| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/22/2004 | CN1168053C Method and apparatus for mfg. resonance labels |
| 09/21/2004 | US6795152 Liquid crystal display apparatus and method for checking the joining accuracy thereof |
| 09/21/2004 | US6794961 High frequency circuit module |
| 09/21/2004 | US6794956 Circuit substrate having resistive films connecting external terminals in series with lands |
| 09/21/2004 | US6794947 Method for adjusting oscillator frequencies |
| 09/21/2004 | US6794813 Electron source, image forming apparatus, and manufacture method for electron source |
| 09/21/2004 | US6794762 Electronic component and fabrication method thereof |
| 09/21/2004 | US6794747 Semiconductor device |
| 09/21/2004 | US6794737 Spring structure with stress-balancing layer |
| 09/21/2004 | US6794729 Stacked capacitor and method of forming the same as well as semiconductor device using the same and circuit board using the same |
| 09/21/2004 | US6794616 Solder reflow oven |
| 09/21/2004 | US6794585 Printed circuit board having filled throughole with corner rounded portion and manufacturing method |
| 09/21/2004 | US6794584 Conductor strip formed with slit, cutout or grooves |
| 09/21/2004 | US6794582 Mask for screen printing, the method for producing same and circuit board produced by screen printing with such mask |
| 09/21/2004 | US6794581 Method and apparatus for distributing power to integrated circuits |
| 09/21/2004 | US6794580 Solder interconnections for flat circuits |
| 09/21/2004 | US6794578 Quadrax to twinax conversion apparatus and method |
| 09/21/2004 | US6794221 Method of placing elements into receptors in a substrate |
| 09/21/2004 | US6794202 Assemblies for temporarily connecting microelectronic elements for testing and methods therefor |
| 09/21/2004 | US6794098 Capacitor with plasma deposited dielectric |
| 09/21/2004 | US6794040 Printed circuit board or card having plated through-holes filled with a photocured polymer |
| 09/21/2004 | US6794031 Cover-lay film and printed circuit board having the same |
| 09/21/2004 | US6794022 Metal plate coated with lubricating resin and drilling processing method of printed wiring board use thereof |
| 09/21/2004 | US6793852 Scavenging method |
| 09/21/2004 | US6793796 Contacting the surface with an electroplating solution comprising metal ions, a suppressor, an accelerator and a leveler additives, in succession applying direct cathodic current density optimized to form conformal thin film |
| 09/21/2004 | US6793759 Method for creating adhesion during fabrication of electronic devices |
| 09/21/2004 | US6793751 Method for manufacturing laminated ceramic electronic component |
| 09/21/2004 | US6793543 Bus bar structure |
| 09/21/2004 | US6793541 Circuit board connector with improved terminal tails |
| 09/21/2004 | US6793505 Ganged land grid array socket contacts for improved power delivery |
| 09/21/2004 | US6793503 Ganged land grid array socket contacts for improved power delivery |
| 09/21/2004 | US6793501 Electric components for printed boards and method for automatically inserting said components in printed boards |
| 09/21/2004 | US6793371 LED lamp assembly |
| 09/21/2004 | US6793116 Solder ball and interconnection structure using the same |
| 09/21/2004 | US6792852 Vacuum print system |
| 09/21/2004 | US6792679 Method of producing electrical connecting elements |
| 09/21/2004 | US6792677 Method of manufacturing an electronic component unit |
| 09/21/2004 | US6792675 Apparatus for aligning and soldering connectors to a printed board |
| 09/16/2004 | WO2004080141A1 Process for producing multilayer printed wiring board and multilayer printed wiring board |
| 09/16/2004 | WO2004080140A1 Surface mounting daughter board into an aperture of mother board |
| 09/16/2004 | WO2004080139A1 Method for manufacturing an electrically conductive pattern |
| 09/16/2004 | WO2004080138A1 Forming electromagnetic communication circuit components using densified metal powder |
| 09/16/2004 | WO2004080137A1 Method and system for manufacturing an electrically conductive metal foil structure |
| 09/16/2004 | WO2004080136A1 Connection structure of printed wiring board |
| 09/16/2004 | WO2004079876A1 Optical module and optical transmission/reception device |
| 09/16/2004 | WO2004079821A1 Packaging structure of high frequency semiconductor device, high frequency transmitter and high frequency receiver employing it |
| 09/16/2004 | WO2004079795A2 Coaxial waveguide microstructures and methods of formation thereof |
| 09/16/2004 | WO2004079304A2 Liquid level sending unit with flexible sensor board |
| 09/16/2004 | WO2004078870A1 Conductive adhesive compositions with electical stability and good impact resistance for use in electronics devices |
| 09/16/2004 | WO2004078701A1 Bis(3-amino-4-hydroxyphenyl)adamantane derivatives and process for production thereof |
| 09/16/2004 | WO2004078472A1 Laminated tape of anisotropic conductive film and method of manufacturing the same |
| 09/16/2004 | WO2004078366A1 Vibrator and portable terminal device mounted with the vibrator |
| 09/16/2004 | WO2004078165A1 Cataplasm base and cataplasm using the same |
| 09/16/2004 | WO2004062037A3 Connector and printed circuit board for reducing cross-talk |
