| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/04/2003 | US6514392 Conducting roller for an electroplating apparatus |
| 02/04/2003 | US6514367 Hot lamination process for the manufacture of a combination contact/contactless smart card |
| 02/04/2003 | US6514364 Conductive particles can be sintered without being influenced by softening and removing of adhesive layer, forming wiring pattern of high precision without causing deformation |
| 02/04/2003 | US6514103 Printed circuit board connector |
| 02/04/2003 | US6514089 Terminal connecting device for flexible substrate |
| 02/04/2003 | US6513959 Vehicle ceiling-mounting electric equipment assembly |
| 02/04/2003 | US6513701 Method of making electrically conductive contacts on substrates |
| 02/04/2003 | US6513236 Method of manufacturing bump-component mounted body and device for manufacturing the same |
| 02/04/2003 | CA2224772C Gas knife cooling system |
| 01/30/2003 | WO2003009661A1 Core substrate, and multilayer circuit board using it |
| 01/30/2003 | WO2003009660A1 Method and material for manufacturing circuit-formed substrate |
| 01/30/2003 | WO2003009659A1 Method for forming conducting layer onto substrate |
| 01/30/2003 | WO2003009658A1 Method for singulating flexible circuit |
| 01/30/2003 | WO2003009657A1 Circuit board, circuit board-use member and production method therefor and method of laminating fexible film |
| 01/30/2003 | WO2003009656A1 Circuit-formed substrate and method of manufacturing circuit-formed substrate |
| 01/30/2003 | WO2003009655A1 Film for circuit board |
| 01/30/2003 | WO2003009427A1 System and method for electrically contacting and mechanically fixing printed circuit boards |
| 01/30/2003 | WO2003009378A1 Solder-free pcb assembly |
| 01/30/2003 | WO2003009308A2 Electrical line |
| 01/30/2003 | WO2003008940A1 Confocal 3d inspection system and process |
| 01/30/2003 | WO2003008671A1 Composite foil and its manufacturing process |
| 01/30/2003 | WO2003008502A1 Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet |
| 01/30/2003 | WO2002087293A3 Support for electrical circuit elements |
| 01/30/2003 | WO2002076166A9 Heat sink |
| 01/30/2003 | WO2002047208A9 Connector |
| 01/30/2003 | US20030023944 Method for ensuring correct pin assignments between system board connections using common mapping files |
| 01/30/2003 | US20030023449 Manufacturing labor cost estimator |
| 01/30/2003 | US20030022958 Resist ink composition |
| 01/30/2003 | US20030022953 Antireflective porogens |
| 01/30/2003 | US20030022945 Method to improve the stability of dispersions of carbon |
| 01/30/2003 | US20030022558 Electronic device, method of manufacturing the same and method of designing the same, and circuit board and electronic instrument |
| 01/30/2003 | US20030022534 Method and apparatus for mounting chip |
| 01/30/2003 | US20030022503 Method for the fabrication of electrical contacts |
| 01/30/2003 | US20030022492 Metal film and manufacturing method therefor, and laminated ceramic electronic component and manufacturing method therefor |
| 01/30/2003 | US20030022479 Semiconductor device, a method of manufacturing the same and an electronic device |
| 01/30/2003 | US20030022477 Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints |
| 01/30/2003 | US20030022462 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures |
| 01/30/2003 | US20030022419 Method of fabricating vias in solder pads of a ball grid array (BGA) substrate |
| 01/30/2003 | US20030022403 Transfer method, method of manufacturing thin film devices, method of manufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and elecronic appliance |
| 01/30/2003 | US20030022102 Electroconductive wiring formed in dielectric body for use in electric/electronic appliances, and communication devices; electroless plating |
| 01/30/2003 | US20030022098 Photoresist composition |
| 01/30/2003 | US20030022014 Vacuum deposition multilayer; reduced expansion |
| 01/30/2003 | US20030022013 Drill stack formation |
| 01/30/2003 | US20030021968 X-ray printing personalization technique |
| 01/30/2003 | US20030021897 Screen printing apparatus and method of screen printing |
| 01/30/2003 | US20030021889 Adhesive bonding of dielectric to conductivity layer |
| 01/30/2003 | US20030021887 Compositions containing heterocylcic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material |
| 01/30/2003 | US20030021886 Method of printing and printing machine |
| 01/30/2003 | US20030021718 Lead-free solder alloy |
| 01/30/2003 | US20030020658 Activation layer controlled variable impedance transmission line |
| 01/30/2003 | US20030020506 Testing device for printed circuit boards |
