Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2003
05/14/2003EP1311025A2 Electronic-part mounting structure and mounting method therefor
05/14/2003EP1310995A2 Device for shielding the signal lines by the ground or power lines
05/14/2003EP1310992A1 Microparticle arrangement film, electrical connection film, electrical connection structure, and microparticle arrangement method
05/14/2003EP1310773A2 Electronic device and thermal type flow meter on vehicle
05/14/2003EP1310582A1 Process for electrolytic copper plating
05/14/2003EP1310525A1 Copper foil with resin and printed wiring boards made by using the same
05/14/2003EP1310142A2 Improved adhesion of polymeric materials to metal surfaces
05/14/2003EP1309997A2 Electrical component assembly and method of fabrication
05/14/2003EP1309996A2 Electrical assembly and method for producing said electrical assembly
05/14/2003EP1309976A1 Photolithographically-patterned out-of-plane coil structures
05/14/2003EP1309740A2 Elastic contact element
05/14/2003EP1309735A2 Method and apparatus for fine feature spray deposition
05/14/2003EP1309447A1 Lead-free alloys with improved wetting properties
05/14/2003EP1309420A1 Soldering method for mounting electric components
05/14/2003EP1233935B1 Method for attaching a body, which is comprised of a metal matrix composite (mmc) material, to a ceramic body
05/14/2003EP1133902B1 Electromechanical component
05/14/2003EP0815622B1 Cross-connect method and apparatus
05/14/2003CN2550991Y Rotary angle stopping piece
05/14/2003CN1418454A Treatment of circuit supports with impulse excitation
05/14/2003CN1418051A Welder
05/14/2003CN1418050A Manufacture of wiring substrate
05/14/2003CN1418049A Multilayer ceramic substrate and its production process
05/14/2003CN1417856A Semiconductor package and its manufacture
05/14/2003CN1417855A Multilayer substrate for semiconductor device
05/14/2003CN1417777A Fixed disk drive including flexible printed circuit board with damping material
05/14/2003CN1417645A Panel surface exposing device
05/14/2003CN1108736C Method of producing metallic layer on surface of detail for shielding against electromagnetic radiation
05/14/2003CN1108648C Electric connector assembly with improved registration characteristics
05/14/2003CN1108635C Process for manufacturing semiconductor device
05/14/2003CN1108617C Fitting assembly of electric component
05/13/2003US6563905 Ball grid array X-ray orientation mark
05/13/2003US6563696 Solderless laser assembly
05/13/2003US6563691 Mounting structure for capacitors
05/13/2003US6563688 Isolating energy conditioning shield assembly
05/13/2003US6563330 Probe card and method of testing wafer having a plurality of semiconductor devices
05/13/2003US6563225 Aluminum particles and aluminum-zinc-magnesium-germanium alloy; electronics
05/13/2003US6563223 Interconnection component for facilitating testing of packaged integrated circuits
05/13/2003US6563214 Electronic component and method of manufacturing the same
05/13/2003US6563210 Parallel plane substrate
05/13/2003US6563058 Multilayered circuit board and method for producing the same
05/13/2003US6563057 Printed circuit board and method for manufacturing same
05/13/2003US6562661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
05/13/2003US6562660 Method of manufacturing the circuit device and circuit device
05/13/2003US6562659 External circuit packaging method and thermocompression bonding apparatus
05/13/2003US6562656 Cavity down flip chip BGA
05/13/2003US6562654 Tented plated through-holes and method for fabrication thereof
05/13/2003US6562641 Apparatus and methods of semiconductor packages having circuit-bearing interconnect components
05/13/2003US6562637 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
05/13/2003US6562636 Wafer level burn-in and electrical test system and method
05/13/2003US6562545 Method of making a socket assembly for use with a solder ball
05/13/2003US6562410 Heat curable epoxy compositions
05/13/2003US6562250 Method for manufacturing wiring circuit boards with bumps and method for forming bumps
05/13/2003US6562179 High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these
05/13/2003US6562169 Multi-level web structure in use for thin sheet processing
05/13/2003US6562149 For firmly bonding laminated multilayered printed circuit boards and for bonding resists to copper
05/13/2003US6562147 Soldered product
05/13/2003US6562099 High-speed fabrication of highly uniform metallic microspheres
05/13/2003US6561854 Connection system
05/13/2003US6561825 Vacuum pick up cap for use with electrical connector
05/13/2003US6561408 Bonding head and component mounting apparatus
05/13/2003US6561407 Reflow soldering apparatus and method
05/13/2003US6561088 Silk-screen printing machine
05/13/2003US6560864 Process for manufacturing a flat coil
05/13/2003US6560863 Method of producing wiring board
05/13/2003US6560861 Microspring with conductive coating deposited on tip after release
05/13/2003US6560860 Providing multilayered low temperature co-fired ceramic assembly with constraining core to minimize shrinkage of outer ceramic layers having high density circuit features patterned thereon during firing
05/13/2003US6560844 Alignment plate with matched thermal coefficient of expansion
05/08/2003WO2003039223A1 Transistor pin geometries that are suitable for contacting
05/08/2003WO2003039219A1 Method for manufacturing multilayer circuit board for semiconductor device
05/08/2003WO2003039218A1 Method of forming a mask on surface
05/08/2003WO2003039217A1 Method for opening the plastic housing of an electronic module
05/08/2003WO2003038897A2 Electronic unit, circuit design for the same, and production method
05/08/2003WO2003038896A2 Ball grid array with x-ray alignment mark
05/08/2003WO2003038887A1 Contact planarization materials that generate no volatile byproducts or residue during curing
05/08/2003WO2003038865A2 Stacking multiple devices using direct soldering
05/08/2003WO2003038852A1 Method and device for etching a thin conductive layer which is disposed on an insulating plate such as to form an electrode network thereon
05/08/2003WO2003038748A1 Rotary screen printing method for manufacturing an antenna
05/08/2003WO2003038576A2 Module and connector having multiple contact rows
05/08/2003WO2003038527A1 Uv curable powder suitable for use as photoresist
05/08/2003WO2003038524A1 Methods of producing photosensitive ceramic composition and multi-layer substrate using it
05/08/2003WO2003038159A2 Method and conveyorized system for electrolytically processing work pieces
05/08/2003WO2003038158A2 Electroplating device and electroplating system for coating already conductive structures
05/08/2003WO2003038149A1 Surface-treated copper foil
05/08/2003WO2003038147A2 High resolution patterning method
05/08/2003WO2003038146A2 High resolution patterning method
05/08/2003WO2003038002A1 Ink-jet inks containing metal nanoparticles
05/08/2003WO2003037953A1 Resin composition
05/08/2003WO2003037783A1 Method for manufacturing metal microstructure
05/08/2003WO2003037631A1 Screen printing apparatus
05/08/2003WO2003037620A1 Polyimide-metal layered products and polyamideimide-metal layered product
05/08/2003WO2002067017A3 Optical device module and method of fabrication
05/08/2003WO2001091508A3 Telecommunications wiring device
05/08/2003US20030088846 System and program for estimating person-hours required to prepare a pattern film of a circuit to be printed on a board
05/08/2003US20030088802 Method and apparatus for reducing signal timing skew on a printed circuit board
05/08/2003US20030087999 Thermosetting resin compositions containing maleimide and/or vinyl compounds
05/08/2003US20030087538 Wiring board with built-in electronic component and method for producing the same
05/08/2003US20030087498 Via components for integrated passive components
05/08/2003US20030087483 Semiconductor device and method for manufacturing substrate of the same
05/08/2003US20030087478 Semiconductor device and a method of manufacturing the same
05/08/2003US20030087477 Repairable flip clip semiconductor device with excellent packaging reliability and method of manufacturing same
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