| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/19/2005 | EP1497865A2 Electrical contacts for flexible displays |
| 01/19/2005 | EP1497851A2 Program-controlled dicing of a substrate using a pulsed laser |
| 01/19/2005 | EP1497810A1 Electrotechnical kit |
| 01/19/2005 | EP1497758A1 Global equivalent circuit modeling system for substrate mounted circuit components incoporating substrate dependent characteristics |
| 01/19/2005 | EP1497696A2 Photocurable compositions containing reactive particles |
| 01/19/2005 | EP1497692A2 Process for forming a patterned thin film conductive structure on a substrate |
| 01/19/2005 | EP1118076A4 Large value buried inductors in low temperature co-fired ceramic circuit boards |
| 01/19/2005 | CN2673036Y Pressing tool for printed circuit board |
| 01/19/2005 | CN1568438A Device for holding an optical fiber |
| 01/19/2005 | CN1568380A Nickel-based surface treatment films excellent in heat-resistant adhesion to resin |
| 01/19/2005 | CN1568140A Stripping striking flake for suppressing feeding material tilting piece |
| 01/19/2005 | CN1568136A Layer increasing method for multilayer printed circuit board and structure thereof |
| 01/19/2005 | CN1568135A Manufacturing method for multilayer printed circuit board and inter-layer ducting structure formed thereby |
| 01/19/2005 | CN1568134A Method for coating anti-welding film in space between welding pads of printed circuit board |
| 01/19/2005 | CN1568133A Line forming method for printed circuit board |
| 01/19/2005 | CN1568132A Apparatus and method for optical detecting of printed circuit board |
| 01/19/2005 | CN1568131A Method for compensating characteristic impedance of meter adhibitted bonding pad and printed circuit board employing same method |
| 01/19/2005 | CN1568129A Circuit substrate and manufacturing method thereof |
| 01/19/2005 | CN1567551A Method for forming solid conductive via hole of integrated circuit packaging base plate |
| 01/19/2005 | CN1567485A Polymer thick film resistor pasty state compound |
| 01/19/2005 | CN1185918C Manufacturing method of planar printed circuit board with polymer thick-film resistor |
| 01/19/2005 | CN1185917C Serial circuit board and its manufacture method |
| 01/19/2005 | CN1185916C Printed circuit board fixing pin assembly and assembling method thereof |
| 01/19/2005 | CN1185915C Flexible substrate, semiconductor device, camera device and X-ray camera system |
| 01/19/2005 | CN1185914C Circuit board |
| 01/19/2005 | CN1185913C Wiring circuit board with projecture and its producing method |
| 01/19/2005 | CN1185912C Differential circuit structure of PCB and its preparing process |
| 01/19/2005 | CN1185776C Device and method for mounting vibrator |
| 01/19/2005 | CN1185715C An integrated circuit and manufacturing method thereof |
| 01/19/2005 | CN1185698C Semiconductor device and manufacture method thereof, circuit board and electronic apparatus |
| 01/19/2005 | CN1185697C Method for installing semiconductor chip |
| 01/19/2005 | CN1185692C Electric linking parts and its manufacturing method |
| 01/19/2005 | CN1185286C Method of treating epoxy resin-cured product |
| 01/19/2005 | CN1185098C Screen printing method and apparatus thereof |
| 01/18/2005 | US6845492 Signal via impedance adjustment tool |
| 01/18/2005 | US6844659 Wiring board and method of manufacturing same |
| 01/18/2005 | US6844505 Reducing noise effects in circuit boards |
| 01/18/2005 | US6844504 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 01/18/2005 | US6844220 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component |
| 01/18/2005 | US6844219 Semiconductor device and lead frame therefor |
| 01/18/2005 | US6844216 Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
| 01/18/2005 | US6844130 Prepolymer having a carboxyl group in combination with at least two unsaturated bonds in its molecule, a polymerization initiator, a diluent, a di- or polyoxetane compound, and a curing promoter |
| 01/18/2005 | US6844023 Alumina insulation for coating implantable components and other microminiature devices |
| 01/18/2005 | US6843675 Standing board fixing structure |
| 01/18/2005 | US6843666 Method and apparatus for installing a surface mount connector on a printed circuit board |
| 01/18/2005 | US6843662 Electric connector housing supporting a plurality of solder balls and including a plurality of protruding blocks respectively supporting the plurality of solder balls |
| 01/18/2005 | US6843661 Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same |
| 01/18/2005 | US6843608 Transparent substrate and hinged optical assembly |
| 01/18/2005 | US6843407 Solder bump fabrication method and apparatus |
| 01/18/2005 | US6842976 Method of connecting flat cable and terminal |
| 01/13/2005 | WO2005004572A1 Shielding for emi-endangered electronic components and/or circuits of electronic devices |
| 01/13/2005 | WO2005004570A1 Method for manufacturing a midplane |
