| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/16/2003 | US20030011062 Package board for multiple-pin ball grid array package, multiple-pin ball grid array package, and semiconductor device |
| 01/16/2003 | US20030011049 Interconnect circuitry, multichip module, and methods of manufacturing thereof |
| 01/16/2003 | US20030011048 Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be soldered |
| 01/16/2003 | US20030011005 Unmolded package for a semiconductor device |
| 01/16/2003 | US20030010940 Target tracking system for an X-Y table having an optical beam |
| 01/16/2003 | US20030010807 Surface mounting to an irregular surface |
| 01/16/2003 | US20030010759 Method of attaching a component to a connection support by welding without the addition of material |
| 01/16/2003 | US20030010646 Comprising enhanced brightener concentrations which accelerate the plating rate in recesses and microvias as carrier molecules become incorporated into the plating deposit; computer printed circuits; semiconductors |
| 01/16/2003 | US20030010642 Hydrodynamically inaccessible recesses of printed circuits are plated using a pulsed reversing current with cathodic pulses having a duty cycle <50%; plating hydrodynamically accessible recesses using a pulsed reversing current of <50% |
| 01/16/2003 | US20030010615 Microspring with conductive coating deposited on tip after release |
| 01/16/2003 | US20030010530 Multilayer printed board |
| 01/16/2003 | US20030010529 Molded high impedance surface and a method of making same |
| 01/16/2003 | US20030010440 Coating a multilayer lamination including a first and second cured photoimageable dielectric layers, a sticker interfaced layer of partially cured photoimageable dielectrics |
| 01/16/2003 | US20030010065 Methods of optical filament scribing of circuit patterns with planar and non-planar portions |
| 01/16/2003 | US20030009880 Electronic packaging device with insertable leads and method of manufacturing |
| 01/16/2003 | US20030009878 Method for attaching an electronic component to a substrate |
| 01/16/2003 | US20030009877 Circuit board packaging process for preventing electromagnetic interference |
| 01/16/2003 | CA2451077A1 Method of ablating an opening in a hard, non-metallic substrate |
| 01/15/2003 | EP1276360A1 Insulating material, method for producing insulating material, method for manufacturing multilayer circuit board |
| 01/15/2003 | EP1276359A2 Method for making a flexible laminate |
| 01/15/2003 | EP1276358A1 Copper foil excellent in laser beam drilling performance and production method therefor |
| 01/15/2003 | EP1276357A2 Wiring board for electrical circuits |
| 01/15/2003 | EP1276153A1 Circuit board and production method therefor |
| 01/15/2003 | EP1276150A2 Resin-encapsulated electronic device |
| 01/15/2003 | EP1276011A1 Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same |
| 01/15/2003 | EP1275695A1 Curable composition and multilayered circuit substrate |
| 01/15/2003 | EP1275680A1 Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circ |
| 01/15/2003 | EP1275665A1 Resins curable with actinic radiation, process for the production thereof, and photo- and thermo-setting resin composition |
| 01/15/2003 | EP1275503A2 Ink jet charge plate with integrated flexible lead connector structure |
| 01/15/2003 | EP1275463A2 Pb-free solder-connected electronic device |
| 01/15/2003 | EP1275462A1 Method and apparatus for soldering electronic devices to a polymer film |
| 01/15/2003 | EP1275434A2 Apparatus and method for making uniformly sized and shaped spheres |
| 01/15/2003 | EP1275281A1 Method for shielding at least the upper part of a radiocommunication module, and corresponding radiocommunication module |
| 01/15/2003 | EP1275277A1 Process for stacking layers that form a multilayer printed circuit |
| 01/15/2003 | EP1275143A2 Process for forming electrical/mechanical connections |
| 01/15/2003 | EP1275036A1 Abbe error correction system and method |
| 01/15/2003 | EP1274885A1 Electrical contacting element made of an elastic material |
| 01/15/2003 | EP1274880A2 Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore |
| 01/15/2003 | EP1274783A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 01/15/2003 | EP1274580A1 Pressure laminator apparatus and non-woven fabric formed thereby |
| 01/15/2003 | EP1070445B1 Hybrid circuit with contact surfaces (solder pads) |
| 01/15/2003 | EP1024958B1 Manufacture of lithographic printing forms |
| 01/15/2003 | EP0994777B1 Method for producing a metallic or ceramic body |
| 01/15/2003 | EP0917597B1 Method for producing conductor track structures, especially fine conductor track structures, arranged on a nonconductive support material |
| 01/15/2003 | EP0529097B1 Method of manufacturing two-layer tab tape |
| 01/15/2003 | CN2530926Y Charging and discharging material conveying device for oven |
