| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/16/2004 | US20040253473 Metal foil composite structure for producing clad laminate |
| 12/16/2004 | US20040253450 Formaldehyde-free electroless copper plating process and solution for use in the process |
| 12/16/2004 | US20040253425 Wiring board, electro-optical device, method of manufacturing the electro-optical device, and electronic instrument |
| 12/16/2004 | US20040252501 Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
| 12/16/2004 | US20040252491 Printed circuit board lamp |
| 12/16/2004 | US20040252477 Contact grid array formed on a printed circuit board |
| 12/16/2004 | US20040252475 Module part |
| 12/16/2004 | US20040252010 Circuit board having resistor and method for manufacturing the circuit board |
| 12/16/2004 | US20040252009 Chip resistor and method of making the same |
| 12/16/2004 | US20040251891 Suction cap for IC sockets and IC socket assembly using same |
| 12/16/2004 | US20040251889 Method and device for testing the operativeness of printed circuit boards |
| 12/16/2004 | US20040251559 Hybrid integrated circuit package substrate |
| 12/16/2004 | US20040251541 Method, system, and apparatus for high volume assembly of compact discs and volume assembly of compact discs and digital video discs incorporating radio frequency identification tag technology |
| 12/16/2004 | US20040251537 Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate |
| 12/16/2004 | US20040251533 Hybrid integrated circuit device |
| 12/16/2004 | US20040251527 Intermediate support for electronic components and method for solder contacting such an intermediate support |
| 12/16/2004 | US20040251523 Stackable integrated circuit package and method therefor |
| 12/16/2004 | US20040251243 System and method for generating and controlling multiple independently steerable laser beams for material processing |
| 12/16/2004 | US20040251231 Circuit board and manufacturing method of the same |
| 12/16/2004 | US20040251230 Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom |
| 12/16/2004 | US20040251047 Via structure for increased wiring on printed wiring boards |
| 12/16/2004 | US20040251046 Blind hole termination of pin to pcb |
| 12/16/2004 | US20040250949 Method and apparatus for expanding a semiconductor wafer |
| 12/16/2004 | US20040250919 Flux composition for solder, solder paste, and method of soldering |
| 12/16/2004 | US20040250417 Method, system, and apparatus for transfer of dies using a die plate |
| 12/16/2004 | US20040250393 High temperature and high voltage power electronics capacitor |
| 12/16/2004 | DE10324489A1 Production of conducting marking material for circuit boards comprises applying layer of fine metal powder, especially copper powder and carbon particles, onto surface of substrate, and further coating with copper |
| 12/16/2004 | DE10322898A1 Flammfeste und Hitze-aktivierbare Haftklebemassen The fire-resistant and heat-activatable PSAs |
| 12/16/2004 | DE10322840A1 Elektronische Baugruppe Electronic assembly |
| 12/16/2004 | DE10311021A1 Smart data card has a processor chip module set into a recess in the plastic card and secured by using laser energy |
| 12/16/2004 | DE102004025714A1 Method for filling liquefied materials into blind hole on surface of sheet-type part includes several steps, i.e. decompression of two adjacent enclosed spaces, each in zone in preset section of sheet-type part |
| 12/16/2004 | DE102004024616A1 Wärmeableitkonstruktion Heat dissipation |
| 12/16/2004 | DE102004021654A1 Arrangement of two spaced circuit boards with interconnected conductive tracks, with contact faces on surface of first circuit board, facing second circuit board, which are engaged by contact ends of contact bridges |
| 12/16/2004 | CA2527241A1 Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| 12/15/2004 | EP1487247A1 Electrical connector housing |
| 12/15/2004 | EP1487246A1 Resin encapsulated electronic component unit and method of manufacturing the same |
| 12/15/2004 | EP1487245A1 Circuit board and process for producing the same |
| 12/15/2004 | EP1487060A2 Technique for interconnecting multilayer circuit boards |
| 12/15/2004 | EP1487056A1 Flexible good conductive layer and anisotropic conductive sheet comprising same |
| 12/15/2004 | EP1487054A1 Circuit-connecting structure including a terminal piece |
| 12/15/2004 | EP1487018A2 Flexible substrate for a semiconductor package and method of manufacturing the same |
| 12/15/2004 | EP1486912A1 Conductive paste and method of forming antenna for transponder |
| 12/15/2004 | EP1486521A1 Curable resins and curable resin compositions containing the same |
| 12/15/2004 | EP1486288A1 Printed board machining apparatus |
