| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/29/2003 | CN1100475C Connecting structure of frame and printed circuit board |
| 01/29/2003 | CN1100474C Electronic package and its mfg. method |
| 01/29/2003 | CN1100473C Structure reinforced spherical grid array semiconductor package and system |
| 01/29/2003 | CN1100347C Method for producing semiconductor device |
| 01/29/2003 | CN1100326C Flat flexible cable |
| 01/29/2003 | CN1100325C Flexible electric cable and its application |
| 01/29/2003 | CN1100280C Liquid crystal display device and data processor |
| 01/29/2003 | CN1100268C Method for testing printed circuit card |
| 01/29/2003 | CN1099962C Screen printing method and screen printing apparatus |
| 01/28/2003 | US6512861 Packaging and assembly method for optical coupling |
| 01/28/2003 | US6512673 Low profile equipment housing with angular fan |
| 01/28/2003 | US6512664 Static dissipative shunt housing |
| 01/28/2003 | US6512491 Antenna device and its assembly method and wireless communication terminal and their assembly method |
| 01/28/2003 | US6512423 Printed board, method for producing the same, and electronic device having the same |
| 01/28/2003 | US6512303 Flip chip adaptor package for bare die |
| 01/28/2003 | US6512301 Making interconnections to a non-flat surface |
| 01/28/2003 | US6512294 Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making the same |
| 01/28/2003 | US6512290 Vertically mountable and alignable semiconductor device, assembly, and methods |
| 01/28/2003 | US6512186 Multilayer printed wiring board having a roughened inner conductor layer and production method thereof |
| 01/28/2003 | US6512185 Printed-wiring board |
| 01/28/2003 | US6512184 Anisotropically electroconductive connection body and method for forming it |
| 01/28/2003 | US6512183 Electronic component mounted member and repair method thereof |
| 01/28/2003 | US6512182 Wiring circuit board and method for producing same |
| 01/28/2003 | US6512181 Multilayer type printed-wiring board and method of measuring impedance of multilayer type printed-wiring board |
| 01/28/2003 | US6512180 Printed-wiring board, method for identifying same, and method for manufacturing same |
| 01/28/2003 | US6512064 Fluororesin film of high mechanical strength |
| 01/28/2003 | US6511546 Aqueous cleaning |
| 01/28/2003 | US6511347 Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site |
| 01/28/2003 | US6510978 Solder jet machine and soldering method |
| 01/28/2003 | US6510977 Method and apparatus using laminated foils for placing conductive preforms |
| 01/28/2003 | US6510724 Method and system for selective soldering process characterization |
| 01/28/2003 | CA2150408C Azeotrope and azeotrope-like compositions of octamethyltrisiloxane |
| 01/23/2003 | WO2003007672A1 Electromagnetic filter for display screens |
| 01/23/2003 | WO2003007670A1 Method for manufacturing ceramic multilayer circuit board |
| 01/23/2003 | WO2003007430A1 Feed-through manufacturing method and feed-through |
| 01/23/2003 | WO2003007379A1 Electronic circuit component |
| 01/23/2003 | WO2003007376A1 Power module and air conditioner |
| 01/23/2003 | WO2003007375A2 Single package containing multiple integrated circuit devices |
| 01/23/2003 | WO2003007370A1 Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor |
| 01/23/2003 | WO2003007369A1 Semiconductor connection substrate |
| 01/23/2003 | WO2003007338A2 Method for attaching an electronic component to a substrate |
| 01/23/2003 | WO2003007084A1 Method for production of printed wiring board |
| 01/23/2003 | WO2003007078A2 Photocurable resist inks |
| 01/23/2003 | WO2003006711A1 Method of surface treatment for copper workpiece |
| 01/23/2003 | WO2003006708A2 Drill bit for printed circuit board fabrication and method for treatment thereof |
| 01/23/2003 | WO2003006396A1 Bonding method and product |
| 01/23/2003 | WO2003006243A1 Screen printing apparatus |
| 01/23/2003 | WO2003006236A1 Component of printed circuit boards |
| 01/23/2003 | WO2003006197A1 Method and device for applying a solder to a substrate |
| 01/23/2003 | WO2002082875A3 Circuit board with voltage-conducting electromechanical components and method for production of said circuit board |
| 01/23/2003 | WO2002057928A3 Signaling on an electromagnetically-coupled bus |
| 01/23/2003 | WO2002037909A3 Method and apparatus for distributing power to integrated circuits |
| 01/23/2003 | WO2002011202A3 Method and device for producing connection substrates for electronic components |
| 01/23/2003 | WO2001054203A3 Direct printing of thin-film conductors using metal-chelate inks |
| 01/23/2003 | US20030018401 Punch and die optimization |
| 01/23/2003 | US20030018243 Selectively plated sensor |