| 01/15/2003 | CN1391704A Surface mount IC stacking method and device |
| 01/15/2003 | CN1391698A Split inductor with fractional turn of each winding and PCB including same |
| 01/15/2003 | CN1391618A Process for selective deposition of copper substrates |
| 01/15/2003 | CN1391432A Printing circuit board embedding electronic device and its manufacture |
| 01/15/2003 | CN1391431A Printing circuit board pore filling methods and apparatus |
| 01/15/2003 | CN1391430A Flexible circuit board and its preparing process |
| 01/15/2003 | CN1391429A Process for preparing flexible circuit board |
| 01/15/2003 | CN1391428A Printing circuit boards and their manufacture |
| 01/15/2003 | CN1391427A Flexible substrate, semiconductor device, camera device and X-ray camera system |
| 01/15/2003 | CN1391314A Installation socket connector of printing circuit board |
| 01/15/2003 | CN1391242A Metal membrane and manufacture thereof, laminated ceramic electronic elements and manufacture thereof |
| 01/15/2003 | CN1391236A Coating material for flat electric cable and flat electric cable therewith |
| 01/15/2003 | CN1391213A Magnetic head suspension device of magnetic disk drive and manufacturing mode |
| 01/15/2003 | CN1391137A Device for explosuring printing circuit board |
| 01/15/2003 | CN1390979A Electroplating process |
| 01/15/2003 | CN1099222C Electroplate lead structure for terminal electroplate |
| 01/15/2003 | CN1099120C Metal-ceramic composition chip, production method therefor, and soldering material for said method |
| 01/14/2003 | US6507497 Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer |
| 01/14/2003 | US6507496 Module having integrated circuit packages coupled to multiple sides with package types selected based on inductance of leads to couple the module to another component |
| 01/14/2003 | US6507384 Flexible printed wiring board, electro-optical device, and electronic equipment |
| 01/14/2003 | US6507268 Low profile mount for plural upper electrode metal oxide varistor package and method |
| 01/14/2003 | US6507121 Array structure of solder balls able to control collapse |
| 01/14/2003 | US6507113 Electronic interface structures and methods of fabrication |
| 01/14/2003 | US6507102 Printed circuit board with integral heat sink for semiconductor package |
| 01/14/2003 | US6507099 Multi-chip integrated circuit carrier |
| 01/14/2003 | US6507095 Wiring board, connected board and semiconductor device, method of manufacture thereof, circuit board, and electronic instrument |
| 01/14/2003 | US6506982 Multi-layer wiring substrate and manufacturing method thereof |
| 01/14/2003 | US6506981 Interconnect structure having fuse or anti-fuse links between profiled apertures |
| 01/14/2003 | US6506979 Sequential build circuit board |
| 01/14/2003 | US6506978 Flexible wiring board, electrooptical device and electronic equipment |
| 01/14/2003 | US6506950 Saturated linear polyfluorohydrocarbons, processes for their production, and their use in cleaning compositions |
| 01/14/2003 | US6506671 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad |
| 01/14/2003 | US6506499 Silicon-yttrium sol coating of metals |
| 01/14/2003 | US6506448 Method of protective coating BGA solder alloy spheres |
| 01/14/2003 | US6506332 Filling method |
| 01/14/2003 | US6506314 Adhesion of polymeric materials to metal surfaces |
| 01/14/2003 | US6506293 Process for the application of a metal film on a polymer surface of a subject |
| 01/14/2003 | US6506079 Multi-pole angle-connecting device |
| 01/14/2003 | US6506062 Circuit board having an integrated circuit board connector and method of making the same |
| 01/14/2003 | US6506060 Electrical junction box |
| 01/14/2003 | US6505956 Reeled L.E.D. assembly |
| 01/14/2003 | US6505955 Flexible and substantially flat printed circuit board; strip or band |
| 01/14/2003 | US6505876 Structure for wiring circuits on panel |
| 01/14/2003 | US6505553 Screen printing method and screen printing apparatus |
| 01/14/2003 | CA2093413C Improved ablation-transfer imaging/recording |
| 01/14/2003 | CA2089917C Method and apparatus for inspecting a printed circuit board (shutter system) |
| 01/09/2003 | WO2003003800A1 Successive integration of multiple devices process and product |
| 01/09/2003 | WO2003003799A1 Direct inner layer interconnect for a high speed printed circuit board |
| 01/09/2003 | WO2003003798A1 Joining method using anisotropic conductive adhesive |
| 01/09/2003 | WO2003003455A2 Using the wave soldering process to attach motherboard chipset heat sinks |
| 01/09/2003 | WO2003003444A2 Method for producing a substrate arrangement |
| 01/09/2003 | WO2003003394A1 Capacitor |
| 01/09/2003 | WO2003003381A1 Low temperature method and compositions for producing electrical conductors |
| 01/09/2003 | WO2003002786A1 Electroplating method and printed wiring board manufacturing method |