| 12/15/2004 | EP1486105A1 Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board |
| 12/15/2004 | EP1486104A2 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 12/15/2004 | EP1485877A1 A method for storing layers' information of a layers-made object |
| 12/15/2004 | EP1485756A2 Method of forming a pattern of sub-micron broad features |
| 12/15/2004 | EP1415166B1 Apparatus and method for testing bare circuit boards |
| 12/15/2004 | EP1092338B1 Assembly of an electronic component with spring packaging |
| 12/15/2004 | CN2664342Y Circuit board making machine |
| 12/15/2004 | CN2663072Y Manual aid welding bench for surface mounted electronic elements |
| 12/15/2004 | CN1555667A Surface mounting package |
| 12/15/2004 | CN1555666A Laser drilling,particular laser drilling method with a perforated mask |
| 12/15/2004 | CN1555577A Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured |
| 12/15/2004 | CN1555576A Thin electronic label and method for making same |
| 12/15/2004 | CN1555572A Inter-carrier for electronic components and method to solder-contact of such an inter-carrier |
| 12/15/2004 | CN1555563A Conductive materials with electrical stability for use in electronics devices |
| 12/15/2004 | CN1555562A Process relating to polymers |
| 12/15/2004 | CN1555428A Method and electrode for defining and replicating structures in conducting materials |
| 12/15/2004 | CN1555309A Security tag and process for making same |
| 12/15/2004 | CN1555303A System and method for unveiling targets embedded in a multi-layered electrical circuit |
| 12/15/2004 | CN1555216A Method for connecting conductor and solder and electronic element in said connecting method |
| 12/15/2004 | CN1554971A Anisotropic conductive rubber film sticking device and method |
| 12/15/2004 | CN1554507A Overlapping method for joint foot and welding flux and electronic element using such method |
| 12/15/2004 | CN1180669C Wiring-connecting material and process for producing circuit board with the same |
| 12/15/2004 | CN1180668C Circuit anti-interference device |
| 12/15/2004 | CN1180667C Radio-electronic element |
| 12/15/2004 | CN1180666C Printing circuit board and method for producing printing circuit board |
| 12/15/2004 | CN1180665C Printed distributing board |
| 12/15/2004 | CN1180477C Semiconductor device adn semiconductor assembly |
| 12/15/2004 | CN1180472C Surface mounting assembly including terminal at side |
| 12/15/2004 | CN1180463C Anisotropic electrically conductive binding material and connecting method |
| 12/15/2004 | CN1180461C Composite high-density structured substrate and its forming method |
| 12/15/2004 | CN1180365C Method of producing smart card |
| 12/15/2004 | CN1180314C Photoimageable compositions having improved stripping properties in aqueous alkaline solutions and its dry film anti-corrosion agent |
| 12/15/2004 | CN1180133C Electrodeposition of metals in smal recesses using modulated electric fields |
| 12/15/2004 | CN1180046C Adhesion material and circuit connection method |
| 12/15/2004 | CN1179845C Composite laminated plate and its mfg process |
| 12/15/2004 | CN1179818C Laser processor |
| 12/15/2004 | CN1179799C Surface treatment device |
| 12/14/2004 | US6832049 Optical Module |
| 12/14/2004 | US6832045 Exposure device |
| 12/14/2004 | US6831841 Flexible substrate, electro-optical device and electronic device |
| 12/14/2004 | US6831838 Circuit board assembly for welding power supply |
| 12/14/2004 | US6831730 Optical magnification adjustment system and projection exposure device |
| 12/14/2004 | US6831528 High-frequency switching module and high-frequency apparatus equipped with the same |
| 12/14/2004 | US6831371 Integrated circuit substrate having embedded wire conductors and method therefor |
| 12/14/2004 | US6831360 Semiconductor device having an elastic resin with a low modulus of elasticity |
| 12/14/2004 | US6831357 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same |
| 12/14/2004 | US6831306 Extended length light emitting diode |
| 12/14/2004 | US6831236 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 12/14/2004 | US6831235 Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof |
| 12/14/2004 | US6831234 Multilayer printed circuit board |
| 12/14/2004 | US6831233 Chip package with degassing holes |
| 12/14/2004 | US6831129 Printed circuits; fireproofing, waterproofing, bonding strength |
| 12/14/2004 | US6831116 Polymeric modifying agents |
| 12/14/2004 | US6831009 Wiring substrate and an electroless copper plating solution for providing interlayer connections |
| 12/14/2004 | US6830875 Preventing cylindrical volume curing; rapid, inexpensive; quality photolithograhic method |
| 12/14/2004 | US6830806 Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured |