| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 09/23/2004 | WO2004082180A2 Method for optimizing high frequency performance of via structures |
| 09/23/2004 | WO2004082022A2 Method for producing an electronic component or module and a corresponding component or module |
| 09/23/2004 | WO2004082019A1 Printed wiring board, method for manufacturing same, lead frame package and optical module |
| 09/23/2004 | WO2004081952A1 Polymer composite high-dielectric-constant material, multilayer printed circuit board and module board |
| 09/23/2004 | WO2004081263A1 Electroplating pcb components |
| 09/23/2004 | WO2004081262A1 Method of electroplating a workpiece having high-aspect ratio holes |
| 09/23/2004 | WO2004080641A1 Device for processing substrates with laser, especially electric circuit substrates |
| 09/23/2004 | WO2004063302A3 High temperature resistant films and adhesive articles made therefrom |
| 09/23/2004 | WO2004062843A3 Universal remover for electronic components and unsoldering paste for removing surface mount electronics components |
| 09/23/2004 | WO2003081641B1 Support clip |
| 09/23/2004 | US20040185717 Filter insert for an electrical connector assembly |
| 09/23/2004 | US20040185688 Connector interface pad for structurally integrated wiring |
| 09/23/2004 | US20040185388 Printed circuit board, method for producing same, and ink therefor |
| 09/23/2004 | US20040185379 Multilayer circuit component and method for manufacturing the same |
| 09/23/2004 | US20040185284 Ultrathin charge dissipation coatings |
| 09/23/2004 | US20040185280 Integrated circuits; three-dimensional; pattern profile; concave, convex coverings |
| 09/23/2004 | US20040185275 Metal-clad laminate; carrier film and water soluble releasing layer |
| 09/23/2004 | US20040184293 Switching power supply unit |
| 09/23/2004 | US20040184255 Method for wave soldering of surface mounted light emitting diodes |
| 09/23/2004 | US20040184248 Power delivery apparatus, systems, and methods |
| 09/23/2004 | US20040184244 Circuit board assembling structure |
| 09/23/2004 | US20040184184 Disk drive having flexible circuit board connecting between main frame and main printed circuit board |
| 09/23/2004 | US20040183985 Liquid crystal display apparatus |
| 09/23/2004 | US20040183859 Ink-jet head unit |
| 09/23/2004 | US20040183855 Method of laser milling using constant tool path algorithm |
| 09/23/2004 | US20040183733 Surface mount type chip antenna and communication equipment mounted therewith |
| 09/23/2004 | US20040183645 Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module |
| 09/23/2004 | US20040183524 Method and apparatus for implementing printed circuit board high potential testing to identify latent defects |
| 09/23/2004 | US20040183213 Semiconductor packaging substrate and method of producing the same |
| 09/23/2004 | US20040183212 Electronic package with strengthened conductive pad |
| 09/23/2004 | US20040183211 Chip carrier with optimized circuitization pattern |
| 09/23/2004 | US20040183205 Wiring substrate, semiconductor device, semiconductor module, electronic equipment, method for designing wiring substrate, method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
| 09/23/2004 | US20040183193 Packaging method, packaging structure and package substrate for electronic parts |
| 09/23/2004 | US20040183186 Low-profile electronic circuit module and method for manufacturing the same |
| 09/23/2004 | US20040183183 Integrated circuit stacking system and method |
| 09/23/2004 | US20040183170 Semiconductor device and method for manufacturing the same, circuit substrate and electronic apparatus |
| 09/23/2004 | US20040183165 Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin |
| 09/23/2004 | US20040183147 Electronic device |
| 09/23/2004 | US20040183094 Structure to accommodate increase in volume expansion during solder reflow |
| 09/23/2004 | US20040182913 Solder bonding technique for assembling a tilted chip or substrate |
| 09/23/2004 | US20040182910 Solder ball attachment system |
| 09/23/2004 | US20040182837 Stripping insulation from flat cables |
| 09/23/2004 | US20040182831 Method of laser milling using constant tool path algorithm |
| 09/23/2004 | US20040182820 For forming a fine structure on a substrate using a mold comprising a heating and a pressure-applying mechanism |
| 09/23/2004 | US20040182819 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| 09/23/2004 | US20040182713 Article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental meta; additional conductive material may then be deposited onto the elemental metal to produce a microstructure |
| 09/23/2004 | US20040182604 Pinned electronic package with strengthened conductive pad |
| 09/23/2004 | US20040182603 [inner layer structure of a circuit board] |
| 09/23/2004 | US20040182601 Substrate for circuit wiring |
| 09/23/2004 | US20040182600 Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereof |
