| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/07/2003 | US6504110 Insulating circuit board and power semiconductor apparatus employing the same |
| 01/07/2003 | US6504108 Electrical connector having stand-offs between solder balls thereof |
| 01/07/2003 | US6504107 Electro-optic module and method for the production thereof |
| 01/07/2003 | US6504105 Solder ball connections and assembly process |
| 01/07/2003 | US6504104 Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array |
| 01/07/2003 | US6504097 Electronic device |
| 01/07/2003 | US6503874 Cleaning method to remove flux residue in electronic assembly |
| 01/07/2003 | US6503831 Method of forming an electronic device |
| 01/07/2003 | US6503777 Deflectable interconnect |
| 01/07/2003 | US6503566 Process for improving the adhesion of polymeric materials to metal surfaces |
| 01/07/2003 | US6503336 Techniques for modifying a circuit board using a flow through nozzle |
| 01/07/2003 | US6503127 Apparatus and methods for substantial planarization of solder bumps |
| 01/07/2003 | US6503088 I-channel surface-mount connector with extended flanges |
| 01/07/2003 | US6502968 Printed circuit board having a light source |
| 01/07/2003 | US6502740 Solder a lead wire of an electronic device to a wiring pattern formed on a printed circuit board, the electronic device is first placed on a first face of the printed circuit board such that the lead wire thereof are protruded from a second face |
| 01/07/2003 | US6502588 Surface modification using an atmospheric pressure glow discharge plasma source |
| 01/07/2003 | US6502302 Process for producing an industrial member having throughholes of high aspect ratio |
| 01/07/2003 | US6502298 Method of electroforming a slip ring |
| 01/05/2003 | CA2391223A1 Circuit board, method for manufacturing same, and high-output module |
| 01/05/2003 | CA2391218A1 Cicuit board, method for manufacturing same, and high-output module |
| 01/03/2003 | WO2003001862A1 Circuit carrier with a fiducial, method for the production thereof and quality inspection method |
| 01/03/2003 | WO2003001858A1 Method and device for installation |
| 01/03/2003 | WO2003001596A1 Electronic device and method for manufacturing the same |
| 01/03/2003 | WO2003001594A2 High-voltage module and method for producing the same |
| 01/03/2003 | WO2003001586A1 Mounting method and device |
| 01/03/2003 | WO2003001585A1 Extension of fatigue life for c4 solder ball in a chip to substrate connection |
| 01/03/2003 | WO2003001537A1 Material and method for making an electroconductive pattern |
| 01/03/2003 | WO2003001299A1 Material having a conductive pattern; and a material and method for making a conductive pattern |
| 01/03/2003 | WO2003000954A1 Surface treatment agent for copper and copper alloy |
| 01/03/2003 | WO2003000816A1 Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same |
| 01/03/2003 | WO2003000619A1 Ceramic component and production method therefor |
| 01/03/2003 | WO2002089257A3 Connection housing for an electronic component |
| 01/03/2003 | WO2002083350A3 Device for applying solder globules |
| 01/03/2003 | WO2002066205A3 Operating head for a machine tool with a spindle rotating on a vertical axis |
| 01/03/2003 | WO2002054845A3 Layered circuit boards and methods of production thereof |
| 01/03/2003 | WO2002054414A3 Fat conductor |
| 01/03/2003 | WO2002013254A3 Electroplating multi-trace circuit board substrates using single tie bar |
| 01/02/2003 | US20030005397 Method and apparatus for PCB array with compensated signal propagation |
| 01/02/2003 | US20030004218 Porous materials |
| 01/02/2003 | US20030003862 Electronic component and mobile communication device using the electronic component |
| 01/02/2003 | US20030003800 Terminating floating signals on a bga module to a ground plane on a ball grid array (bga) circuit board site |
| 01/02/2003 | US20030003780 Integrated ball grid array-pin grid array-flex laminate assembly |
| 01/02/2003 | US20030003779 Flexible compliant interconnect assembly |
| 01/02/2003 | US20030003740 Contact structure production method |
| 01/02/2003 | US20030003706 Substrate with top-flattened solder bumps and method for manufacturing the same |
| 01/02/2003 | US20030003705 Vertical electronic circuit package and method of fabrication therefor |
| 01/02/2003 | US20030003630 Hybrid integrated circuit device |
| 01/02/2003 | US20030003629 Hybrid integrated circuit device and manufacturing method thereof |
| 01/02/2003 | US20030003624 Single-melt enhanced reliability solder element interconnect |