| 09/16/2004 | WO2003082937A9 Polymerisable composition |
| 09/16/2004 | WO2003038158A3 Electroplating device and electroplating system for coating already conductive structures |
| 09/16/2004 | US20040180539 Method of forming a penetration electrode and substrate having a penetration electrode |
| 09/16/2004 | US20040180526 Solder on a sloped surface |
| 09/16/2004 | US20040180471 Method of manufacturing stacked semiconductor device |
| 09/16/2004 | US20040180469 SMT passive device noflow underfill methodology and structure |
| 09/16/2004 | US20040180292 converting an organometallic precursor material to a metal-containing pattern adherent to a substrate |
| 09/16/2004 | US20040180225 Peel strength enhancement of copper laminates |
| 09/16/2004 | US20040179347 Circuit board |
| 09/16/2004 | US20040179306 Flexible printed circuit board unit contributing to reliable soldering and suppression of increased temperature |
| 09/16/2004 | US20040179151 Display device |
| 09/16/2004 | US20040178539 System and method for bending a substantially rigid substrate |
| 09/16/2004 | US20040178523 Molded waveguides |
| 09/16/2004 | US20040178514 Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method |
| 09/16/2004 | US20040178510 Electronic parts packaging structure and method of manufacturing the same |
| 09/16/2004 | US20040178508 Stacked semiconductor device |
| 09/16/2004 | US20040178496 Memory expansion and chip scale stacking system and method |
| 09/16/2004 | US20040178492 Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring board |
| 09/16/2004 | US20040178491 Method for fabricating semiconductor components by forming conductive members using solder |
| 09/16/2004 | US20040178489 Multilayer circuit and method of manufacturing |
| 09/16/2004 | US20040178486 Electronic component device and manufacturing method therefor |
| 09/16/2004 | US20040178393 Conductive paste, method of controlling viscosity thereof and electronic component using the same |
| 09/16/2004 | US20040178369 Device for processing substrates, especially electrical circuit substrates, with a laser |
| 09/16/2004 | US20040178251 Manufacture of solid-solder-deposit PCB utilizing electrically heated wire mesh |
| 09/16/2004 | US20040178250 Oriented connections for leadless and leaded packages |
| 09/16/2004 | US20040178000 Standardized circuit board core |
| 09/16/2004 | US20040177999 Wiring substrate |
| 09/16/2004 | US20040177998 Circuitized substrate assembly and method of making same |
| 09/16/2004 | US20040177997 Electronic apparatus |
| 09/16/2004 | US20040177921 Joining method using anisotropic conductive adhesive |
| 09/16/2004 | US20040177919 Reel-type package of flexible printed circuit boards and method for supplying thereof |
| 09/16/2004 | US20040177777 Uphill screen printing in the manufacturing of microelectronic components |
| 09/16/2004 | US20040177774 Reinforcement combining apparatus and method of combining reinforcement |
| 09/16/2004 | US20040177498 Electronic device and manufacturing same |
| 09/16/2004 | US20040177497 Self-adjusting printed circuit board support and method of use |
| 09/16/2004 | DE20307111U1 Komponententräger Component support |
| 09/16/2004 | DE20220971U1 Selective soldering device for soldering components onto circuit boards, has outlet opening at known distance from top of pipe in each pipe extending vertically above solder container |
| 09/16/2004 | DE202004007591U1 High frequency base material consisting of PTFE carrier layer coated on at least one side with metal layer, for use in automobile construction and telecommunication industries |
| 09/16/2004 | DE202004003619U1 Exchangeable end caps for low-energy lights with protective tubes are designed so that the mechanical connection between the bulb protection tube and the end cap can be undone |
| 09/16/2004 | DE19904327B4 Verfahren zum Bestücken von Leiterplatten mit Bauteilen A method for PCB assembly with components |
| 09/16/2004 | DE10320646A1 Electronic component, typically integrated circuit, system support and manufacturing method, with support containing component positions in lines and columns, starting with coating auxiliary support with photosensitive layer |
| 09/16/2004 | DE10304906A1 SMT-fähiges Bauelement und Leiterplatte sowie SMT-Verfahren SMT-enabled device and PCB and SMT process |
| 09/16/2004 | DE10297264T5 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 09/16/2004 | DE102004010633A1 Elektronisches Baulelement zum Verkleben einer Mehrzahl von Elektroden und Verfahren zum Montieren desselben The same electronic Baulelement for bonding a plurality of electrodes, and method of assembling |
| 09/16/2004 | DE102004006312A1 Verfahren zur Herstellung einer isolierenden Harzzusammensetzung, eine isolierende Harzzusammensetzung, eine mehrschichtige Leiterplatte und ein Verfahren für deren Herstellung A method for manufacturing an insulating resin composition, an insulating resin composition, a multilayer printed wiring board and a method for their preparation |
| 09/16/2004 | DE10153171B4 Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen Method and apparatus for electrolytic treatment of parts in continuous flow systems |