| 01/30/2003 | US20030020179 Methods and apparatus for aligning an integrated circuit package with an interface |
| 01/30/2003 | US20030020158 Semiconductor device and contactor for inspection |
| 01/30/2003 | US20030020156 Electronic package with optimized lamination process |
| 01/30/2003 | US20030020155 Chip-on-board module, and method of manufacturing the same |
| 01/30/2003 | US20030020150 Compliant layer for encapsulated columns |
| 01/30/2003 | US20030020149 Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same |
| 01/30/2003 | US20030020145 Semiconductor device having reinforced coupling between solder balls and substrate |
| 01/30/2003 | US20030019917 Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus |
| 01/30/2003 | US20030019854 Multiple beam micro-machining system and method |
| 01/30/2003 | US20030019846 Flex to flex soldering by diode laser |
| 01/30/2003 | US20030019836 Method for the fabrication of electrical contacts |
| 01/30/2003 | US20030019735 Bonding electrical components to substrates |
| 01/30/2003 | US20030019664 Electrically conducting bonding connection |
| 01/30/2003 | US20030019663 Multi-layer wiring substrate and manufacturing method thereof |
| 01/30/2003 | US20030019662 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 01/30/2003 | US20030019659 Bending-resistant flexible flat cable and production process thereof |
| 01/30/2003 | US20030019647 Protected electronic assembly |
| 01/30/2003 | US20030019573 Method for bonding an integrated circuit device to a glass substrate |
| 01/30/2003 | US20030019568 Method for joining conductive structures and an electrical conductive article |
| 01/30/2003 | US20030019563 Method of manufacturing multilayer ceramic wiring board and conductive paste for use |
| 01/30/2003 | US20030019562 Adhesive bonding of printed circuit boards to heat sinks |
| 01/30/2003 | DE20114939U1 Circuit arrangement e.g. for detecting position of elevator doors, comprises modules mounted in a ball grid array housing on a circuit board |
| 01/30/2003 | DE19549536C2 Mfg. printed circuit assembly for construction of sub-assemblies in e.g. microwave electronic equipment |
| 01/30/2003 | CA2454377A1 Composite foil and its manufacturing process |
| 01/29/2003 | EP1280394A1 Apparatus comprising contacts made from carbon tracks and process for manufacturing the same |
| 01/29/2003 | EP1280393A2 Multilayer circuit board and method for manufacturing multilayer circuit board |
| 01/29/2003 | EP1280392A1 Printed circuit board and relevant manufacturing method for the installation of microwave chips up to 80 Ghz |
| 01/29/2003 | EP1280237A2 Connector for printed board |
| 01/29/2003 | EP1280223A1 Dielectric filter and method of making same |
| 01/29/2003 | EP1280213A2 Layered wiring line of silver or silver alloy and method for forming the same and display panel substrate using the same |
| 01/29/2003 | EP1280204A2 Wiring substrate having position problem |
| 01/29/2003 | EP1279750A1 Pretreating agent for metal plating |
| 01/29/2003 | EP1279469A1 Vacuum gripper to be used for the manufacture of multi-layered printed circuits |
| 01/29/2003 | EP1279323A1 A method for fastening a printed board to an element and a guide element |
| 01/29/2003 | EP1279195A1 Electronic component with flexible contact points and method for the production thereof |
| 01/29/2003 | EP1278806A1 Adhesive bonding laminates |
| 01/29/2003 | EP1278631A2 Method of making reactive multilayer foil and resulting product |
| 01/29/2003 | EP1278612A1 Flip chip interconnection structure |
| 01/29/2003 | EP0925622B1 Miniature filament lamp |
| 01/29/2003 | EP0877762A4 Dual-curing coating formulation and method |
| 01/29/2003 | CN2533641Y Water stopping device for horizontal wet making circuit board |
| 01/29/2003 | CN1394465A Circuit forming board producing method, circuit foaming board, material for circuit forming board |
| 01/29/2003 | CN1394358A Laser system and method for processing memory link with burst of laser pulses having ultrashort pulsewidths |
| 01/29/2003 | CN1394113A Method for mfg. glass ceramic multi-substrate and glass ceramic multi-substrate |
| 01/29/2003 | CN1394112A Soldering paste printing method and equipment for printing soldering paste on wiring pattern board |
| 01/29/2003 | CN1394111A Method for etching laminated assembly containing polyimide layer |
| 01/29/2003 | CN1394110A Process for praparing contact electrode of high-temp superconductor filter |
| 01/29/2003 | CN1394109A Method for making circuit board |
| 01/29/2003 | CN1393696A Pressing contacting structure for detector |