| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/09/2003 | WO2003002682A1 Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constituents |
| 01/09/2003 | WO2003002675A1 Selective deposition of circuit-protective polymers |
| 01/09/2003 | WO2003002290A1 Solder composition |
| 01/09/2003 | WO2002027791A3 Polymer stud grid array and method for production thereof |
| 01/09/2003 | WO2002025709A3 Integrated thin film capacitor/inductor/interconnect system and method |
| 01/09/2003 | WO2001069717A9 Method for forming radio frequency antenna using conductive inks |
| 01/09/2003 | WO2001068567A3 Photostructured paste |
| 01/09/2003 | US20030009726 Method and apparatus for the formation of laminated circuit having passive componets therein |
| 01/09/2003 | US20030009684 Tamper-evident and/or tamper-resistant electronic components |
| 01/09/2003 | US20030008989 Polymer synthesis and films therefrom |
| 01/09/2003 | US20030008590 Three-dimensional nonwoven substrate for circuit board |
| 01/09/2003 | US20030008535 Electrical contact and electrical connection device using same |
| 01/09/2003 | US20030008489 Method of making bondable leads using positive photoresist and structures made therefrom |
| 01/09/2003 | US20030008434 Conductive pedestal on pad for leadless chip carrier (LCC) standoff |
| 01/09/2003 | US20030008182 Comprises shrink-suppressing layers on main surface of presintered ceramic; efficiency; electronic |
| 01/09/2003 | US20030008163 Multilayered 4-methyl-1-pentene copolymer mutli layer film and process for producing the same |
| 01/09/2003 | US20030008156 Selective deposition of circuit-protective polymers |
| 01/09/2003 | US20030008133 Flip chips; conductive particles dispersed in binder |
| 01/09/2003 | US20030007341 Shielding base member and method of manufacturing the same |
| 01/09/2003 | US20030007340 Electrical device allowing for increased device densities |
| 01/09/2003 | US20030007332 Insulating resin composition for multilayer printed-wiring board |
| 01/09/2003 | US20030007331 Flexible printed circuit board and connecting method thereof |
| 01/09/2003 | US20030007330 Multilayer circuit board and method for manufacturing multilayer circuit board |
| 01/09/2003 | US20030007139 Aligner |
| 01/09/2003 | US20030007038 Multilayer piezoelectric device and method of producing the same and piezoelectric actuator |
| 01/09/2003 | US20030006857 High performance dense wire for printed circuit board |
| 01/09/2003 | US20030006855 Center electrode assembly, nonreciprocal circuit device, communication device, and method of producing the center electrode assembly |
| 01/09/2003 | US20030006798 Engagement probes |
| 01/09/2003 | US20030006790 Method for constructing a flex-rigid laminate probe |
| 01/09/2003 | US20030006527 Method of fabricating micron-and submicron-scale elastomeric templates for surface patterning |
| 01/09/2003 | US20030006519 Method for treating foamed plastic particles that are present in pourable form and device for carrying out said method |
| 01/09/2003 | US20030006503 Device having resin package and method of producing the same |
| 01/09/2003 | US20030006500 Circuit board, method for manufacturing same, and high-output module |
| 01/09/2003 | US20030006491 Single package containing multiple integrated circuit devices |
| 01/09/2003 | US20030006489 Flexible wiring substrate interposed between semiconductor element and circuit substrate |
| 01/09/2003 | US20030006220 Method of ablating an opening in a hard, non-metallic substrate |
| 01/09/2003 | US20030006215 Etchant, method for roughening copper surface and method for producing printed wiring board |
| 01/09/2003 | US20030006069 Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board |
| 01/09/2003 | US20030006068 System and method for integrating optical layers in a PCB for inter-board communications |
| 01/09/2003 | US20030006067 High-density electronic circuits |
| 01/09/2003 | US20030006066 An electronic package having a substrate with electrically conductive filled through holes |
| 01/09/2003 | US20030006065 Monolithic ceramic electronic component, method for manufacturing the same, and electronic device |
| 01/09/2003 | US20030006063 Wiring substrate |
| 01/09/2003 | US20030006062 Interconnect system and method of fabrication |
| 01/09/2003 | US20030006061 Hybrid surface mount and pin thru hole circuit board |
| 01/09/2003 | US20030006055 Semiconductor package for fixed surface mounting |
| 01/09/2003 | US20030006007 Method of laminating copper foil onto a printed circuit board |
| 01/09/2003 | US20030005582 Circuit board, method for manufacturing same, and high-output module |
| 01/09/2003 | US20030005581 Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
| 01/09/2003 | US20030005576 Process for making electronic chip device incorporating plural elements |
| 01/09/2003 | US20030005567 Alignment plate with matched thermal coefficient of expansion |
