Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2003
01/22/2003EP0677090B1 Ink composition and method of making, using and recovering such composition
01/22/2003CN2532661Y Spring medium unit for fixing packaged device on printed circuit board
01/22/2003CN2532660Y Circuit board clamp
01/22/2003CN1393035A Electronic equipment
01/22/2003CN1393007A 显示模块 Display Module
01/22/2003CN1392971A Photosensitive composition, cured article thereof, and printed circuit board using same
01/22/2003CN1392835A Multilayered 4-methyl-1 pentene copolymer film and process for producing the same
01/22/2003CN1392829A Circuit board production method and circuit board production data
01/22/2003CN1392817A Solder material and electric or electronic device in which same is used
01/22/2003CN1392769A Electronic device and its producing method
01/22/2003CN1392764A Method for producing metal foil laminated product and method for producingcircuit board
01/22/2003CN1392763A Multi layer connection board and its producing method
01/22/2003CN1392762A Printing soldering tin paste on soldering area of printed circuit board and having rised printing mask with through hole
01/22/2003CN1392761A Method for high reliable packaged electronic element
01/22/2003CN1392760A Electronic element assembling method without producing unnecessary welding balls
01/22/2003CN1392759A Surface mounting method for double-side circuit module
01/22/2003CN1392758A Method for forming high density super fine circuiton fibrous substrate
01/22/2003CN1392757A Printed radio frequency induction card and its preparing method
01/22/2003CN1392756A Flexible conductive foil with electronic circuit
01/22/2003CN1392755A High frequency circuit base board and its producing method
01/22/2003CN1392601A Circuit device and its producing method
01/22/2003CN1392294A Plating method of electrocytic copper
01/22/2003CN1392038A Heat resistant buffer part for molding machine
01/22/2003CN1099826C Arrangement for installation of unit members on printed circuit board
01/22/2003CN1099825C Electronic elements and equipment
01/22/2003CN1099725C 板对板的电连接器 Board-to-board electrical connectors
01/22/2003CN1099610C Method for manufacturing fine pattern, and color filter, shading pattern filter and color LCD element formed by using same
01/22/2003CN1099334C Component of printed circuit boards
01/21/2003US6510545 Automated shielding algorithm for dynamic circuits
01/21/2003US6510356 Method and apparatus for programming a paste dispensing machine
01/21/2003US6510060 Electrical subassembly having a holding device and an electrical component fastened thereto
01/21/2003US6510059 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
01/21/2003US6510058 Printed circuit board configuration having reduced EMC/EMI interference in electromechanical relay circuits
01/21/2003US6509807 Energy conditioning circuit assembly
01/21/2003US6509647 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
01/21/2003US6509646 Plurality of inside-connected capacitors are fixed on said contact layer, and a conductive glue is used to electrically connect the capacitors to the power plane and ground plane to reduce the electrical noise between the power plane and ground
01/21/2003US6509641 High-frequency signal amplification device
01/21/2003US6509634 Chip mounting structure having adhesive conductor
01/21/2003US6509630 Flexible interconnecting substrate, film, carrier, tape-shaped semiconductor device, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
01/21/2003US6509546 Laser excision of laminate chip carriers
01/21/2003US6509531 Monolithic ceramic electronic component, method for manufacturing the same, and electronic device
01/21/2003US6509530 Via intersect pad for electronic components and methods of manufacture
01/21/2003US6509528 Printed circuit board and manufacturing process thereof
01/21/2003US6509261 Wiring forming method
01/21/2003US6509256 Methods of forming electrically conductive interconnections and electrically interconnected substrates
01/21/2003US6509207 Soldering method and apparatus for a chip and electronic devices
01/21/2003US6508890 Method of enhancing the conductivity of a conductive surface
01/21/2003US6508845 Preparation of a chip scale package; heatable pressing plate movable to press against the solder balls to planarize
01/21/2003US6508674 Multi-layer conductive device interconnection
01/21/2003US6508663 Arrangement and method for forming an electrical contact in an electronic device
