525 Method for interconnecting a flat panel display having a non-transparent substrate and devices formed |
| 12/31/2002 | US6501352 High frequency wiring board and its connecting structure |
| 12/31/2002 | US6501176 Deflectable interconnect |
| 12/31/2002 | US6501174 Interconnect structure for surface mounted devices |
| 12/31/2002 | US6501160 Semiconductor device and a method of manufacturing the same and a mount structure |
| 12/31/2002 | US6501103 Light emitting diode assembly with low thermal resistance |
| 12/31/2002 | US6501031 Electrical circuit board and a method for making the same |
| 12/31/2002 | US6500746 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 12/31/2002 | US6500693 Electrode forming method and bump electrode formable base used therefor |
| 12/31/2002 | US6500566 Depositing onto carrier film release agent layer comprising water soluble polymer, forming conductive metal layer with thickness of less than 10,000 angstroms, bonding metal layer to circuit board laminate layer, peeling off carrier film |
| 12/31/2002 | US6500529 Low signal loss bonding ply for multilayer circuit boards |
| 12/31/2002 | US6500350 Formation of thin film resistors |
| 12/31/2002 | US6500349 Manufacture of printed circuits using single layer processing techniques |
| 12/31/2002 | US6500011 Flexure blank and method of manufacturing the same |
| 12/31/2002 | US6499994 Heating apparatus in reflow system |
| 12/31/2002 | US6499647 Method for producing contact between two circuit layers separated by an insulating layer |
| 12/31/2002 | US6499645 Automatic soldering apparatus |
| 12/31/2002 | US6499644 Rework and underfill nozzle for electronic components |
| 12/31/2002 | US6499217 Method of manufacturing three-dimensional printed wiring board |
| 12/31/2002 | US6499215 Processing of circuit boards with protective, adhesive-less covers on area array bonding sites |
| 12/31/2002 | US6499214 Method of making a circuit board |
| 12/31/2002 | CA2158706C Improved battery holder for a printed circuit board |
| 12/31/2002 | CA2102987C Formation of microstructures using a preformed photoresist sheet |
| 12/31/2002 | CA2063844C Process for production of copper through-hole printed wiring boards |
| 12/27/2002 | WO2002104088A1 Method for assembly and/or disassembly of an electronic module on an application card method for production and corresponding mechanical fixing clip |
| 12/27/2002 | WO2002103884A1 Housing part for an electric adjusting drive |
| 12/27/2002 | WO2002103848A2 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials |
| 12/27/2002 | WO2002103789A2 Electronic assembly with laterally connected capacitors and manufacturing method |
| 12/27/2002 | WO2002103751A2 Electroplating chemistry for the cu filling of submicron features of vlsi/ulsi interconnect |
| 12/27/2002 | WO2002103725A1 Electrical apparatus having an electromagnetic device operable at multiple inductance values |
| 12/27/2002 | WO2002103718A2 Uv-curable inks for ptf laminates (including flexible circuitry) |
| 12/27/2002 | WO2002103455A2 Method and apparatus for imaging with fiber optic arrays on non-flat surfaces |
| 12/27/2002 | WO2002103085A1 Method and electrode for defining and replicating structures in conducting materials |
| 12/27/2002 | WO2002102911A1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
| 12/27/2002 | WO2002102524A1 Electroless process for the preparation of particle enhanced electric contact surfaces |
| 12/27/2002 | WO2002096169A8 Printed circuit board with mounted components housed in a resin foil |
| 12/27/2002 | WO2002089260A3 Separable power delivery connector |
| 12/27/2002 | WO2002074024A3 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 12/27/2002 | WO2002063334A3 Integrated circuit for a radar device in a hermetically sealed housing comprising a patch antenna formed from a bent component from sheet metal |
| 12/27/2002 | WO2002022321A3 Multiple blade robot adjustment apparatus and associated method |
| 12/27/2002 | WO2002017387A3 Conductive material patterning methods |
| 12/27/2002 | WO2002006561A3 Process for deposition of metal on a surface |
| 12/27/2002 | WO2001091524A3 High-speed fabrication of highly uniform metallic microspheres__ |
| 12/27/2002 | WO2001042533A8 Electroplating apparatus |
| 12/27/2002 | CA2462098A1 Method and electrode for defining and replicating structures in conducting materials |
| 12/26/2002 | US20020199159 Naked chip motherboard module |
| 12/26/2002 | US20020198353 Polycarbosilane adhesion promoters for low dielectric constant polymeric materials |
| 12/26/2002 | US20020198269 Antireflective porogens |
| 12/26/2002 | US20020197900 Locking assembly for securing semiconductor device to carrier substrate |
| 12/26/2002 | US20020197843 Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components |
| 12/26/2002 | US20020197842 Bumping process |
| 12/26/2002 | US20020197834 Method for manufacturing a composite member |
| 12/26/2002 | US20020197773 High-frequency module, method of manufacturing thereof and method of molding resin |
| 12/26/2002 | US20020197767 Apparatus, method and product therefrom, for aligning die to interconnect metal on flex substrate |
| 12/26/2002 | US20020197554 Solution coating a light emitting material onto the donor element; and selectively thermal transferring the emitter layer from the donor element to a receptor and proximate to a second device layer that is incompatible with the solvent. |
| 12/26/2002 | US20020197492 Electrolessly depositing a metal coating; depositing a photoresist coating; imaging and developing the photoresist coating; electroplating a metal on the exposed electrolessly deposited metal; and stripping the cured coating |
| 12/26/2002 | US20020197488 Use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass to enhance the reliability of the electrical connection of a silver-based conductor film |
| 12/26/2002 | US20020197479 Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film |
| 12/26/2002 | US20020197457 Impregnated printed circuit board, and manufacturing method therefor |
| 12/26/2002 | US20020197433 Component for use in manufacture of printed circuit boards and laminates |
| 12/26/2002 | US20020197415 Method for the deposition of materials from mesomorphous films |
| 12/26/2002 | US20020197405 Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals |
| 12/26/2002 | US20020197404 Method of activating non-conductive substrate for use in electroless deposition |
| 12/26/2002 | US20020197401 Laser forward transfer of rheological systems |
| 12/26/2002 | US20020197399 Method for production of microcapsule type conductive filler |