| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/03/2005 | US20050024290 Low cost RFID antenna manufactured from conductive loaded resin-based materials |
| 02/03/2005 | US20050023706 Semiconductor device and semiconductor device manufacturing method |
| 02/03/2005 | US20050023704 Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure |
| 02/03/2005 | US20050023703 Variable thickness pads on a substrate surface |
| 02/03/2005 | US20050023685 Nickel bonding cap over copper metalized bondpads |
| 02/03/2005 | US20050023683 Semiconductor package with improved ball land structure |
| 02/03/2005 | US20050023681 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
| 02/03/2005 | US20050023679 Substrate with reinforced contact pad structure |
| 02/03/2005 | US20050023676 Solder pads and method of making a solder pad |
| 02/03/2005 | US20050023668 Stacked memory and manufacturing method thereof |
| 02/03/2005 | US20050023664 High density chip carrier with integrated passive devices |
| 02/03/2005 | US20050023659 Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane |
| 02/03/2005 | US20050023583 Multi media card formed by transfer molding |
| 02/03/2005 | US20050023548 Mount for semiconductor light emitting device |
| 02/03/2005 | US20050023527 Electrode substrate of plasma display panel and method for making the same |
| 02/03/2005 | US20050023367 Method and apparatus for detecting a liquid spray pattern |
| 02/03/2005 | US20050023328 Method of controlling solder deposition utilizing two fluxes and preform |
| 02/03/2005 | US20050023327 Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps |
| 02/03/2005 | US20050023326 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
| 02/03/2005 | US20050023275 Procedure for soldering the constituent layers of a multilayer printed circuit and the machine used for same |
| 02/03/2005 | US20050023259 Methods of bonding solder balls to bond pads on a substrate, and bonding frames |
| 02/03/2005 | US20050023241 Method of fabricating a high-layer-count backplane |
| 02/03/2005 | US20050023147 Including an interconnect pattern having portions of its surface with different properties; since the first and second plating layers are formed on the interconnect pattern, oxidation of the surface of the interconnect pattern can be prevented, and also the electrical contact resistance can be lowered |
| 02/03/2005 | US20050023144 Methods for electrochemically fabricating multi-layer structures including regions incorporating maskless, patterned, multiple layer thickness depositions of selected materials |
| 02/03/2005 | US20050023035 Information handling system utilizing circuitized substrate |
| 02/03/2005 | US20050023034 Printed wiring board and manufacturing method therefor |
| 02/03/2005 | US20050023033 Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate |
| 02/03/2005 | US20050023032 Laminated wiring board and its mounting structure |
| 02/03/2005 | US20050023031 Method for making a flat flex cable |
| 02/03/2005 | US20050023030 Printed circuit board with a heat dissipation element and package comprising the printed circuit board |
| 02/03/2005 | US20050023022 Computer enclosure |
| 02/03/2005 | US20050022733 Screen printing apparatus |
| 02/03/2005 | US20050022379 Method of making a semiconductor device having an opening in a solder mask |
| 02/03/2005 | US20050022378 Apparatus used to package multimedia card by transfer molding |
| 02/03/2005 | US20050022375 Method and apparatus for shock and vibration isolation of a circuit component |
| 02/03/2005 | US20050022374 Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus |
| 02/03/2005 | DE10357174B3 Continuous deposition of adherent coatings on e.g. smooth copper foil comprises passing foil through bath containing copper ions and applying double pulses consisting of short, steep pulse followed by longer, flatter pulse |
| 02/03/2005 | DE10336634B3 Electronic device e.g. for motor vehicle controllers, has inner layer forming flexible connections between circuit boards of 2 assemblies and lead-through capacitors in common with other conducting tracks of first assembly |
| 02/03/2005 | DE10332695A1 Anordnung zur Befestigung eines Bauelements Assembly for mounting a device |
| 02/03/2005 | DE10331008A1 Reflowlötbarer Bauelementeträger Reflowlötbarer component support |
| 02/03/2005 | DE10330789A1 Gehäuse für elektrische oder elektronische Vorrichtungen Housings for electrical or electronic devices |
| 02/03/2005 | DE10313866B4 Schnappkonstruktion Snap construction |
| 02/03/2005 | DE102004034396A1 Electrical connector for wiring looms has printed circuit on flexible element that is fitted with stiffening connectors |
| 02/03/2005 | DE102004028722A1 Rückseitensondierverfahren und -anordnung Rückseitensondierverfahren and arrangement |