| 01/09/2003 | DE9321655U1 Printed circuit board coil structure - has groups of parallel track sections on both sides of PCB connected via metallised through holes |
| 01/09/2003 | DE4410091C2 Verfahren zum Herstellen von elektrostatischen Hafttafeln A method for producing electrostatic adhesion panels |
| 01/09/2003 | CA2451636A1 Low temperature method and compositions for producing electrical conductors |
| 01/08/2003 | EP1274289A1 HDI circuit board and manufacturing method of an HDI circuit board |
| 01/08/2003 | EP1274288A1 Conducting path structures and method of making |
| 01/08/2003 | EP1274149A2 Radio frequency circuit manufacturing method and radio frequency circuit |
| 01/08/2003 | EP1274126A2 Circuit board, method for manufacturing same, and high-output module |
| 01/08/2003 | EP1274125A2 Circuit board, method for manufacturing same, and high-output module |
| 01/08/2003 | EP1273998A1 Tamper-evident and/or tamper-resistant electronic components |
| 01/08/2003 | EP1273682A1 Laser hole drilling copper foil |
| 01/08/2003 | EP1273630A1 Resin composition, adhesive film for semiconductor device, and laminated film with metallic foil and semiconductor device using the same |
| 01/08/2003 | EP1273618A1 Room temperature curable organopolysiloxane compositions |
| 01/08/2003 | EP1273609A1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
| 01/08/2003 | EP1273421A2 Method for treating foamed plastic particles that are present in pourable form and device for carrying out said method |
| 01/08/2003 | EP1273384A1 Lead-free solder alloy |
| 01/08/2003 | EP1273214A1 Fixing plate, fixing arrangement comprising the fixing plate and the use of said fixing plate |
| 01/08/2003 | EP1273213A1 Method and apparatus for applying viscous or paste material onto a substrate |
| 01/08/2003 | EP1273212A1 Double-sided wiring board and its manufacture method |
| 01/08/2003 | EP1272901A1 Photoimageable, aqueous acid soluble polyimide polymers |
| 01/08/2003 | EP1272586A2 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 01/08/2003 | EP1272550A1 Impregnated glass fiber strands and products including the same |
| 01/08/2003 | EP1272285A1 High speed flip chip assembly process |
| 01/08/2003 | EP1218178A4 An adhesion promoting layer for use with epoxy prepregs |
| 01/08/2003 | EP1140373A4 Methods of manufacturing voidfree resin impregnated webs |
| 01/08/2003 | EP1073781A4 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances |
| 01/08/2003 | EP0882079B1 Reversible and irreversible water-based coatings |
| 01/08/2003 | CN2530243Y Circuit board checker |
| 01/08/2003 | CN1390437A Solder-bearing wafer for use in soldering operations |
| 01/08/2003 | CN1390318A Photosensitive resin composltion, photo sensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereon |
| 01/08/2003 | CN1390268A Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 01/08/2003 | CN1390088A Power assembly and method for manufacturing the same |
| 01/08/2003 | CN1390086A Method for making multi-layer circuit assembly |
| 01/08/2003 | CN1390085A Structure comprising printed circuit board mounting electronic components and method for manufacturing the same |
| 01/08/2003 | CN1390075A Electronic component and mobile communicating device using the same |
| 01/08/2003 | CN1389958A Connecting plug and method for manufacturing the same |
| 01/08/2003 | CN1389935A Fixing device of plate-type magnetic-resistance sensing element |
| 01/08/2003 | CN1389877A Strip-like cable |
| 01/08/2003 | CN1389848A Liquid crystal display apparatus with drive IC fitted on to flexible board directly connected with liquid crystal display face-board |
| 01/08/2003 | CN1389325A Method for fixing electronic element using lead-less tin-zinc soldering material without redacing connection strength |
| 01/08/2003 | CN1098617C Method for mounting electronic component and device with binder on circuit substrate |
| 01/08/2003 | CN1098536C Terminal for electronic elements and making method |
| 01/08/2003 | CN1098375C Device for processing flat workpieces in particular printed circuit boards |
| 01/07/2003 | US6505330 Method and apparatus for designing trace lengths of a clocked bus of a mounting surface |
| 01/07/2003 | US6504508 Printed circuit variable impedance transmission line antenna |
| 01/07/2003 | US6504444 High frequency integrated circuit including an isolator and dielectric filter |
| 01/07/2003 | US6504389 Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems |
| 01/07/2003 | US6504248 Surface treatment of organic insulating film and the removal of oxidized surface layer on lower electrode are done at same time by irradiation with inert gas ion; increased adhesion strength and reliable electroconductivity |
| 01/07/2003 | US6504223 Contact structure and production method thereof and probe contact assembly using same |
| 01/07/2003 | US6504111 Solid via layer to layer interconnect |