| 01/02/2003 | US20030003623 Electronic component mounted on a flat substrate and padded with a fluid filler |
| 01/02/2003 | US20030003406 Film of thermo-resist applied to a substrate surface is scanned by a focused heat source without a phototool |
| 01/02/2003 | US20030003398 Photosensitive composition, cured article thereof, and printed circuit board using the same |
| 01/02/2003 | US20030003320 Plating film onto an object at a first current density in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. |
| 01/02/2003 | US20030003287 Heat conductive resin substrate and semiconductor package |
| 01/02/2003 | US20030003231 Pattern formation method and substrate manufacturing apparatus |
| 01/02/2003 | US20030003011 Lead-free solder balls and method for the production thereof |
| 01/02/2003 | US20030002940 Rotary drilling and cutting tools for manufacturing printed circuit boards |
| 01/02/2003 | US20030002770 Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
| 01/02/2003 | US20030002268 Ultra-low impedance power interconnection system for electronic packages |
| 01/02/2003 | US20030002264 Manufacturing method for a flexible PCB |
| 01/02/2003 | US20030002263 HDI circuit board and method of production of an HDI circuit board |
| 01/02/2003 | US20030002260 Electronic apparatus |
| 01/02/2003 | US20030002241 Sensor |
| 01/02/2003 | US20030002055 Method of calibrating the optical system of a laser machine for processing electrical circuit substrates |
| 01/02/2003 | US20030002003 Display module |
| 01/02/2003 | US20030001932 Ink jet charge plate with integrated flexible lead connector structure |
| 01/02/2003 | US20030001839 System for generating printed board three-dimensional shape data |
| 01/02/2003 | US20030001798 Multi-exposure drawing method and apparatus therefor |
| 01/02/2003 | US20030001717 Surface mountable PTC chips |
| 01/02/2003 | US20030001454 Matrix type actuator |
| 01/02/2003 | US20030001287 Flexible tape electronics packaging |
| 01/02/2003 | US20030001256 Wiring substrate having position information |
| 01/02/2003 | US20030001255 Hybrid integrated circuit device and manufacturing method thereof |
| 01/02/2003 | US20030001254 Electronic assembly with separate power and signal connections |
| 01/02/2003 | US20030001237 Flexible polyimide circuits having predetermined via angles |
| 01/02/2003 | US20030001077 System for compensating for chip-to-chip gap widths in a multi-chip photosensitive scanning array |
| 01/02/2003 | US20030000916 Method and apparatus for structuring printed circuit borads |
| 01/02/2003 | US20030000846 Plating method |
| 01/02/2003 | US20030000832 Roller assembly for an electroplating apparatus |
| 01/02/2003 | US20030000831 Conducting roller for an electroplating apparatus |
| 01/02/2003 | US20030000830 Stacked panel processing apparatus and methods |
| 01/02/2003 | US20030000739 Circuit housing clamp and method of manufacture therefor |
| 01/02/2003 | US20030000738 Solder resist opening to define a combination pin one indicator and fiducial |
| 01/02/2003 | US20030000735 Multilayered printed circuit board |
| 01/02/2003 | US20030000734 Printed-wiring board, method for identifying same, and method for manufacturing same |
| 01/02/2003 | US20030000723 Method for making a circuit assembly having an integal frame |
| 01/02/2003 | US20030000555 Circuit board-washing device capable of minimizing detergent residue on circuit boards |
| 01/02/2003 | US20030000084 Device for collectively filling blind cavities |
| 01/02/2003 | US20030000083 Method of manufacturing wiring substrate |
| 01/02/2003 | US20030000079 Method for manufacturing multilayer ceramic substrates |
| 01/02/2003 | EP1272022A2 Multilayer wiring board and method of manufacturing the same |
| 01/02/2003 | EP1272021A2 Method for manufacturing metal foil laminated product and method of manufacturing wiring board |
| 01/02/2003 | EP1272020A1 Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
| 01/02/2003 | EP1272019A1 Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof |
| 01/02/2003 | EP1272018A2 Method of mounting electronic parts with Sn-Zn solder free of Pb |
| 01/02/2003 | EP1272017A1 Copper-clad laminated sheet |
| 01/02/2003 | EP1272016A2 Resin-molded board |
| 01/02/2003 | EP1271649A2 Multi-die module and method thereof |
| 01/02/2003 | EP1271644A1 Wiring board, semiconductor device, and method of manufacturing wiring board |
| 01/02/2003 | EP1271641A1 Method and apparatus for mounting chip |