| 02/03/2005 | DE102004023674A1 Process for coating unfired ceramic foils used in the manufacture of strip conductors comprises cutting ceramic foils to a required length, forming recesses a surface side, and further processing |
| 02/03/2005 | DE102004015925A1 An einer Oberfläche angebrachte Antennenvorrichtung Attached to a surface antenna device |
| 02/03/2005 | DE10125417B4 Verfahren zum Beschichten eines Trägers und Drahtgeflecht A method for coating a substrate and wire mesh |
| 02/02/2005 | EP1503615A2 Circuit board having a cooled component, particularly a SMD-component |
| 02/02/2005 | EP1503452A1 Electrical connector for connecting electrical units, electrical device, and production metod for producing electrical device |
| 02/02/2005 | EP1503433A2 Mount for semiconductor light emitting device |
| 02/02/2005 | EP1503417A1 Stacked memory and manufacturing method thereof |
| 02/02/2005 | EP1503414A2 Ball grid array package |
| 02/02/2005 | EP1503216A1 Sheet-form connector and production method and application therefor |
| 02/02/2005 | EP1502745A1 Inkjet printer |
| 02/02/2005 | EP1502293A2 Method for the production of structured layers on substrates |
| 02/02/2005 | EP1501756A2 Method of manufacturing an electronic device in a cavity with a cover |
| 02/02/2005 | EP1436142A4 Metal-containing web processed with a continuous etch process |
| 02/02/2005 | EP1214741B1 Control device, particularly for use in automotive engineering |
| 02/02/2005 | EP1029431B1 Via pad geometry supporting uniform transmission line structures |
| 02/02/2005 | CN2676570Y Fixing structure for piezoelectric ceramic transformer |
| 02/02/2005 | CN1575627A Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method |
| 02/02/2005 | CN1575511A Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces |
| 02/02/2005 | CN1575500A Multilayer circuit and method of manufacturing |
| 02/02/2005 | CN1575210A 超声波印刷电路板换能器 Ultrasonic transducers printed circuit board |
| 02/02/2005 | CN1575127A Circuit board working unit support apparatus |
| 02/02/2005 | CN1575125A Parts installation device |
| 02/02/2005 | CN1575124A Substrate holder |
| 02/02/2005 | CN1575121A Electronic component interposing method |
| 02/02/2005 | CN1575118A Method for manufacturing an emi shielding element |
| 02/02/2005 | CN1575112A Printed circuit board and method for making same |
| 02/02/2005 | CN1575111A Printed wiring board for mounting semiconductor |
| 02/02/2005 | CN1575110A Structure of terminal member |
| 02/02/2005 | CN1575109A Method of forming solder resist pattern |
| 02/02/2005 | CN1575108A Method of making mounting plates |
| 02/02/2005 | CN1575107A Electrical contacting method |
| 02/02/2005 | CN1575106A Printed circuit boards and the methods of their production |
| 02/02/2005 | CN1575105A Thin film pattern forming method, device and method of manufacture, electrooptical device |
| 02/02/2005 | CN1575104A Method for fabricating thin film pattern, method for fabricating device, electro-optical apparatus, and electronic apparatus |
| 02/02/2005 | CN1575103A Filling equipment and method for filling fluidized material |
| 02/02/2005 | CN1575102A Forming process of thin film pattern and manufacturing process of device, electro-optical apparatus and electronic apparatus |
| 02/02/2005 | CN1575100A Method for drilling process |
| 02/02/2005 | CN1575099A Method for forming sheet metal |
| 02/02/2005 | CN1575098A Wiring substrate, process for manufacturing the wiring substrate, and carrier sheet for green sheet used in the manufacturing process |
| 02/02/2005 | CN1575097A Printed board machining apparatus |
| 02/02/2005 | CN1575096A Electronic circuit device and its manufacturing method |
| 02/02/2005 | CN1575095A Circuit board having resistor and method for manufacturing the circuit board |
| 02/02/2005 | CN1575094A Multilayer circuit board and method for manufacturing the same |
| 02/02/2005 | CN1575093A Electronic substrate, electronic circuit and method and device for manufacture of the same |
| 02/02/2005 | CN1575091A Wired circuit board |
| 02/02/2005 | CN1575090A 混合集成电路装置 Hybrid integrated circuit device |
| 02/02/2005 | CN1574475A Standoff/mask structure for electrical interconnect |
| 02/02/2005 | CN1574472A Circuit-connecting structure including a terminal piece |
| 02/02/2005 | CN1574471A Electrical connector housing |
| 02/02/2005 | CN1574451A Methods for making microwave circuits |
| 02/02/2005 | CN1574411A Methods for depositing a thickfilm dielectric on a substrate |
| 02/02/2005 | CN1574391A Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET |
| 02/02/2005 | CN1574313A Resin encapsulated electronic component unit and method of manufacturing the same |
| 02/02/2005 | CN1574311A Terminal structure of multi-layer substrate and method for forming the same |
| 02/02/2005 | CN1574310A Intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate |
| 02/02/2005 | CN1574307A 半导体器件 Semiconductor devices |