| 09/23/2004 | US20040182509 Multilayered stack; reduces processing time and processing costs in the fabrication of multilayer laminates |
| 09/23/2004 | US20040182265 Wiring substrate |
| 09/23/2004 | US20040181940 Conductor board and method for producing a conductor board |
| 09/23/2004 | US20040181923 Process for reusing and recycling circuit boards |
| 09/23/2004 | DE19715926B4 Herstellungsverfahren für einen externen Anschluß für ein Kugelgitterarray-(BGA)Halbleiterbauteil Manufacturing method for an external connection for a Kugelgitterarray- (BGA) semiconductor device |
| 09/23/2004 | DE10311575A1 Electrolytic metallizing of a workpiece with bores of high aspect ratio useful for the electrodeposition of copper, e.g. onto conductive plates |
| 09/23/2004 | DE10311510A1 Electrically nonconductive substrate and an electrically conductive coating useful in electronic and electrical technology |
| 09/23/2004 | DE102004010883A1 Schaltungsplatine Circuit board |
| 09/23/2004 | DE102004010013A1 Verfahren zum Kontaktieren eines Chipmoduls A method for contacting a chip module |
| 09/23/2004 | DE102004001763A1 Magnetooptischer Kopf und magnetooptische Speicheranordnung Magneto Optical head and magneto-optical storage device |
| 09/23/2004 | DE10117759B4 Halte- und Kontaktiervorrichtung für eine Knopfzelle Holding and contact for a button cell |
| 09/22/2004 | EP1460890A1 Method of soldering the constituent layers of a multilayer printed circuit and the machine used for same |
| 09/22/2004 | EP1460889A2 Plastic package with high heat dissipation and method for manufacturing the same |
| 09/22/2004 | EP1460888A1 Low-profile electronic circuit module and method for manufacturing the same |
| 09/22/2004 | EP1460887A2 Connector interface pad for structurally integrated wiring |
| 09/22/2004 | EP1460715A1 Surface mount type chip antenna and communication equipment using the same |
| 09/22/2004 | EP1460690A1 Optimization of routing layers and board space requirements in a BGA package (fka BGA package) |
| 09/22/2004 | EP1460688A2 Resin sealed electronic assembly and method of manufacturing the same |
| 09/22/2004 | EP1460658A1 Process for producing laminated ceramic capacitor |
| 09/22/2004 | EP1460644A1 Electroconductive composition, electroconductive coating and method for forming electroconductive coating |
| 09/22/2004 | EP1459611A1 Housing system for an electric device |
| 09/22/2004 | EP1459610A1 An electronic assembly and a method for manufacturing the same |
| 09/22/2004 | EP1459609A1 System to form a layering of electronically-interactive material |
| 09/22/2004 | EP1459408A1 Grouped element transmission channel link termination assemblies |
| 09/22/2004 | EP1459355A2 Stacking multiple devices using direct soldering |
| 09/22/2004 | EP1458794A1 Heat-curable resin composition |
| 09/22/2004 | EP1458784A1 3,4-alkylenedioxythiophene compounds and polymers thereof |
| 09/22/2004 | EP1458657A1 Methods of roughening a ceramic surface |
| 09/22/2004 | EP1390219B1 Electric heating system for a motor vehicle |
| 09/22/2004 | EP1218688A4 Method and apparatus for three dimensional inspection of electronic components |
| 09/22/2004 | EP1169891B1 Flexible microsystem and building techniques |
| 09/22/2004 | EP1153532B1 Flexible printed circuit board arrangement |
| 09/22/2004 | EP1103021B1 Circuit support with control elements communicating via bus lines |
| 09/22/2004 | EP1095545B1 A thermal management device and method of making such a device |
| 09/22/2004 | EP0976010B1 Waterborne photoresists made from urethane acrylates |
| 09/22/2004 | CN1531841A High frequency printed circuit board via VIA |
| 09/22/2004 | CN1531472A Solder alloy and soldered joint |
| 09/22/2004 | CN1531471A Method and device for laser beam machining of laminated material |
| 09/22/2004 | CN1531389A Image forming method and device, manufacture of device, conductive film layout, photoelectric device and electronic machine |
| 09/22/2004 | CN1531388A Method for coating conductive belts onto moulded plastic articles and obtained articles thereby |
| 09/22/2004 | CN1531386A Heat resistant insulative membrane and insulative method |
| 09/22/2004 | CN1531070A Electronic component device and producing method thereof |
| 09/22/2004 | CN1531041A Method for packing semiconductor device on printing circuit board and the printing circuit board |
| 09/22/2004 | CN1531013A Sticking device and method for reinforcing plate |
| 09/22/2004 | CN1530470A Tin-plating method |
| 09/22/2004 | CN1530469A High efficient copper foil and producing method thereof |
| 09/22/2004 | CN1168361C Multilayer printed wiring board having filled-via structure |
| 09/22/2004 | CN1168360C Multilayered printed wiring board |
| 09/22/2004 | CN1168150C Method for installing transmission or receiving module of optical chain and rigid bendable board |
| 09/22/2004 | CN1168106C Multilayered electronic part with minimum silver diffusion and its manufacturing method |