| 01/23/2003 | US20030017879 Automatic stabilizer for high-speed drill spindle |
| 01/23/2003 | US20030017719 Method for manufacturing circuit component |
| 01/23/2003 | US20030017687 Method for filling a wafer through-VIA with a conductive material |
| 01/23/2003 | US20030017653 Semiconductor package insulation film and manufacturing method thereof |
| 01/23/2003 | US20030017645 Method for manufacturing circuit device |
| 01/23/2003 | US20030017414 Photosensitive resin composition |
| 01/23/2003 | US20030017357 A surface of each of the copper and metal sheets are pure and engageable with each other at an interface, a bond is formed along the edges that is temperature sensitive and deteriorates at > 180 degrees f |
| 01/23/2003 | US20030017327 High adhesion triple layered anisotropic conductive adhesive film |
| 01/23/2003 | US20030017277 Laser energy strikes a target substrate comprising a rheological fluid, causing a portion of the rheological fluid to evaporate and propel a jet of nonevaporated rheological fluid onto a receiving substrate |
| 01/23/2003 | US20030016508 Capacitor sheet, electro-optical device with capacitor, flexible substrate, composite build-up substrate, and electronic apparatus |
| 01/23/2003 | US20030016503 Solder-free PCB assembly |
| 01/23/2003 | US20030016484 Method of producing ceramic laminates, laminated electronic parts and method of producing the same |
| 01/23/2003 | US20030016342 Aligner |
| 01/23/2003 | US20030016116 Method of depositing a thin metallic film and related apparatus |
| 01/23/2003 | US20030016026 Method and apparatus for inspecting printed circuit boards |
| 01/23/2003 | US20030015791 Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment |
| 01/23/2003 | US20030015777 Connection of packaged integrated memory chips to a printed circuit board |
| 01/23/2003 | US20030015776 Press-fit chip package |
| 01/23/2003 | US20030015575 Solder material and electric or electronic device in which the same is used |
| 01/23/2003 | US20030015574 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate |
| 01/23/2003 | US20030015572 Successive integration of multiple devices process and product |
| 01/23/2003 | US20030015498 Contacting resinous material with a lactone solvent swell composition to condition the resinous material for porous texturing with an etchant; and contacting the conditioned resinous material with an etchant |
| 01/23/2003 | US20030015433 Electrolytic copper plating method |
| 01/23/2003 | US20030015349 Printed wiring board having wiring patterns and connection terminals |
| 01/23/2003 | US20030015348 Printed circuit board with a heat dissipation element, mehtod for manufacturing the printed circuit board, and package comprising the printed circuit board |
| 01/23/2003 | US20030015345 Laminated base sheet for flexible printed circuit board |
| 01/23/2003 | US20030014895 Control system for ablating high-density array of vias or indentation in surface of object |
| 01/23/2003 | US20030014864 Process for mass prodcution of plates for holding connection pins of electronic components |
| 01/23/2003 | US20030014863 Method for manufacturing a printed circuit board |
| 01/23/2003 | DE20218201U1 Circuit board module for rotary operating switch e.g. for cooker time switch, comprises conductive tracks on first circuit board coupled to contact faces on second circuit board |
| 01/22/2003 | EP1278407A1 Laminate with inside layer circuit used for multilayer printed circuit board for high frequency circuit, and method and device for measuring circuit impedance of the laminate with inside layer circuit |
| 01/22/2003 | EP1278406A1 Apparatus for making multi-layered printed circuits |
| 01/22/2003 | EP1278405A1 Circuit board producing method and circuit board producing device |
| 01/22/2003 | EP1278404A1 Circuit board and production method thereof |
| 01/22/2003 | EP1278240A2 Transfering method of a component onto a connection support by welding without supplying material |
| 01/22/2003 | EP1277852A1 Process for partially galvanising a workpiece made by injection moulding |
| 01/22/2003 | EP1277819A1 Connecting material |
| 01/22/2003 | EP1277798A2 Thermosetting resin composition |
| 01/22/2003 | EP1277696A2 Spring with conductive coating |
| 01/22/2003 | EP1277278A1 Isolating energy conditioning shield assembly |
| 01/22/2003 | EP1276799A2 Flame retardant epoxy molding compositions |
| 01/22/2003 | EP1276587A1 Device for processing substrates and method therefor which entails the use of such a device |
| 01/22/2003 | EP1042539A4 Printed circuit manufacturing process using tin-nickel plating |
| 01/22/2003 | EP0988129B1 Method and device for repairing defective soldered joints |