| 01/13/2005 | WO2005004568A1 Wiring board member for forming multilayer printed circuit board, method for producing same, and multilayer printed circuit board |
| 01/13/2005 | WO2005004567A1 Process for producing substrate incorporating component |
| 01/13/2005 | WO2005004566A1 Testing of interconnections between stacked circuit boards |
| 01/13/2005 | WO2005004565A1 Packaging electrode, package, device and process for producing device |
| 01/13/2005 | WO2005004564A1 REFLOW SOLDERING METHOD USING Pb-FREE SOLDER ALLOY AND HYBRID PACKAGING METHOD AND STRUCTURE |
| 01/13/2005 | WO2005004563A1 Module and method for fabricating the same |
| 01/13/2005 | WO2005004562A1 Integrated electromechanical arrangement and method of production |
| 01/13/2005 | WO2005004561A1 Self-adjusting device, self-adjusting system and method for arranging a self-adjusting device on a sheet material |
| 01/13/2005 | WO2005004560A1 Soft magnetic material for manufacturing printed circuit boards |
| 01/13/2005 | WO2005004558A2 Method for the manufacture of printed circuit boards with embedded resistors |
| 01/13/2005 | WO2005004297A1 Method for the space-saving installation of electrical wiring |
| 01/13/2005 | WO2005004291A1 Electrical connector solder terminal |
| 01/13/2005 | WO2005004182A2 Method of layering green sheet and method of producing laminated ceramic electronic component |
| 01/13/2005 | WO2005004176A1 High-frequency heating device |
| 01/13/2005 | WO2005004172A1 Coated conductive particle, anisotropic conductive material, and conductive connection structure |
| 01/13/2005 | WO2005004171A1 Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure |
| 01/13/2005 | WO2005004050A1 Conductive sheet for non-contact type ic card having built-in antenna and non-contact type ic card having built-in antenna |
| 01/13/2005 | WO2005002850A1 Mold release film and process for producing flexible printed wiring board therewith |
| 01/13/2005 | WO2005002779A1 Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 01/13/2005 | WO2004105456A9 Transfer assembly for manufacturing electronic devices |
| 01/13/2005 | WO2004093266B1 Method of making an electrical connector |
| 01/13/2005 | US20050010480 Information providing system, information providing method, information providing device, and recording medium |
| 01/13/2005 | US20050010329 Paste dispenser and method for controlling the same |
| 01/13/2005 | US20050009416 Conductor strip formed with slit, cutout or grooves |
| 01/13/2005 | US20050009386 Compliant electrical probe device incorporating anisotropically conductive elastomer and flexible circuits |
| 01/13/2005 | US20050009385 Electrical connector having improved contacts |
| 01/13/2005 | US20050009353 Multi-layer integrated circuit package |
| 01/13/2005 | US20050009327 Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof |
| 01/13/2005 | US20050009307 Laser beam processing method and laser beam processing machine |
| 01/13/2005 | US20050009259 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography |
| 01/13/2005 | US20050009234 Stacked module systems and methods for CSP packages |
| 01/13/2005 | US20050009232 Method, system, and apparatus for transfer of dies using a die plate having die cavities |
| 01/13/2005 | US20050009230 Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, electronic device, and method for manufacturing active matrix substrate |
| 01/13/2005 | US20050008955 Forming film from organometallic compound by combustion; forming resin on surface of substrate; absorption ; washing |
| 01/13/2005 | US20050008868 Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
| 01/13/2005 | US20050008833 Method and structure for small pitch z-axis electrical interconnections |
| 01/13/2005 | US20050008824 Ceramic multilayer substrate manufacturing method and unfired composite multilayer body |
| 01/13/2005 | US20050008360 Chemical processing apparatus, chemical processing method, and method for manufacturing circuit substrate |
| 01/13/2005 | US20050008319 Method for analyzing material density variations on a multi-layer printed circuit board |
| 01/13/2005 | US20050007723 Methods for forming a high performance capacitor |
| 01/13/2005 | US20050007708 Controller and rectifier for an electrical machine, and electrical machine |
| 01/13/2005 | US20050007398 Method for fabricating thin film pattern, method for fabricating device, electro-optical apparatus, and electronic apparatus |
| 01/13/2005 | US20050007281 Surface-mounted antenna apparatus |
| 01/13/2005 | US20050007252 Method, system, and apparatus for authenticating devices during assembly |
| 01/13/2005 | US20050006788 Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board |
| 01/13/2005 | US20050006765 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/13/2005 | US20050006763 Circuit substrate, semiconductor module and method of manufacturing circuit substrate |
| 01/13/2005 | US20050006752 Multi-layer interconnection circuit module and manufacturing method thereof |