01/21/2003US6508154 Integrated circuit package separators
01/21/2003US6507998 Method of mounting an electrical receptacle on a substrate
01/21/2003US6507995 Apparatus for manufacturing a wiring substrate
01/21/2003US6507993 Polymer thick-film resistor printed on planar circuit board surface
01/21/2003US6507984 Cutters having frame supports, rotation tables and pivots for semiconductor machining
01/16/2003WO2003005789A1 Method for producing multilayer wiring circuit board
01/16/2003WO2003005788A1 Multilayer flexible wiring circuit board and its manufacturing method
01/16/2003WO2003005787A1 Method for manufacturing multilayer wiring board
01/16/2003WO2003005785A1 Method for the combined processing of printed circuit boards
01/16/2003WO2003005784A2 Conductor track structures and method for the production thereof
01/16/2003WO2003005616A2 System and method for integrating optical layers in a pcb for inter-board communications
01/16/2003WO2003005458A1 Surface-mountable, radiation-emitting component and method for the production thereof
01/16/2003WO2003005437A2 Interconnect system and method of fabrication
01/16/2003WO2003005126A1 Resist curable resin composition and cured article thereof
01/16/2003WO2003004717A2 Partition plate and method for producing a partition plate for a multi-layer pressed stack
01/16/2003WO2003004567A1 High thermal conductivity spin castable potting compound
01/16/2003WO2003004262A1 Laminate and its producing method
01/16/2003WO2003004212A1 Method for the calibration of the optical system on a laser machine for machining electrical circuit substrates
01/16/2003WO2003004210A1 Method of ablating an opening in a hard, non-metallic substrate
01/16/2003WO2002058137A3 Composite microelectronic spring structure and method for making same
01/16/2003WO2002042523A3 2,4-hexadienoic acid and derivatives as corrosion inhibitors
01/16/2003WO2002037248A3 A power distribution system with a dedicated power structure and a high performance voltage regulator
01/16/2003WO2002023566A3 A lead-less surface mount reed relay
01/16/2003WO2001083844A3 Method for depositing metal and metal oxide films and patterned films
01/16/2003US20030014728 Connection block for interfacing a plurality of printed circuit boards
01/16/2003US20030013344 Apparatus and method for incorporating surface mount components into connectors
01/16/2003US20030013330 Connector and method for manufacturing same
01/16/2003US20030013286 Making interconnections to a non-flat surface
01/16/2003US20030013228 Method and apparatus for attaching solder members to a substrate
01/16/2003US20030013048 Electromagnetic filter for display screens
01/16/2003US20030013045 Integrated circuits, printed circuits; multilayer overcoatings of chromium, copper and polymer; removal zones
01/16/2003US20030013013 Circuit assembly for battery pack or the like, and method of making the same
01/16/2003US20030012975 Composite copper foil and manufacturing method thereof
01/16/2003US20030012968 Piece having a portion of its visible surface galvanized, wherein the non-galvanized portion of its visible surface is covered in a film of non-galvanizable material that adheres strongly to the galvanized material
01/16/2003US20030012927 Process for preparing metal-coated aromatic polyimide film
01/16/2003US20030012882 Adhesive polyimide resin and adhesive laminate
01/16/2003US20030012005 Electronic circuit device
01/16/2003US20030012004 Printed wiring board having non-through lead mounting hole and manufacturing method of the same
01/16/2003US20030011999 Wiring substrate, method of producing the same, and electronic device using the same
01/16/2003US20030011998 Chip scale packaging on CTE matched printed wiring boards
01/16/2003US20030011997 Electronic assembly with solderable heat sink and methods of manufacture
01/16/2003US20030011959 Monolithic ceramic capacitor
01/16/2003US20030011523 Method for forming radio frequency antenna
01/16/2003US20030011458 Planar inductors and method of manufacturing thereof
01/16/2003US20030011393 CSP BGA test socket with insert and method
01/16/2003US20030011298 Interconnecting large area display panels
01/16/2003US20030011098 PCB support plate method for PCB via fill
01/16/2003US20030011075 Semiconductor package and production method thereof
01/16/2003US20030011074 Printed circuit board having an improved land structure
01/16/2003US20030011070 Semiconductor package, method of manufacturing the same, and semiconductor device